• Proceedings of the KSME Conference
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• 2007.05a
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• pp.321-325
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• 2007

Recently, demands on thin multi-layer printed circuit boards(PCB) have been rapidly increased with broad spread of personal portable digital appliances such as multi-media. In case of mobile phone, however, the fact that PCBs have low flexural strength might cause defects. The purpose of this study is to improve the flexural strength by substituting the well-known GFRP(glass fiber reinforced plastic) for CFRP(carbon fiber reinforced plastic). Firstly, finite element simulation was carried out using ABAQUS to find out a unique CFRP layer that has a role to sustain the applied forces mainly in PCB. Secondly, three point bending tests were conducted with the newly designed CFRP PCB model to verify the improvement of the flexural strength. Consequently, it is shown that PCB layered with the CFRP on both outer sides of the board can be used to improve the flexural strength effectively.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.7
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• pp.1048-1056
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• 2001

Decoupling capacitors are commonly used to reduce the effect of SSN propagated through parallel power and ground planes in high-speed multilayer printed circuit boards (PCBs). In this paper, we introduced a simple high frequency measurement and proposed a wideband (50 MHz ∼3 GHz) equivalent circuit model for decoupling capacitor considering high frequency parasitic effects. The proposed model can be easily combined with the SPICE model of power supply planes far SSN analysis. The circuit simulations with the proposed model show good agreement with the measurement results. Also, we expect to accurately analyze the noise reduction effect as a function of value and location using the proposed model of decoupling capacitor.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.48 no.1
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• pp.27-33
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• 2016

This study was carried out in order to investigate the effect of binder properties in pre-coating layer on the characteristics of top-coating layer and print mottle of coated paper. Four different latices were used as a binder in pre-coating layer, and coating color prepared with a same formulation was applied for top-coating. The properties and print mottle of coated paper were evaluated. It was found that glass transition temperature (Tg) was the important factor to control the properties of pre- and top-coating layer. PPS roughness of coated paper was decreased and paper gloss was increased with applying binder which has lower Tg. Properties of top-coating layer were affected by the binder used in pre-coating layer. Print mottle of coated paper was improved with using binder which has lower Tg in pre-coating layer. These results indicate that final printability and properties of top-coating layer can be improved with using suitable binder in pre-coating layer.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.48 no.2
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• pp.61-67
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• 2016

This study was carried out in order to investigate the effect of pigment properties in a pre-coating layer on the characteristics of a top-coating layer and the print mottle of the coated paper. Five different pigments were applied for this study as raw materials for the pre-coating layer. The properties and print mottle of the coated paper samples were evaluated according to the coating color formulation. Type of pigments appliied in a pre-coating layer was one of the most important factor to control the properties of pre and top coating layer. Surface properties of pre and top coated paper were improved by blending GCC which had smaller particle size, with clay. Properties of a top-coating layer was affected by the pigment properties used in the pre-coating layer. It was found that print mottle of coated paper can be improved by replacing part of GCC with smaller particle size GCC or clay in pre-coating layer.

• Journal of Sensor Science and Technology
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• v.29 no.4
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• pp.232-236
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• 2020

Three-dimensional (3D) multilayered Pt electrodes were fabricated to develop a porous electrode using a pattern-transfer printing process. The Pt thin films were deposited using a transferred sputtering pattern having a 250 nm line width on the substrate, and the uniform line patterns were efficiently transferred using our proposed method. Temperature-programmed desorption (TPD) analyses were used to evaluate the porosity of the electrodes. It was possible to distinguish between two resolved maxima at 168 and 227 ℃, which could be described in terms of desorption reactions on the Pt (111) planes. The results of the TPD analysis of the 3D and multilayered Pt electrodes prepared through transfer printing were compared to those of an electrode fabricated through screen printing using a commercial Pt-carbon paste commonly used as porous electrodes. It was confirmed that the 3D multilayered electrodes exhibited a desorption concentration approximately 100 times higher than that of the Pt-carbon composite electrode, and the desorption concentration increased by approximately 0.02 mg/mol per layer. The 3D multilayered electrode effectively functions as a porous electrode and a catalyst.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.38-38
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• 2008

무선 통신에 사용되는 기판에서 passive device는 대부분 기판 위에 개별적으로 표면 실장 되고 있으며 전체 기판면적에 80% 정도를 차지하고 있다. 따라서 기판의 소형화, 경량화를 위하여 많은 면적을 차지하는 수동소자들을 다층인쇄회로기판(multi-layer circuit board)에 내장하는 내장형 수동소자(embedded passive device) 기술이 연구되고 있다. 본 연구원에서 개발한 복합재료는 무기물 충전제 $SrTiO_3$를 사용하였으며, 열가소성 수지로는 cyclo-olefin-polymer계열의 수지를 바탕으로 제작 하였고, 유전율7~7.5이고 유전손실은 0.0045이다. 또한 $SrTiO_3$/유기물 복합재료는 공정온도가 낮고 경제적인 유기물에 높은 유전상수를 갖는 무기물이 분산되어 있는 형태이며, 우수한 유전 특성, 화학적 안정성, 저온 제조공정, 제조단가의 감소, 패키징 크기의 감소 등의 장점을 갖는다. 개발된 재료를 기반으로 Multi-layer 구조를 이용한 다양한 용량대의 capacitor를 구현 하였으며, spiral inductor 와 내장형 spiral inductor를 구현하여 다양한 용량대의 inductor를 구현 하였다. 그리고 각각의 구조에 따른 inductance와 Q factor를 분석 하였으며, Q factor가 100이상인 high Q inductor도 구현하였다. 이렇게 구현된 내장형 수동소자는 기판의 크기의 감소와 제조 단가의 절감, 최소 크기의 기판을 구현하는데 응용이 가능 할 것으로 예상 된다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.59.2-59.2
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• 2009

화학보호복은 독성이 있는 화학물질 및 미세분진등에 대해 공기를 차단하며 완전 밀폐형으로 공기호흡기 및 에어라인 같은 호흡보호장치와 함께 착용하여 신체부위를 보호한다. 그 예로 생물/화학보호복은 유독하고 해로운 생물/화학물질로 부터 인체를 보호해준다. 이들 보호복은 다양한 환경이 노출되어 장시간 작업을 위해서 오랜시간 보호성능을 유지해야한다. 특히, 이런 원단의 구성은 플라스틱과 고무류의 다층구조로 구성되어있다. 플라스틱류(폴리에틸렌, PTFE 등)는 표면장력이 너무 낮아 접착하는데 어려운 점이 많이 대두된다. 일반적인 표면처리방법은 크게 물리화학적 방법으로 4가지로 분류한다. 화학적산화, 불꽃처리, 플라즈마처리, UV 방사법 등이 있다. 이들 중에서 가장 간단한 산화처리는 플라즈마처리다. 이처리는 상온/상압하에서 대기 중 또는 가스내에 방전에 의해 플라즈마를 형성하고 이 플라즈마가 대상물의 표면분자와 격렬히 반응하게 하여 표면의 분자구조를 변화시킴에 따라 소수성의 표면에 Carboxyl, hydroxyl과 carbonyl과 같은 친수성으로 변하여 결합능력을 증가 시켜 표면장력을 높여주는 가장 효과적인 방법이다. 플라즈마 표면처리를 하고 나면 육안으로 표면의 변화를 감지할 수 없지만 접착, 잉크, 코팅을 잘 받아들이는 결과를 가져온다. 플라즈마 표면처리의 효과는 주로 부도체의 필름이나 합성수지 계열의 인쇄성과 접착성을 향상시키고자 많이 활용되고 있는 실정이다. 특히, 화학보호복과 같은 플라스틱류인 다양한 고분자 합성수지(Polyethylene, polypropylene, nylon, vinyl, PVC, PET 등)에 적용가능하다. 본 연구에서는 플라즈마처리조건에 영향을 주는 변수들을 고려하여 실험계획법(DOE, RSM)을 이용하여 최적화된 플라즈마 공정을 향상시키고자한다.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1591-1592
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• 2006

이동 및 정보통신 시스템이 소형화 및 고성능화됨에 따라 System OR Package (SOP) 기술의 연구개발이 주목을 받고 있다. 저가형 SOP를 위하여 가장 많은 연구가 다층인쇄회로 기판에 수동소자 및 전송선로를 내장시키는 것이다. 본 논문에서는, 8층 KB 기판에 Meander line과 Radial/T Stub 패턴을 Advanced Design System(ADS) simulation을 이용하여 설계 및 제작하고 분석함으로써 정확한 SOP 디자인 및 설계 방향을 제시하고자 한다. 설계변수-패턴의 length, width, spacing, 각도와 공정변수-1층/3층, 기판 재질(prepreg(PP)과 resin coated copper(RCC))을 두어 제작하여 그 특성을 비교하였다. Meander Line는 PP보다 RCC에서의 인덕턴스가 크고 높은 자가 공진주파수를 가졌고, 3층보다 1층에서의 인덕턴스가 안정적이었다. Radial/T Stub는 PP보다 RCC에서의 커패시턴스가 작으나, 높은 자가 공진 주파수로 커패시턴스가 안정적이었다. Meander Line은 RCC, 병렬 전송선로 간격-400um, 병렬 전송선로 길이-500um, 1층 설계 시, 인덕턴스-1.60nH, 자가 공진주파수-9.21GHz 특성이 가장 우수하고, Radial Stub는 RCC, $60^{\circ}$, 1층 설계 시, 커패시턴스-0.62pF, 자가 공진주파수-9.06GHz의 특성이 나타났고, T Stub는 RCC, Stub 길이-600um, Stub 너비-150um, 1층 설계 시, 커패시턴스 -0.38pF, 자가 공진주파수-10GHz이상으로 우수한 특성을 나타냈다.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.7
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• pp.750-755
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• 2003

This paper proposes a new three-line balun. The equivalent circuit of the proposed three-line balun is presented, and impedance matrix［Z］of the equivalent circuit is derived from the relationship between the current and voltage at each port. The design equation for a given set of balun impedance at input and output ports is presented using［S］parameters, which is transferred fom impedance matrix,［Z］. To demonstrate the feasibility and validity of design equation, multi-layer ceramic(MLC) chip balun operated in the 2.4 GHz ISM band frequency is designed and fabricated by the use of the low temperature co-fired ceramic(LTCC) technology. By employing both the proposed new three-line balun equivalent circuit and multi-layer configuration provided by LTCC technology, the 2012 size MLC balun is realized. Measured results of the multi-layer LTCC three-line balun match well with the full-wave electromagnetic simulation results, and measured in band-phase and amplitude balances over a wide bandwidth are excellent. This proposed balun is very easily applicable to multi-layer structure using LTCC as shown in the paper, and also can be realized with microstrip lines on PCB. This distinctive performance is very favorable for wireless communication systems such as wireless LAN(Local Area Network) and Bluetooth applications.