• Proceedings of the Materials Research Society of Korea Conference
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• 2002.05a
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• pp.134-134
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• 2002

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.61-61
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• 2003

CMP(Chemical Mechanical Polishing)는 VLSI의 제조공정에서 실리콘웨이퍼의 절연막내에 있는 토포그래피를 제어할 수 있는 광역 평탄화 기술이다. 또한 최근에는 실리콘웨이퍼의 나노토포그래피(Nanotopography)가 STI의 CMP 공정에서 연마 후 필름의 막 두께 변화에 많은 영향을 미치게 됨으로 중요한 요인으로 대두되고 있다. STI CMP에 사용되는 CeO$_2$ 슬러리에서 첨가되는 계면활성제의 농도에 따라서 나노토포그래피에 미치는 영향을 제어하는 것이 필수적 과제로 등장하고 있다. 본 연구에서는 STI CMP 공정에서 사용되는 CeO$_2$ 슬러리에서 계면활성제의 농도에 따른 나노토포그래피의 의존성에 대해서 연구하였다. 실험은 8 "단면연마 실리콘웨이퍼로 PETEOS 7000$\AA$이 증착 된 것을 사용하였으며, 연마 시간에 따른 나노토포그래피 의존성을 알아보기 위해 연마 깊이는 3000$\AA$으로 일정하게 맞췄다. 그리고 CMP 공정은 Strasbaugh 6EC를 사용하였으며, 패드는 IC1000/SUBA4(Rodel)이다. 그리고 연마시 적용된 압력은 4psi(Pounds per Square Inch), 헤드와 정반(table)의 회전속도는 각각 70rpm이다 슬러리는 A, B 모두 CeO$_2$ 슬러리로 입자크기가 다른 것을 사용하였고, 농도를 달리한 계면활성제가 첨가되었다. CMP 전 후 웨이퍼의 막 두께 측정은 Nanospec 180(Nanometrics)과 spectroscopic ellipsometer (MOSS-ES4G, SOPRA)가 사용되었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.149-149
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• 2004

반도체 산업이 급속하게 발전함에 따라 고집적, 대용량이 요구되고 있으며, 이에 따라 선폭의 미세화, 웨이퍼 크기의 증가, 패턴의 다층화가 필수적인 조건으로 대두되고 있다. 이러한 요구를 만족시키기 위해서는 고정도의 표면상태와 칩과 웨이퍼 전면에서의 균일한 가공이 필요하다. 따라서 화학 기계적 연마를 통한 안정하고 고성능의 평탄화는 고집적 소자형성에 있어서 핵심 기술이 되고 있다.(중략)

• Journal of Korean Tunnelling and Underground Space Association
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• v.14 no.5
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• pp.517-528
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• 2012

Inserting a nozzle assembly into a removed cutting space during a continuous cutting operation is necessary in rock excavation using an abrasive waterjet. In this study, a combined two nozzle assembly is used to secure enough removal width. The shape of the cut space is affected by the geometric parameters (standoff distance, nozzle angle, and vertical distance between the nozzle tips) of the combined nozzle assembly. Abrasive waterjet cutting tests are performed with various geometric parameters for granite rock specimens. Optimized geometric parameters for the nozzle inserting process are determined and verified through the experimental tests.

• The Journal of the Petrological Society of Korea
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• v.23 no.2
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• pp.139-144
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• 2014

A series of the planar cathodoluminescence (CL) and backscattered-electron (BSE) images of magmatic zircon from the Paleozoic Yeongdeok pluton in the southeastern Korean Peninsula were taken using a scanning electron microscope for a 3D reconstruction of internal zonation of zircon. Seven zircon crystals mounted in epoxy were serially polished with average $3{\mu}m$ thickness to their disappearance. Their 3D reconstruction of zonation was performed using the Volume Viewer function in the ImageJ software. The 3D oscillatory zoning pattern of zircon was apparently shown in all the analyzed crystals. This method can further be applied to zircon crystals of multiple growth histories as well as other geological materials.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.89-93
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• 2020

Complex warpage behavior of the electronic packages causes internal stress so many kinds of mechanical failure occur such as delamination or crack. Efforts to predict the warpage behavior accurately in order to prevent the decrease in yield have been approached from various aspects. For warpage prediction, silicon is generally treated as a homogeneous material, therefore it is described as showing no warpage behavior due to thermal loading. However, it was reported that warpage is actually caused by residual stress accumulated during grinding and polishing in order to make silicon wafer thinner, which make silicon wafer inhomogeneous through thickness direction. In this paper, warpage behavior of the single-side polished wafer at solder reflow temperature, the highest temperature in packaging processes, was measured using 3D digital image correlation (DIC) method. Mechanism was verified by measuring coefficient of thermal expansion (CTE) of both mirror-polished surface and rough surface.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.4
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• pp.179-185
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• 2004

Surface finish technology is highly demanded in the wide field of industry applications from ultra-precision parts to rough casting parts. Therefore, many kinds of surface finish technologies have been developed for each purpose. Because surface of a car's wheel cast is very rough it becomes the reason of the corrosion. This surface is coated to complement such problem but because surface is rough, the result of coating is not good and the coated metal peels off well. Therefore before the wheel is coated, it is necessary to grind the surface. In this study, we devised the plant to apply a barrel machining to improve the surface roughness and enhance the productivity. Also we could obtain the optimum barrel machining conditions for the proper surface roughness.

• ETRI Journal
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• v.14 no.1
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• pp.108-117
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• 1992

광통신 시스팀에서 신호접속용으로 사용되는 광커넥터의 결합기구 중 세라믹 페룰-슬리브의 정렬기구에서 발생하는 성능저하 현상을 다루었다. 성능저하 현상으로 페룰 단면연마시 발생하는 Vertex Eccentricty, 좌굴현상, 환경에 따른 탄성 및 응력의 변화, 마모, 피로파괴 등에 대한 이론적인 배경과 실험결과를 토대로 특성에 대한 영향을 분석하였다.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.166-167
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• 2007

본 연구에서는 Anodic Aluminum Oxide(AAO)-Nano Template 제조 시 알루미늄의 결정방위가 AAO 미세공 형성에 미치는 영향을 연구하였다. 시료는 직경 20mm 두께 2mm의 (200), (220), (111) 세가지 알루미늄 단결정 시편을 사용 하였으며 이는 XRD 장비로 단결정임을 확인 하였다. 양극산화에 앞서 평활한 면을 얻기 위해 다이아몬드 콤파운드($1{\mu}m$)로 미세연마 하였으며 양극산화는 세가지 시편에 대해 모두 동일한 조건에서 2단계 양극산화까지 하였다. 결과는 주사전자현미경(FE-SEM)으로 제조된 AAO 표면의 세공형태와 단면을 모두 관찰 하였으며 그 결과 (200) 결정방위가 (220), (111) 결정 방위보다 세공 형태 균일도 및 단면 정열도와 직진성이 우수함을 관찰 할 수 있었다.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.12
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• pp.1159-1165
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• 2013

Powder blasting, which is an efficient micromachining method for glass, silicon, and ceramics, has a critical disadvantage in that the surface finish is poor owing to the brittle fracture of materials. Low-pressure waterjet machining can be applied to smoothen the rough surface inside the blasted structure. In this study, the surface roughness and sectional dimension of micro-channels are observed during the repetitive application of a waterjet to blasted micro-channels. The asperities and subsurface cracks created by blasting are removed by waterjet machining. Along with the surface roughness, it is found that the sectional dimension increases and the edges of the finished micro-channel become slightly round. Finally, a microfluidic chip is machined by the blasting-waterjet process and a transparent microfluidic channel is obtained efficiently.