• Composites Research
• /
• v.35 no.3
• /
• pp.182-187
• /
• 2022

In this paper, the thickness of a multilayer PCB was predicted through an empirical formulation based on the physical properties of the prepreg used in multilayer PCB. Since the thickness of prepreg reduction when manufacturing a PCB due to the physical properties and copper foil residual rate, it is necessary to accurately predict the thickness of the PCB through the thickness empirical formulation. To determine the density of the prepreg, the mass and thickness of the prepreg were measured. To manufacture the CCL, the prepreg and copper foil were laminated using a hot press machine, and the thickness was measured using a microscope and micrometer. An 8-layerd PCB was designed with different circuit densities to measure the change in the thickness with the copper foil residual ratio, and the proposed empirical formulation was verified by comparing the measured thickness with the value obtained using the empirical formulation. As a result, the errors for the CCL and multilayer PCB were 2.56% and 4.48%, respectively, which demonstrated the reliability of the empirical formulation.

• The Transactions of the Korea Information Processing Society
• /
• v.5 no.1
• /
• pp.119-127
• /
• 1998

In this paper, the design of a VLSI-based multilayer neural network is presented, which can be used as a dedicated hardware for character-type segmentation and character-element recogniti on consuming large processing time in conventional software-based Hangul printed-character recognition systems. Also the architecture and its design of a neural coprocessor interfacing the neural network with a host computcr and controlling thc neural network are presented. The architecture, behavior, and performance of the proposed neural coprocessor are justified using VHDL modeling and simulation. Experimental results show the successful rates of character-type segmentation and character-element recognition is competitive to those of software-based Hangul printed-character recognition systems with retaining high-speed.

• Journal of the Korean Institute of Telematics and Electronics
• /
• v.27 no.2
• /
• pp.65-72
• /
• 1990

The potential of neural networks for the recognition of the printed Korean characters is examined. In spite of good classification capability of neural networks, it is difficult to train a neural network to recognize Korean characters. The difficulty is due to a large number of Korean characters, the similarities among the characters, and the large number of data from the character images. To reduce the input image data, DC components are extracted from each input images. These preprocessed data are used as input to the neural network. The output nodes are composed to represent the characteristics of Korean characters. A MLP (multilayer perceptron) with one hidden layer was trained with a modified BEP algorithm, This method gives good recognition rate for the standard positioned characters of more than 2,300. The result shows that neural networks are well suited for the recognition of printed Korean characters.

• Journal of the Microelectronics and Packaging Society
• /
• v.9 no.2
• /
• pp.55-60
• /
• 2002

The recent trend in electronic devices has been towards light weight, low cost, high performance and improved reliability. Passive components are very important parts of microelectronic devices. The number of passive components used in hand held devices and computers continue to increase. To achieve improvements in costs, component density, performance, and reliability, embedding of these passive components into the printed circuit boards (PCBs) is required. This paper introduces the embedding of passive components, and discusses the remained challenges in the commercialization of this technique.

• Annual Conference on Human and Language Technology
• /
• 1995.10a
• /
• pp.137-142
• /
• 1995

코호넨의 SOFM(Self-Organizing Feature Map)온 빠른 검증 학습이 가능하여 다층 퍼셉트론의 단점을 보완할 수 있는 패턴분류기로 부각되고 있다. 그러나 기본적으로 고정된 크기와 구조의 네트워크를 사용하기 때문에 실재 문제에 적용하기가 쉽지 않다는 문제가 있다. 본 논문에서는 패턴에 대한 사전 정보없이 복잡한 패턴공간을 적응적으로 분할하기 위해 구조적응되는 자기조직화 신경망을 소개하고 이를 인쇄체 한글 문자의 인식에 적용한 결과를 보여준다. 여기에서 제안하는 신경망은 SOFM의 각 셀이 좀더 자세한 SOFM으로 확장될 수 있도록하며, 확률분포가 0인 셀을 제거함으로써 패턴 공간에 보다 근사한 분류를 가능하게 한다. 실제로 이러한 방식이 한글과 같은 복잡한 분류 문제에서 어떻게 작동하는지 설명하고, 한글 완성형 2350자에 대해 실험한 결과를 보여준다.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.12 no.3
• /
• pp.36-40
• /
• 2013

Recently, electronic equipments become smaller, more functional, and more complex than before. As these trends, MLC(multi-layer ceramic) circuit has been emerged to a promising technology in semiconductor inspection industry. Especially, multi-layer ceramic which is consisted of many fine-pitch multi-hole is used to produce a semiconductor inspection unit. The hole is processed by UV laser. But, working conditions are changed all the time. Therefore real time measurement of fine-pitch multi-hole is very important method for ensuring performance. In this paper we found the best method for illuminating and auto focusing. And, we verified our equipment.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2000.11a
• /
• pp.755-758
• /
• 2000

Rapid prototyping is one of the most important technology for 21th century industry. To overcome the limitation of the material and function, Functional Prototype Development(FPD) concept is newly proposed. Wide function is necessary such as mechanical, optical, chemical and electrical property in order to solve broad requirements of the industry. The process of FPD has more than two conventional processes based on fusion technology and the FPD system is integrated with the interdisciplinary, interfacing and intelligent concepts. This paper shows some representative achievements such as optic coloring prototypes, electric multi layer printed circuit broad(MLB) and MEMS using electrostrictive polymer. Finally, we confirmed that FPD has a great possibility which can be applied in broad industry and will be a powerful tool in near future.

• Journal of Sensor Science and Technology
• /
• v.28 no.2
• /
• pp.113-116
• /
• 2019

A three-dimensional porous structure was fabricated by pattern transfer printing for applications of electrodes in gas sensors. To form replica patterns, solutions were mixed with acetone, toluene, heptane, and poly(methyl methacrylate). These replica patterns can also be formed on substrates such as polyimide, polydimethylsiloxane, and silicon. The wide range of line widths from 1 to $5{\mu}m$ was derived from the surface grating patterns of master substrates. The cross-bar pattern with 40 layers showed a thickness of 600 nm. The area of platinum transferred patterns with different line widths was enhanced to $20{\times}25mm$, which is applicable to various electrode patterns of gas sensors.

• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.4
• /
• pp.59-66
• /
• 2018

In this paper, we analyzed the usefulness of single-structured printed circuit board (PCB) modeling by using numerical analysis to model the PCB structure applied to a package for semiconductor purposes and applying modeling assuming a single structure. PCBs with circuit layer of 3rd and 4th were used for analysis. In addition, measurements were made on actual products to obtain material characteristics of a single structure PCB. The analysis results showed that if the PCB was modeled in a single structure compared to a multi-layered structure, the warpage analysis results resulting from modeling the PCB structure would increase and there would be a significant difference. In addition, as the circuit layer of the PCB increased, the mechanical properties of the PCB, the elastic coefficient and inertia moment of the PCB increased, decreasing the package's warpage.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.41 no.5
• /
• pp.421-426
• /
• 2017

In this study, we propose a method for predicting the mechanical properties of the printed circuit board (PCB) that has transversely isotropic characteristics. Unlike the isotropic material, there is no specific test standard for acquisition of the transversely isotropic properties. In addition, common material test methods are not readily applicable to that type of laminated thin plate. Utilizing the natural frequency obtained by a modal test and the sizing optimization technique provided in $OptiStruct^{(R)}$, the mechanical properties of a PCB were derived to minimize the difference between test and analysis results. In addition, the validity of the predicted mechanical properties was confirmed by the MAC (Modal Assurance Criteria) value of each of the compared mode shapes. This proposed approach is expected to be extended to the structural analysis for the design verification of the top product that includes a PCB.