• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.2
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• pp.443-448
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• 2010

Rapid advance in information technology requires high performance devices with compact size. Integrated multi-layer electronic element with different functions enables those compact devices to possess various performances and powerful capabilities. In mass production, the multi-layer electronic element is manufactured as a bulk type with a large number of parts for productivity. However, this may cause the electronic part to be damaged in the cutting process of the bulk elements to separate into each part. Therefore the cutting performance of multi-layer element bulk is playing an important role in the view of production efficiency. This study focuses on the cutting characteristics of multi-layer electronic elements. In order to increase the efficiency, the vibration cutting method was applied to the blade cutting machine. Flexure hinge structure, which is an physical amplifier of increasing displacement, was attached to the vibration cutting device for machining efficiency. The behaviors of flexure hinge were modeled with Lagrange equation and simulated with finite element method (FEM). Performance of hinge structure was verified by experimental modal analysis (EMA) for hinge structure to be tuned to the specific mode of vibrations. Cutting experiments of multi-layer elements were conducted with the proposed vibrating cutting module, and the characteristics was analyzed.

• Journal of the Korean Ceramic Society
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• v.46 no.2
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• pp.211-218
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• 2009

For the Y5V characteristic MLCC which is very prone to crack, it is important to to find out the basic cause of the crack. After finding out the crack origin, the materials and processes should be developed to remove the crack. The microstructures of the cracks were investigated using the fractographic method for the various types of cracks such as an exterior crack, a cyclic thermal shock crack, and an piezo-electric crack. It was found out that the crack origin was the pore at the end of the Ni inner electrode after bake-out. Even though the three dimensional crack shapes were different, the crack origins were seemed to be similar. The exterior crack could grow from the origin with the aids of residual and applied stress. FEM (finite element method) analysis was used to calculate the stress distribution of residual and applied stress. And the concept of fracture mechanics was applied for the explanation of the crack initiation and propagation from the stresses concentration.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.3
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• pp.149-154
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• 2015

This study has focused on the deburring technology of a vacuum plate for MLCC lamination using electrolytic in-process dressing (ELID) grinding, and the magnetic-assisted polishing (MAP) process. The surface of the vacuum plate has many micro-holes for vacuum suction. They are easily blocked by the burrs created in the surface-flattening process, such as the conventional grinding process. In this study, the MAP process, the ELID grinding process, and an ultrasonic vibration table are examined to remove the micro-burrs that lead to the blockage of the holes. In the results of the experiments, the MAP process and ELID grinding technology showed significant improvements of surface roughness and deburring performance.

• Journal of the Korean Ceramic Society
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• v.35 no.2
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• pp.123-128
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• 1998

Multilayer ceramic capacitors(MLCC) were prepared by laminating the layer of composition with dif-ferent Curie temperature to improve temperature coefficient in the Pb(Mg1/3Nb2/3)O3-PbTiO3 binary system. Green sheet was formed by tape casting using Pb(Mg1/3Nb2/3)O3-PbTiO3 and PbTiO3 synthesized with solid state reaction of PBO. Nb2O5 MgO and TiO2. Green sheet with electrode of 70Ag-30Pd was laminated under 300 kg/cm2 at 70$^{\circ}C$ and sintered at 1100$^{\circ}C$ for 2hr. Curie temperatues for MLCC with 10 layers of pure PMN and 0.9PMN-0.1PT were lowered to -22$^{\circ}C$ and 36$^{\circ}C$ respectively. MLCC with 7 layers of PMN and 3 layers of 0.9PMN-0.1PT showed nearly zero temperature coefficient of capacitance in the range of -20∼30$^{\circ}C$ and sum of dissipation factor of each layer.