• Title/Summary/Keyword: 다중기판

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Numerical Analysis of Multi-Layer Multi-Coupled Microstrip Lines (쉬해석에 의한 다층 다중 결합 마이크로스트립 선로 해석)

  • Seo, Cheol-Heon
    • The Journal of the Acoustical Society of Korea
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    • v.13 no.1E
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    • pp.5-10
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    • 1994
  • It is obtained the general expessions of the numerical method are applied for the TEM-mode analysis of multu-layer multi-coupled microstrip lines, In this paper, coupled microstrip are replaced by three-coupled microstrip lines in special aplications. Three-layer versions of three-coupled microstrip lines are specially attactive because of the additional flexibilities offered by three-layer configuration. This structure can be used for obtaining large capacitance and preventing coupling among microstrip lines in filter and coupler. Sappihre is chosen for anisotropic substrates material. The permittivity parallel to the optical axis is higher than the permittivity in the plane perpendicular to this axis.

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Heat Transfer Analysis of Infrared Reflow Soldering Process for Attaching Electronic Components to Printed Circuit Boards (전자부품의 인쇄회로기판 부착시 적외선 Reflow Soldering과정 열전달 해석)

  • Son, Young-Seok
    • Journal of Welding and Joining
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    • v.15 no.6
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    • pp.105-115
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    • 1997
  • A numerical study is performed to predict the thermal response of a detailed card assembly during infrared reflow soldering. The card assembly is exposed to discontinuous infrared panel heater temperature distributions and high radiative/convective heating and cooling rates at the inlet and exit of the oven. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated and the predictions illustrate the detailed thermal responses. The predictions show that mixed convection plays an important role with relatively high frequency effects attributed to buoyancy forces, however the thermal response of the card assembly is dominated by radiation. The predictions of the detailed card assembly thermal response can be used to select the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly tresses and warpage.

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InGaN/GaN 양자우물층 위에 제작된 460nm 격자의 GaN 나노박막 광결정 특성

  • Choe Jae-Ho;Kim Geun-Ju
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2006.05a
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    • pp.127-130
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    • 2006
  • 사파이어 기판위에 MOCVD (metal organic chemical vapor deposition)를 이용하여 8주기의 InGaN/GaN 다중양자우물(multiple quantum well : MQW)구조가 성장되어졌고 이 구조 위에 p-GaN층이 형성됐다. 다시 p-GaN 위에 200nm의 두께를 갖는 PMMU 박막을 도포하고 electron beam lithography system을 이용하여 직경이 150nm가 되도록 나노단위의 삼각격자 구조를 가진 구멍을 패턴하고 inductively coupled plasma(ICP)를 이용하여 식각을 하여 광결정을 제작하였다. 광결정은 두께가 26nm이고 격자간격은 460nm로서 파장이 450nm인 파란빛을 나노회절 시켜서 photoluminescence(PL)의 세기를 강화시킨다.

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표면 프리틸트 제어를 통한 새로운 광시야각 수직 배향 LCD 기술 소개

  • Kim, Seong-Min;Lee, Seung-Hui
    • Information Display
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    • v.10 no.1
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    • pp.15-21
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    • 2009
  • 다중 도메인 수직배향 LCD는 러빙 공정을 필요치 않는 다는 장점에서 출발해 현재 액정 TV 시장에서 주를 이루고 있다. 하지만 현재 사용화 되고 있는 제품들이 투과율, 응답속도, 명암대비율 등 성능부분의 개선이 필요하고 공정 측면에서 돌기를 사용하거나 상판 패턴을 필요로 하는데 이러한 공정을 제거하면서도 성능이 우수한 새로운 형태의 수직배향 LCD가 최근 대두되고 있다. 기 발표된 기술들을 정리해 보면 신기술에서는 액정에 UV curing이 가능한 모노머를 소량 도핑 한 후 적절한 셀 구조를 형성해 전압 인가시 중간에 액정 배열에 충돌이 있더라도 최종적으로 안정한 배열을 갖게 만든 다음 UV조사를 통해 양 기판 표면에 모노머가 고분자화되면서 액정 배향 방향과 프리틸트각을 갖게 하도록 만든다. 이러한 신개념의 수직배향 LCD는 종래 LCD에 비해 전기광학 특성이 우수해지고 제조공정도 단순해져 향후 수직배향 LCD의 주를 이룰 것으로 예상된다. 더불어 수직배향 기술은 해마다 새로운 진화를 하고 있으며 앞으로 더 진화를 할 것으로 예상되어 이 부분에 대한 적극적인 연구 지원이 필요하다.

Macro-Micro Reconfigurable Antenna for Multi Mode & Multi Band(MMMB) Communication Systems (다중 모드 다중 대역(MMMB) 통신 환경을 위한 매크로-마이크로 주파수 재구성 안테나)

  • Yeom, In-Su;Choi, Jung-Han;Jung, Young-Bae;Kim, Dong-Ho;Jung, Chang-Won
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.20 no.10
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    • pp.1031-1041
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    • 2009
  • A small microstrip monopole antenna for macro-micro frequency tuning over multiple bands is presented. The meander-shape antenna is fabricated on a conventional printed circuit board(FR-4, $\varepsilon_r=4.4$ and tan $\delta=0.02$). The antenna operates over WiBro(2.3~2.4 GHz) and WLAN a/b(2.4~2.5 GHz/5.15~5.35 GHz) service bands with an essentially constant antenna gain within each service band. Two diodes, a PIN diode and a varactor, are embedded into the antenna for frequency reconfiguration. The PIN diode is used for frequency switching(macro-tuning) between 2 GHz and 5 GHz bands while the varactor is used for frequency tuning(micro-tuning) within the service bands, 2.3~2.5 GHz and 5.15~5.35 GHz. Unwanted resonances between the two frequency bands(2 GHz and 5 GHz) are suppressed by filling up the gaps between the meander lines. The antenna gain is essentially constant and higher than 2 dBi within each service band. The measured performance of the proposed antenna system suggests the macro-micro frequency tuning techniques be useful in reconfigurable wireless communication systems.

Dual Backlight Unit Incorporating a Single Light Source Integrated with a Beam Splitting Reflector (광분할 반사경이 집적된 단일 광원 기반의 통합형 듀얼 백라이트 유닛)

  • Park, Chan-Kyu;Lee, Hak-Soon;Lee, Sang-Shin
    • Korean Journal of Optics and Photonics
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    • v.19 no.2
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    • pp.122-126
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    • 2008
  • Dual backlight unit incorporating a single light source integrated with a beam splitting reflector was demonstrated, providing a surface light beam for both the keypad and the display section simultaneously. The reflector was realized by aligning a groove substrate with a matching cover, and a light guiding module comprising a stack of light guide panels and prism/diffuser sheets was attached to both sides of the reflector. A light emanating from the light source-placed in the middle of the substrate-undergoes a series of reflections through the reflector to reach the input of the light guiding module. Then it is transformed into a surface light beam, which is used to irradiate the keypad and display sections simultaneously. As for the accomplished dual surface light sources, the measured average luminance and the spatial luminance uniformity were respectively about $420\;cd/m^2$ and 69% for the keypad section, and $640\;cd/m^2$ and 79% for the display section.

Fabrication of Indium Tin Oxide (ITO) Transparent Thin Films and Their Microwave Shielding Properties (Indium Tin Oxide (ITO) 투광성 박막의 제조 및 전자파 차폐특성)

  • Kim, Yeong-Sik;Jeon, Yong-Su;Kim, Seong-Su
    • Korean Journal of Materials Research
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    • v.9 no.11
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    • pp.1055-1061
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    • 1999
  • Indium Tin Oxide (ITO) films were fabricated by vacuum deposition technique and their microwave shielding properties were investigated for the application to the transparent shield material. The vacuum coating was conducted in a RF co-sputtering machine. The film composition and structure associated with the sputtering conditions (argon and oxygen pressure. substrate temperature. RF input power) were investigated for the attainment of high electrical conductivity and good transparency. The electrical conductivity of IT0 films fabricated under the optimum deposition conditions (substrate temperature : $300^{\circ}C$. Ar flow rate : 20 sccm, Oxygen flow rate : 10 sccm, In/Sn input power : 50/30 W) showed 5.6$\times10^4$mho/m. The optical transparency is also considerably good. The microwave shielding properties including the dominant shielding mechanism are investigated from the electrical conductivity, thickness and skin depth of the ITO films. The total shielding effectiveness is then estimated to be 26 dB, which provides a suggestion that the IT0 films can be effectively used as the transparent shield material.

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PCB Board Impedance Analysis Using Similarity Transform for Transmission Matrix (전송선로행열에 대한 유사변환을 이용한 PCB기판 임피던스 해석)

  • Suh, Young-Suk
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.13 no.10
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    • pp.2052-2058
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    • 2009
  • As the operating frequency of digital system increases and voltage swing decreases, an accurate and high speed analysis of PCB board becomes very important. Transmission matrix method, which use the multiple products of unit column matrix, is the highest speedy method in PCB board analysis. In this paper a new method to reduce the calculation time of PCB board impedances is proposed. First, in this method the eigenvalue and eigenvectors of the transmission matrix for unit column of PCB are calculated and the transmission matrix for the unit column is transformed using similarity transform to reduce the number of multiplication on the matrix elements. This method using the similarity transform can reduce the calculation time greatly comparing the previous method. The proposed method is applied to the 1.3 inch by 1.9 inch board and shows about 10 times reduction of calculation time. This method can be applied to the PCB design which needs a lots of repetitive calculation of board impedances.

GaInP/GaAs 이중접합 태양전지의 전극 구조가 집광 효율에 미치는 영향

  • Jeon, Dong-Hwan;Kim, Chang-Ju;Gang, Ho-Gwan;Park, Won-Gyu;Lee, Jae-Jin;Go, Cheol-Gi
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.272-272
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    • 2010
  • 최근 화합물반도체를 이용한 집광형 고효율 태양전지가 차세대 태양전지로서 주목을 받기 시작하였다. GaAs를 주축으로 하는 고신뢰성 고효율 태양전지는 높은 가격으로 인해 응용이 제한되어왔으나, 고집광 기술을 접목하여 태양전지 재료 사용을 수 백배 이상 줄이면서도 동시에 효율을 극도로 향상시킴으로써 차세대 태양전지로 활발히 개발되고 있다. GaAs 기판을 이용한 다중접합의 태양전지는 n-type GaAs 기판 위에 버퍼 층, GaInP back surface field 층, GaAs p-n 접합, AlInP 창층, GaAs p-n 접합의 터널접합층, 상부전지로서 GaInP p-n 접합, AlInP 창층 순서로 epi-taxial structure를 형성하고 전극과 무반사막을 구성한다. 이러한 태양전지의 효율을 결정하는 요인 중, 상부 전극은 전기적 및 광학적 손실을 일으키는 원인으로써 최소화되어야 한다. 그런데 이러한 이중접합 화합물 태양전지에 집광한 태양광을 조사할 경우, 태양광을 집광한 만큼 전류가 증가하게 되며 증가한 전류가 전극에 흐르면서 전기적 효율 손실을 유발하게 된다. 따라서, 집광형 화합물 반도체 태양전지의 전극에 의한 손실에 대한 연구가 선행되어 저항에서 손실되는 전력을 최소화하여야만 전기적 손실이 낮은 고집광 태양전지 개발이 가능하다. 본 논문에서는 먼저 전극 두께가 0.5${\mu}m$인 GaInP/GaAs 이중접합 태양전지 (효율 25.5% : AM1.5G)의 집광시 효율 변화에 대해서 연구하였다. 이후 이러한 효율 변화가 전극 구조의 최적화에 의해서 개선 될 수 있는지를 삼차원 모의실험을 통해서 확인하였다. 모의실험에는 Crosslight 사의 APSYS를 사용하였고, material parameter를 보정하여 실제 실험 결과에 근사 시킨 후 전극 구조에 대한 최적화를 하였다.

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Improvement of Conductive Micro-pattern Fabrication using a LIFT Process (레이저 직접묘화법을 이용한 미세패턴 전도성 향상에 관한 연구)

  • Lee, Bong-Gu
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.18 no.5
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    • pp.475-480
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    • 2017
  • In this paper, the conductivity of the fine pattern is improved in the insulating substrate by laser-induced forward transfer (LIFT) process. The high laser beam energy generated in conventional laser induced deposition processes induces problems such as low deposition density and oxidation of micro-patterns. These problems were improved by using a polymer coating layer for improved deposition accuracy and conductivity. Chromium and copper were used to deposit micro-patterns on silicon wafers. A multi-pulse laser beam was irradiated on a metal thin film to form a seed layer on an insulating substrate(SiO2) and electroless plating was applied on the seed layer to form a micro-pattern and structure. Irradiating the laser beam with multiple scanning method revealed that the energy of the laser beam improved the deposition density and the surface quality of the deposition layer and that the electric conductivity can be used as the microelectrode pattern. Measuring the resistivity after depositing the microelectrode by using the laser direct drawing method and electroless plating indicated that the resistivity of the microelectrode pattern was $6.4{\Omega}$, the resistance after plating was $2.6{\Omega}$, and the surface texture of the microelectrode pattern was uniformly deposited. Because the surface texture was uniform and densely deposited, the electrical conductivity was improved about three fold.