• Title/Summary/Keyword: 레이저 습식 후면 식각공정

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Fabrication of Glass Microstructure Using Laser-Induced Backside Wet Etching (레이저 습식 후면 식각공정을 이용한 미세 유리 구조물 제작)

  • Kim, Bo Sung;Park, Min Soo
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.9
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    • pp.967-972
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    • 2014
  • The good light permeability and hardness of glass allow it to be used in various fields. Non-conventional machining methods have been used for glass machining because of its brittle properties. As one non-contact machining method, a laser has advantages that include a high machining speed and the fact that no tool making is required. However, glass has light permeability. Thus, the use of a laser to machine glass has limitations. A nanosecond pulse laser can be used at low power for laser-induced backside wet etching, which is an indirect method. In previous studies, a short-wave laser that had good light absorption but a high price was used. In this study, a near-infrared laser was used to test the possibility of glass micro-machining. In particular, when deeper machining was conducted on a glass structure, more problems could result. To solve these problems, microstructure manufacturing was conducted using ultrasonic vibration.