A Study on the Detection of Interfacial Defect to Boundary Surface in Semiconductor Package by Ultrasonic Signal Processing (초음파 신호처리에 의한 반도체 패키지의 접합경계면 결함 검출에 관한 연구)
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- Journal of the Korean Society for Nondestructive Testing
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- v.19 no.5
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- pp.369-377
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- 1999