• 제목/요약/키워드: 뜯김 억제

검색결과 2건 처리시간 0.016초

미세홈 가공시 전해 인프로세스 드레싱의 영향에 관한 연구 (A Study on the Effect of Electrolytic In-process Dressing in Slot Grinding)

  • 유정봉;이석우;정해도;최헌종
    • 한국정밀공학회지
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    • 제16권1호통권94호
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    • pp.18-25
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    • 1999
  • Chipping is an unavoidable phenomenon in the slot grinding process of hard and brittle materials. However, it should be reduced for the improvement of surface integrity in the manufacture of optical and semiconductor components. Electrolytic In-process Dressing (ELID) technique for metal bonded superabrasive grinding wheel has been developed for mirror surface grinding of hard and brittle materials. Electrically dressed wheel surface has sharply exposed abrasives and results in lower grinding force, higher grinding efficiency in grinding. The paper deals with a newly developed method for slot grinding using ELID and was implemented to improve grooved surface quality and decreases chipping size on the edge of the groove. As a result, we accomplished chipping-free grooves and obtained the clear ground surfaces on glass and WC.

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Slot Grinding시 전해 인프로세스 드레싱의 영향에 관한 연구 (Effect of Electrolytic In-process Dressing in Slot Grinding)

  • 유정봉;정해도;최헌종
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1995년도 추계학술대회 논문집
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    • pp.48-52
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    • 1995
  • Chipping is an unavidable phenomean in the slot grinding process of hard and brittle materials. However,it should be reduced for the improvement of surface integrity in the manufacture of optical and semiconductor components. Electrolytic In-process Dressing (ELID) technique for metal bonded superabrasive grinding wheel has been developed for mirror surface grinding of hard and brittle materials. Electrically dressed wheel surface has sharply exposed abrasives and results in lower grinding force, higher grinding efficiency in grinding. The paper deals with a newly developed method for slot grinding using ELID and was implemented to improve grooved surface quality and decreases chipping size on the edge of the groove. As a result, we accomplished shipping-free grooves and obtained the clear ground sufaces on glass and tungsten carbide.

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