• Journal of the Korean Society for Nondestructive Testing
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• v.25 no.2
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• pp.81-86
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• 2005

This paper proposes a non-destructive ESPI technique to quantitatively evaluate defects inside a semiconductor package. The inspection system consists of the ESPI system, a thermal loading system and an adiabatic chamber. The technique is high feasibility for non-destructive testing of a semiconductor and overcomes the weaknesses of previous techniques, such as time-consumption and difficult quantitative evaluation. Most defects are classified as delamination defects, resulting from the insufficient adhesive strength between layers and from non-homogeneous heat spread. Ninety percent of the tested samples had delamination defects which originated at the corner of the chip and nay be related to heat spread design.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.556-560
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• 2005

The measurement method by Laser Speckle Interferometry which uses the interference law which will grow precedes and with it explains a resolution measurement ability and together the change of place arrowhead and general measurement, at real-time measurement sensitivity it has application boat song from candle precise measurement field it is increasing. But, currently the domestic application technique to sleeps and optical science military merit by optical science interferometer and directness it composes purchases to the level which it applies the expensive commercial business equipment the outside and in spite of the technical ripple effect is deficient even in many strong point. The hazard which complements like this problem point form technical development it leads from the research which it sees and an application degree and to sleep as the measurement equipment which tries to develop the small-sized optical science interference sensor and an interpretation program it raises it does.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.307-308
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.295-298
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• 1997

Recycl ing of PP/EPR based bumper coated with polyester urethane paint has been per formed by chemical decoating method. Electronic Speckle Pattern Interferometry (ESP11 has been applied to characterize the deformation of polyolef in based bumper. In additon, physical properties and processability of recycled materials have been investigated by dynamic mechanical thermal analysis, impact test and melt flower index measurement. The results show that the deformation ratio of recycled material is higher than that of virgin one. The morphological change of EPR, degree of distribution and dispersion during the recycling process seem to be the most important factor for the deformation and the mechanical properties of recycled materials. The experimental results obtained show that ESPI is very powerful technique to study the thermal mechanical property of polyolefin bumper system.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.11
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• pp.121-129
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• 1998

In-plane ESPI(Electronic Speckle Pattern Interferometry) was devised to measure in-plane deformations and rotation of a specimen with laser in this study. ESPI is a optical measuring method to be able to measure the deformations of engineering components and materials in industrial fields. The conventional measuring methods of surface deformations such as the strain gauge have many demerits because they are contact and point-to-point measuring ones. But that ESPI is noncontact, nondestructive and whole field measuring method can overcome previous disadvantages. We used ESPI which is sensitive to in-plane displacement for measuring in-plane deformations of a disk. And the 4-frame phase shifting method was used for the quantitative analysis. First of all, the system calibration was done due to an in-plane rotation before getting deformations of a disk. Finally we showed good agreement between the experiment results and those of the FEA(Finite Element Analysis).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.29-33
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• 2004

This paper presents ESPI system for the measurement of thermal expansion coefficient of STS430 up to 1,000$^{\circ}C$. Existing methods, strain gauge and moire have the limitation of contact to object and do not supply the coefficient up to 800$^{\circ}C$. There needs to measure the data up to 800$^{\circ}C$, because heat resistant materials have high melting temperature up to 1,000$^{\circ}C$. In previous studies related to thermal strain analysis, the quantitative results are not reported by ESPI at high temperature, yet. In-plane ESPI and vacuum chamber for the reduction of air turbulence and oxidation are designed for the measurement of the coefficient up to 1,000$^{\circ}C$and speckle correlation fringe pattern images are processed by commercial image filtering tool-smoothing, thinning and enhancement- to obtain quantitative results, which is compared with references data. The comparison shows two data are agreed within 4.1％ blow 600$^{\circ}C$ however, there is some difference up to 600$^{\circ}C$. Also, the incremental ratio of the coefficient is changed up to 800$^{\circ}C$. The reason is the phase transformation of STS430 probably begins at 800$^{\circ}C$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.1
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• pp.102-108
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• 2003

Recently, the authors have developed a new material test system fur thin film at the high temperature. It is so compact and precise with sub micron resolution that it seems to be a useful tool fur research of the oxide film growth, its mechanical behavior and failure mechanism. To this end. in this paper three methologies are described for in-situ monitoring of the displacement & strain and the temperature, the oxide thickness. These are the Laser Speckle analysis with digital image correlation technique, the two-color infra-red thermometer and the laser reflection interferometry respectively. The calibration results and some issues which should be addressed for practical application are presented.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.3
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• pp.101-108
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• 2008

Residual stress is one of the causes which make defects in engineering components and materials. Many methods have been developing to measure the residual stress. Though these methods provide the information of the residual stress, they also have disadvantage like a little damage, time consumption, etc. In this paper, we devised a new experimental technique to measure residual stress in materials with a combination of laser speckle pattern interferometry and spot heating. The speckle pattern interferometer measures in-plane deformation during the heat provides for much localized stress relief. 3-D shape is used for determining heat temperature and other parameters. The residual stresses are determined by the amount of strain that is measured subsequent to the heat and cool-down of the region being interrogated. A simple model is presented to provide a description of the method. In this paper, we could experimentally confirm that residual stress can be measured by using laser interferometry and spot heating method.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.3
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• pp.93-100
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• 2008

Laser interferometry is widely used as a measuring system in many fields because of its high resolution and ability to measure a broad area in real-time all at once. In conventional LASER interferometry, for example Out-of-plane ESPI(Electronic Speckle Pattern Interferometry), In plane ESPI, Shearography and Holography, it uses PZT or other components as a phase shift instrumentation to extract 3D deformation data, vibration mode and others. However, in most cases PZT has some disadvantages, which include nonlinear errors and limited time of use. In the present study, a new type of LASER interferometry using a laser diode is proposed. Using LASER Diode Sinusoidal Phase Modulating (LD-SPM) interferometry, the phase modulation can be directly modulated by controlling the LASER Diode injection current thereby eliminating the need for PZT and its components. This makes the interferometry more compact. This paper reports on a new approach to the LD Modulating interferometry that involves four-buckets phase shift method. This study proposes a four-bucket phase mapping algorithm, which was developed to have a guaranteed application, to stabilize the system in the field and to be a user-friendly GUI. In this paper, the theory for LD wavelength modulation and sinusoidal phase modulation of LD modulating interferometry is shown. Four-bucket phase mapping algorithm is then introduced.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.10a
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• pp.85-89
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• 2002

This paper used the Laser Speckle Interferometry to present the strain analysis of Nd:YAG Laser welding zone. Previous TIG welding to sheet plate, which welds only high-skilled engineer, produces residual stress nearby welding zone due to thermal effect. However, Laser welding makes sheet pate welding easy and thermal effect minimum. Thermal effect zone is measured by strain analysis of the laser-welding zone by ESPI under tensile testing of sheet plate welded by Nd:YAG laser. The ESPI results, which compared with strain gage method, are agreed within error 3 %.