• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.10 no.1
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• pp.70-77
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• 1999

A miniaturized voltage controlled oscillator using multi-layer ceramic technology at PCS frequency band is designed and fabricated. To improve the phase noise characteristics and to reduce the size, the strip line which is embedded in a high performance multi-layer ceramic substrate is used as an inductor of VCO. And the fabricated VCO is very small size ($6mm\times6mm\times2mm$). At the bias condition of 3.3 V and 9mA, the output power and phase noise in the operating frequency range of 1,720~1,780 MHz are -3.7 dBm and -95 dBc/Hz at 10 KHz offset from the carrier, respectively. The phase noise and size are better than the conventional VCO using glass epoxy substrate.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.29-35
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• 2001

Combline 구조를 가진 마이크로 스트립 라인 또는 스트립 라인 필터를 내장한 기능형 PCB를 제작하였다. 저 비용 구현 및 이동성과 휴대성을 강조하기 위해 기존의 세라믹 대신 FR4와 에폭시를 유전체로 사용하는 저가형 다층 회로 기판의 도체 층에 집적화 하였다. Combline의 각 끝단에 커패시터를 부하함으로써 전기적 길이를 확장하였고 전체적인 크기를 감소시킴으로서 적당한 필터 특성을 얻을 수 있었다. 구현된 Embedded PCB는 마이크로파 대역에서 사용 가능하며 특히 Bluetooth 나 Wireless LAN과 같은 ISM 대역을 사용하는 무선통신소자로서 사용 가능하다.

• 전기의세계
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• v.42 no.1
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• pp.5-11
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• 1993

금속이나 세라믹 입자를 용사하여 보호피막을 형성하는 기술은 화염을 사용하는 방법에서 시작했으며 용사재료는 분말, 선, 봉의 형태로 공급되었다. 1960년대에 상업적인 plasma 용사장비가 개발되었으며 여기서 사용된 D.C.plasma jet를 이용하여 분말형태의 용사재료를 용융하고 고속으로 피용사테에 용융입자를 분사하여 피용사체면에 충돌시켜 다층의 얇은 피막을 형성한다. 최근(1985년)에는 R.F.(Radio Frequency) Plasma를 이용하여 열전도도가 작은 재료나 산소와 반응성이 큰 재료를 용사하는 방법도 개발되고 있다. 용사피복법은 현재 여러가지 방법이 실용되고 있으며 재료를 용융하는 열원에 따라 분류하면 표1과 같다. 즉 산소와 연료 가스의 혼합에 의한 연소나 폭발에너지를 이용하는 가스식 용사법과 Arc, Plasma등의 전기 에너지를 이용하는 전기식 용사법으로 크게 나눌 수 있다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2008.05a
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• pp.42.1-42.1
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• 2008

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.401-404
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• 2008

In the present investigation, a high precision thermal imprint system for micro ceramic products was developed and the net-shape manufacturing of multi-layer ceramic reflector for LED (Light Emitting Diode) was conducted with a precision metal die. Workpiece used in the present investigation were the multi-layer laminated ceramic sheets with pre-punched holes. The cavity with arbitrary angle was formed on the circular and rectangular holes of the ceramic sheets. During the imprinting process, the ambient temperature of the imprint system was kept over the transition temperature of the ceramic sheet and then rapidly cooled. The results in this paper show that the present method can be successfully applied to the fabrication of very small size hole array for ceramic reflector in a one step operation.

• Journal of Industrial Technology
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• v.24 no.A
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• pp.9-15
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• 2004

The flexural strength from 3-point bend test and fatigue properties were measured to evaluate mechanical properties of metal/ceramic interface of the multilayer ceramic package produced through tape casting. From the results, the specimens with three electrode layers showed the highest strength. The temperature distribution with time during thermal cycle and thermal stresses with the change of electrode's shape have been estimated by mathematical modelling. Specimen affected by thermal shock, produced microcracks by the difference of thermal expansion coefficient. The results of tensile test and fatigue test showed the rupture at pin. The fact that the pin brazed specimens were always fractured at the pin proved the good bonding condition between pin and electrode.

• Journal of the Korean Ceramic Society
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• v.31 no.10
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• pp.1115-1122
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• 1994

ZT/PZT/ZT multi-layered thin films were deposited on silicon substrate by co-sputtering method for FEMFET device application. Effects of Pb/(Zr+Ti) ratio, films thickness, annealing conditions and substrate temperature on the ferroelectric behavior of the multi-layered films were studied. The best memory device characteristics with leakage current of 2$\times$10-8 A/$\textrm{cm}^2$ and breakdown field of about 1 MV/cm could be obtained with ZT(250 $\AA$) / PZT(1000 $\AA$)/ZT(750 $\AA$) multi-layered thin film deposited at 35$0^{\circ}C$ and post-annealed at $700^{\circ}C$ for 120 sec by RTA(Rapid Thermal Annealing).

• Journal of the Korean Ceramic Society
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• v.42 no.12 s.283
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• pp.865-871
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• 2005

Submicron thick solid electrolyte membrane is essential to the implementation of low temperature solid oxide fuel cell, and, therefore, development of new electrode structures is necessary for the submicron thick solid electrolyte deposition while providing functions as current collector and fuel transport channel. In this research, a nickel membrane with multi-stage nano hole array has been produced via modified two step replication process. The obtained membrane has practical size of 12mm diameter and $50{\mu}m$ thickness. The multi-stage nature provides 20nm pores on one side and 200nm on the other side. The 20nm side provides catalyst layer and $30\~40\%$ planar porosity was measured. The successful deposition of submicron thick yttria stabilized zirconia membrane on the substrate shows the possibility of achieving a low temperature solid oxide fuel cell.

• Journal of the Korean Ceramic Society
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• v.33 no.2
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• pp.127-134
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• 1996

The thermal residual stresses were estimated for brazed Si3N4/S.S.316 joints with Cu/Mo multi-interlayers using FEM, and their bending strengths at room temperature were measured for various interlayer configura-tions. The Cu, Mo multi-interlayer decreased the maximum residual stress in Si3N4 and caused the residual stress redistribution rsulting in the high residual stress at Mo interlayer. The stress distribution in the joints as well as the maximum residual stress in silicon nitride were found to be main factors for determining bending strengths and Weibull modulous of the joints. The bending strength of the brazed Si3N4/S.S.316 joints with specific Cu, Mo multi-interlayer system were found to be above 400 MPa.

• Journal of the Korean Ceramic Society
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• v.34 no.6
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• pp.601-610
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• 1997

In cofiring of multilayered alumina with tungsten, the change of camber with lamination condition was experimented and the effect of sintering shrinkage of alumina and tungsten was investigated. From the exact measurement of sintering shrinkage of tungsten thick film, as lamination pressure increased, the sintering shrinkage of alumina decreased but that of tungsten thick film was not changed. So it was though that the main factor which induced the sintering shrinkage difference between ceramics and metal with lamination condition was the change of sintering shrinkage of ceramics. In case of high lamination pressure, high green sheet density, the cofired specimen showed low camber due to low shrinkage difference between alumina and tungsten and there was a linear relation between camber and shrinkage difference. It was found that this shrinkage difference could change the thickness of tungsten film and the microstructure within via hole during cofiring.