• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.2
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• pp.81-86
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• 2003

To measure the pressure using semiconductor type pressure sensor in water or chemical solution, the sensor must be protected from the solution using proper packaging materials. stainless steel isolated type pressure sensor packaged with SUS316 can be widely used to measure the pressure in water or chemical due to its high corrosion-resistance and good performance in tensility and welding. Even if the surface of SUS316 has a plenty of nickel and chromium, the SUS316 is highly corrosive in acidic or alkaline solution. We coated parylene and adhesion promoting copper layer are 5${\mu}{\textrm}{m}$ and 200nm, respectively. The parylene coated stainless steel pressure sensor showed good anti-corosive characteristics in various strong acids. The accuracy of pressure sensor wasn't varied after parylene coating with 0.5%FSO.

• Korean Journal of Materials Research
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• v.15 no.5
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• pp.301-305
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• 2005

We fabricated nickel silicide layers on whole non-patterned wafers from $p-Si(100)SiO_2(200nm)$/poly-Si(70 nm)mn(40 nm) structure by 40 sec rapid thermal annealing of $500\~900^{\circ}C$. The sheet resistance, cross-sectional microstructure, surface roughness, and phase analysis were investigated by a four point probe, a field emission scanning electron microscope, a scanning probe microscope, and an X-ray diffractometer, respectively. Sheet resistance was as small as $7\Omega/sq$. even at the elevated temperature of $900^{\circ}C$. The silicide thickness and surface roughness increased as silicidation temperature increased. We confirmed the nickel silicides iron thin nickel/poly-silicon structures would be a mixture of NiSi and $NiSi_2$ even at the $NiSi_2$ stable temperature region.

• Korean Journal of Materials Research
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• v.28 no.10
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• pp.595-600
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• 2018

This study investigates the microstructural properties of CoCrFeMnNi high entropy alloy (HEA) oxynitride thin film. The HEA oxynitride thin film is grown by the magnetron sputtering method using nitrogen and oxygen gases. The grown CoCrFeMnNi HEA film shows a microstructure with nanocrystalline regions of 5~20 nm in the amorphous region, which is confirmed by high-resolution transmission electron microscopy (HR-TEM). From the TEM electron diffraction pattern analysis crystal structure is determined to be a face centered cubic (FCC) structure with a lattice constant of 0.491 nm, which is larger than that of CoCrFeMnNi HEA. The HEA oxynitride film shows a single phase in which constituting elements are distributed homogeneously as confirmed by element mapping using a Cs-corrected scanning TEM (STEM). Mechanical properties of the CoCrFeMnNi HEA oxynitride thin film are addressed by a nano indentation method, and a hardness of 8.13 GPa and a Young's modulus of 157.3 GPa are obtained. The observed high hardness value is thought to be the result of hardening due to the nanocrystalline microstructure.

• 한국신재생에너지학회:학술대회논문집
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• 2006.11a
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• pp.556-559
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• 2006

벌크형태의 태양전지 기판을 대체할 목적으로 연성기판을 적응한 태양전지 개발이 활발하게 진행되고 있으며, 주재료는 플라스틱 기판, 금속기판 등이 있다 그러나 기존의 연성기판인 플라스틱의 경우 열과, 내구성, 화학약품에 약하다는 단점이 있으며, 금속기판은 높은 생산원가, 박막화의 어려움 등의 문제를 안고 있다 이러한 문제를 극복하기 위해 전주성형법으로 제조된 철-니켈계 연성기판을 개발하였다. 이 연성기판의 경우 고온의 공정조건에서도 열팽창율이 플라스틱 기판보다 낮으며, 기존의 금속기판 보다 저렴한 생산단가로 쉽게 극박화 할 수 있다는 것이다. 전주성형법을 적용하여 40Ni, 45Ni, 52Ni 연성기관을 제조하였으며, TMA 장비를 사용하여 각 연성기판의 열팽창 계수를 측정한 결과 6.36, 6.78, $10.93{\mu}m/m^{\circ}C$로 기존의 연성기판인 플라스틱, 금속에 비해 낮은 열팽창 계수를 가짐으로서 고온 공정 중에 안정성 요구를 충분히 충족시킬 수 있다.

• Korean Journal of Materials Research
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• v.14 no.11
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• pp.769-774
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• 2004

15 nm-Co/15 nm-Ni/P-Si(100)[Type I] and 15 nm-Ni/15 nm-Co/P-Si(100)(Type II) bilayer structures were annealed using a rapid thermal annealer for 40sec at $700/sim1100^{\circ}C$. The annealed bilayer structures developed into composite NiCo silicides and resulting changes in sheet resistance, composition and microstructure were investigated using Auger electron spectroscopy and transmission electron microscopy. Prepared NiCoSix films were further treated in a sequential annealing set up from $900\sim1100^{\circ}C$ with 30 minutes. The sheet resistances of NiCoSix from Type I maintained less than $7\;{\Omega}/sq$. even at the temperature of $1100{\circ}C$, while those of Type II showed about $5\;{\Omega}/sq$. with the thinner and more uniform thickness. With the additive post annealing, the sheet resistance for all the composite silicides remained small up to $900^{\circ}C$. The proposed NiCoSix films were superior over the conventional single-phased silicides and may be easily incorporated into the sub-0.1 ${\mu}m$ process.

• Korean Journal of Materials Research
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• v.16 no.9
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• pp.564-570
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• 2006

Silicides have been required to be below 40 nm-thick and to have low contact resistance without agglomeration at high silicidation temperature. We fabricated composite silicide layers on the wafers from Ni(20 nm)/Co(20 nm)/poly-Si(70 nm) structure by rapid thermal annealing of $700{\sim}1100^{\circ}C$ for 40 seconds. The sheet resistance, surface composition, cross-sectional microstructure, and surface roughness were investigated by a four point probe, a X-ray diffractometer, an Auger electron spectroscopy, a field emission scanning electron microscope, and a scanning probe microscope, respectively. The sheet resistance increased abruptly while thickness decreased as silicidation temperature increased. We propose that the fast metal diffusion along the silicon grain boundary lead to the poly silicon mixing and inversion. Our results imply that we may consider the serious thermal instability in designing and process for the sub-0.1 um CMOS devices.

• Journal of the Korean Electrochemical Society
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• v.12 no.3
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• pp.251-257
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• 2009

In this study, we fabricated nickel oxide thin film for lithium based electrolyte using sol-gel method. This film was deposited by dip-coating method with mixed solvent of DameH (N,N-dimethylaminoethanol) and DI water. As changing the ratio between DmaeH and DI water, nickel oxide thin film was presented in different charge density and optical transmittance because they were shown various thickness. It was accounted for changing viscosity and density by the ratio of DmaeH and DI water. The thin film synthesized with 1 : 1 ratio of DmaeH and DI water was expressed best electrochromic performance in lithium based electrolyte, because of thick thickness but porous structures.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.460-460
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• 2011

그래핀은 탄소원자로 구성된 2차원의 나노재료로서 우수한 기계적, 전기적, 광학적 특성을 지닌다. 이러한 특성들을 기반으로 그래핀은 디스플레이, 터치스크린, 전 자기 차폐재 등의 다양한 분야로의 응용이 가능하다고 예측되고 있다. 한편 이러한 특성은 그래핀의 구조 및 결함, 불순물 등에 의하여 변화한다고 알려져 있으며, 이러한 특성의 변화를 통해 전자소자로의 응용도 가능 하다고 예측되고 있다. 따라서 그래핀의 구조를 제어하고 적절한 결함 및 불순물을 부여하는 것은 그래핀의 기초물성 연구 뿐 아니라 응용연구 에 있어서도 매우 중요하다고 할 수 있다. 본 연구에서는 공기 플라즈마를 이용하여 그래핀의 구조변형을 도모하였다. 그래핀은 열화학 기상증착법 (thermal chemical vapor deposition; TCVD)을 이용하여 300 nm 두께의 니켈박막이 증착된 기판위에 합성하였다. 합성된 그래핀은 산화처리 시 기판의 영향을 배제하고자 트렌치(trench) 구조의 산화막 실리콘 기판위로 전사함으로서 공중에 떠 있는 (air suspended) 구조를 구현하였다. 산화처리를 위한 장치는 직류 플라즈마 장치를 이용하였으며 0.1 Torr의 압력에서 0.4W의 파워로 공기 플라즈마를 방전하여 5분간의 산화처리와 특성평가를 매회 반복함으로서 처리시간에 따른 산화처리의 영향을 관찰하였다. 그 결과 공기 플라즈마 산화처리를 통해 그래핀에 결함을 부여하고 그래핀의 구조변형이 가능함을 확인하였다. 그래핀의 특성분석을 위해서는 광학현미경, 라만 분광기, 원자간힘현미경 등을 이용하였다.

• Korean Journal of Materials Research
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• v.14 no.12
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• pp.846-850
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• 2004

NiCo silicide films have been fabricated from $300{\AA}-thick\;Ni_{1-x}Co_{x}(x=0.1\sim0.9)$ on Si-substrates by varying RTA(rapid thermal annealing) temperatures from $700^{\circ}C\;to\;1100^{\circ}C$ for 40 sec. Sheet resistance, cross-sectional microstructure, and chemical composition evolution were measured by a four point probe, a transmission electron microscope(TEM), and an Auger depth profilemeter, respectively. For silicides of the all composition and temperatures except for $80\%$ of the Ni composition, we observed small sheet resistance of sub- $7\;{\Omega}/sq.,$ which was stable even at $1100^{\circ}C$. We report that our newly proposed NiCo silicides may obtain sub 50 nm-thick films by tunning the nickel composition and silicidation temperature. New NiCo silicides from NiCo-alloys may be more appropriate for sub-0.1${\mu}m$ CMOS process, compared to conventional single phase or stacked composit silicides.

• Journal of Surface Science and Engineering
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• v.50 no.1
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• pp.24-28
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• 2017

The electrodeposition of Ni-Co alloy from a sulfamate bath was investigated. The cobalt content in the Ni-Co deposits is more influenced by the temperature or stirring effect than the current density in the process parameters. As cobalt contents in the Ni-Co deposited layer increased from 0 wt.% up to 43 wt.%, hardness value of the layer rised from 400 Hv up to 700 Hv and crystal orientation (111) increased. However, (200) and crystal size significantly reduced. The tensile and yield strength also increased, while the modulus of elasticity showed the maximum value of $10.4N/mm^2$ at 29 wt.%.