• Journal of the Korean Society for Precision Engineering
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• v.20 no.8
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• pp.76-85
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• 2003

In this paper, a technical method for removing the solder from PCBs has been proposed to simplify the pulverizing process and to get higher quality of materials for recycling of the electronic parts in the Printed Circuit Boards (PCBs). There are several techniques to remove the solder from PCB, such as physical and chemical method, vibration, suction and blowing and so on. Among them, the suction technique turned out the best method by investigation. In the suction method, there are three variables for removing the solder. They are a temperature of the thermal wire, a velocity of moving PCB and a gap between PCB and thermal wire. To find the optimal variables for the system, an experiment has been conducted by a trial and error method. The optimal variables were found $220^{\circ}C$ of temperature, 11.58mm/s of velocity, 10mm of gap (A gap between suction hole and bottom of PCBs is 5mm). The result of the experiment shows that 50% of the solder were removed.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.1
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• pp.322-328
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• 2012

This paper deals with a digital Desoldering system for removing lead-free solder. We proposed a Desoldering system that is to cope with the changed work environment of the solder materials changing from lead solder to lead-free solder, we can be quickly stable to the set temperature, and continuous operation is possible. Proposed system consists of a Desoldering station and a Desoldering gun. For the PID temperature control, we designed the 8bit MCU peripheral circuit. We had a few experiments to confirm the performance of the proposed system, and compared with the specification of same kind of imports. As a result, proposed system than the imported products showed good performance as follows: the time to reach operating temperature is 11 seconds faster, ripple temperature variation is $1.5^{\circ}C$ lower, temperature recovery rate is about $0.14^{\circ}C$/sec faster.