• Resources Recycling
• /
• v.17 no.6
• /
• pp.62-67
• /
• 2008

Oil shale is a sedimentary rock that contains organic compounds called kerogen that are released as petroleum-like liquids by retorting. In order to evalute oil shale as alternative oil resources, the physical properties of oil shale samples from US and Russia were investigated and Fischer assays were carried out. Thermogravimetric analysis shows that thermal degradation of oil shale consisted of two stage processes, with hydrocarbon release from kerogen followed by $CO_2$ release by carbonate decomposition. Organic compounds in oil shale have an high hydrogen/carbon ratio, and therefore liquid hydrocarbons could be obtained easily. Shale oil yields from Russian and US oil shales by Fischer assay were 12.7% and 18.5%, respectively. The density and boiling point of shale oils are higher than that of Middle East crude oil, indicating that further upgrading processes are necessary for refinery. On the other hands, sulfur contents are relatively low, and the amounts of Vanadium and Nickel are extremely small in shale oil. It was found that paraffins were rich in US shale oil while main components of Russian shale oil were oxygenated hydrocarbons.

• Korean Journal of Materials Research
• /
• v.2 no.4
• /
• pp.270-278
• /
• 1992

The effect of Ni-rich phase on the stress-rupture properties of Ni mlcroalloyed W were studied using direct load creep tester at 100$0^{\circ}C$, 110$0^{\circ}C$, and 120$0^{\circ}C$ in $H_2.$ The stress rupture strength of 100hrs. of W-0.4wt% Ni was 43% higher at 100$0^{\circ}C$ and 35% higher at 110 $0^{\circ}C$than that of W-0.2wt% Ni due to the larger initial grain size, the higher relative density and the higher grain growth during test. That of W-0.8wt% Ni was 90% higher at 100$0^{\circ}C$ and 60% higher at 110$0^{\circ}C$ than that of W-0.2wt% Ni. The activation energy of W-0.4wt% Ni for creep was 81.3 Kcal/mole. It was considered that creep deformation was controlled by the diffusion of W in the Ni rich phase between the grains and the deformation of grains. All of the specimens showed intergranular fracture by grain boundary cavitation and growth of cavity throughout the entire spcimen cross-section.

• Journal of the Korean Vacuum Society
• /
• v.21 no.3
• /
• pp.178-184
• /
• 2012

Carbon coils could be synthesized on nickel catalyst layer-deposited silicon oxide substrate using $C_2H_2$ and $H_2$ as source gases and $SF_6$ as an additive gas under thermal chemical vapor deposition system. The characteristics (formation density and morphology) of as-grown carbon coils were investigated as functions of additive gas flow rate and the cycling on/off modulation of $C_2H_2/SF_6$ flows. Even in the lowest $SF_6$ flow rate (5 sccm) in this work, the cycling on/off modulation injection of $SF_6$ flow for 2 minutes could give rise to the formation of nanosized carbon coils, whereas the continuous injection of $SF_6$ flow for 5 minutes could not give rise to the carbon coils formation. With increasing $SF_6$ flow rates from 5 to 30 sccm, the cycling on/off modulation injection of $SF_6$ flow confines the geometry for the carbon coils to the nanosized ones. Fluorine's role of $SF_6$ during the reaction was regarded as the main cause for the confinement of carbon coils geometries to the nano-sized ones.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.202-202
• /
• 2012

유연성 투명 전도막은 현대 전자산업의 발전에 있어 필수적인 부품소재로서, 가시광선의 투과율이 80% 이상이고 면저항이 $100{\Omega}/sq.$ 전후이며 휘거나 접히고 나아가 두루마리의 형태로도 응용이 가능한 소재를 일컫는다. 이러한 유연성 투명 전도막은 차세대 정보디스플레이 산업 및 유비쿼터스 사회의 중심이 되는 유연성 디스플레이, 터치패널, 발광다이오드, 태양전지 등 매우 다양한 분야에 응용이 기대된다. 이러한 이유로 고 신뢰성 유연성 투명 전도막 개발기술은 차세대 산업에 있어서의 핵심기술로 인식되고 있다. 현재로서는 인듐 주석 산화물(indium tin oxide; ITO) 및 전도성 유기고분자를 사용하여 투명 전도막을 제조하고 있으나, ITO 박막의 경우 인듐 자원의 고갈로 인한 가격상승 및 기판과의 낮은 접착력, 열팽창계수의 차이로 인한 공정상의 문제, 산화물 특유의 취성으로 인한 유연소자로서의 내구성 저하 등의 문제가 제기되고 있다. 전도성 유기고분자의 경우는 낮은 전기전도도와 기계적강도, 유기용매 처리 등의 문제점이 지적되고 있다. 따라서 높은 전기전도도와 투광도 뿐만 아니라 유연성을 지니는 재료의 개발이 요구되고 있는 실정이다. 최근 이러한 재료로서 그래핀(graphene)과 탄소나노튜브(carbon nanotube; CNT)를 중심으로 하는 탄소나노재료가 주목받고 있으며 많은 연구가 활발히 진행되고 있다. 본 연구에서는 열화학기상증착법(thermal vapor deposition; TCVD)으로 합성된 그래핀 및 CNT를 이용하여 탄소나노재료 복합체 기반의 유연성 투명 전도막을 제작하고 그 특성을 평가하였다. 그래핀과 CNT합성을 위한 기판으로는 각각 300 nm 두께의 니켈과 1 nm 철이 증착된 실리콘 웨이퍼를 이용하였으며, 원료가스로는 메탄(CH4)과 아세틸렌(C2H2)등의 탄화수소가스를 이용하였다. 그래핀의 경우 원료가스의 유량, 합성온도, 냉각속도를 변경하여 대면적으로 두께균일도가 높은 그래핀을 합성하였으며, CNT의 경우 합성시간을 변수로 길이 제어합성을 도모하였다. 합성된 그래핀은 식각공정을, CNT는 스프레이 증착공정을 통해 고분자 기판(polyethylene terephthalate; PET) 위에 순차적으로 전사 및 증착하여 탄소나노재료 복합체 기반의 유연성 투명 전도막을 제작하였다. 제작된 탄소나노재료 복합체 기반의 유연성 투명 전도막은 물리적 과부하를 받았을 때 발생할 수 있는 유연성 투명 전도막의 구조적결함에 기인하는 전도성 저하를 보상하는 특징이 있어, 그래핀과 탄소나노튜브 각각으로 제조된 유연성 투명 전도막보다 물리적인 하중이 반복적으로 인가되었을 때 내구성이 향상되는 효과가 있다. 40% 스트레인을 반복적으로 인가하였을 때 그래핀 투명 전도막은 20 사이클 이후에 면저항이 $1-2{\Omega}/sq.$에서 $15{\Omega}/sq.$ 이상으로 급증한 반면 그래핀-CNT 복합체 투명 전도막은 30사이클까지 $1-2{\Omega}/sq.$ 정도의 면저항을 유지하였다.

• Applied Chemistry for Engineering
• /
• v.23 no.1
• /
• pp.1-7
• /
• 2012

In this article, I will introduce recent developments of environmental-friendly materials fabricated using atomic layer deposition (ALD). Advantages of ALD include fine control of the thin film thickness and formation of a homogeneous thin fim on complex-structured three-dimensional substrates. Such advantages of ALD can be exploited for fabricating environmental-friendly materials. Porous membranes such as anodic aluminum oxide (AAO) can be used as a substrate for $TiO_2$ coating with a thickness of about 10 nm, and the $TiO_2$-coated AAO can be used as filter of volatile organic compound such as toluene. The unique structural property of AAO in combination with a high adsorption capacity of amorphous $TiO_2$ can be exploited in this case. $TiO_2$ can be also deposited on nanodiamonds and Ni powder, which can be used as photocatalyst for degradation of toluene, and $CO_2$ reforming of methane catalyst, respectively. One can produce structures, in which the substrates are only partially covered by $TiO_2$ domains, and these structures turns out to be catalytically more active than bare substrates, or complete core-shell structures. We show that the ALD can be widely used not only in the semiconductor industry, but also environmental science.

• Korean Journal of Crystallography
• /
• v.7 no.1
• /
• pp.36-43
• /
• 1996

The crystal structure Tris(ethylenediamine)nickel(II)Dichromate has been determined by X-ray crystallography. Crystal data: a=8.268(2), b=13.865(2), c=14.921(2)Å, γ=102.04(2)°, V=1672.9(5)Å3, Z=4, Monocline, P21/b (space group No.=14), Dcalc=1.806 gcm-3, μ=24.05 cm-0.1. The intensity data were collected with Mo-Kα radiation(λ=0.7107Å) on an automatic four-circle diffractometer with a graphite monochromator. The structure was solved by Patterson method and refined by full matrix least-square methods using unit weights. The final R and S values were R=0.045, Rw=0.051, Rall=0.059 and S=2.171for 2248 observed reflections. The two carbon atoms of a ring of Ni(en)-ion were split into crossed four atoms. In consideration of α- and β-angles of two rings of a disordered ethylenediamine of Nien3-ion and the hydrogen bonds between Ni(en)3-cation and Cr2O7-anion, the configuration of Ni(en)3-ion is assumed to be disordered with Λδδδ and Λδδλ.

• Korean Journal of Metals and Materials
• /
• v.46 no.11
• /
• pp.762-769
• /
• 2008

Hydrogenated amorphous silicon(a-Si : H) layers, 120 nm and 50 nm in thickness, were deposited on 200 $nm-SiO_2$/single-Si substrates by inductively coupled plasma chemical vapor deposition(ICP-CVD). Subsequently, 30 nm-Ni layers were deposited by E-beam evaporation. Finally, 30 nm-Ni/120 nm a-Si : H/200 $nm-SiO_2$/single-Si and 30 nm-Ni/50 nm a-Si:H/200 $nm-SiO_2$/single-Si were prepared. The prepared samples were annealed by rapid thermal annealing(RTA) from $200^{\circ}C$ to $500^{\circ}C$ in $50^{\circ}C$ increments for 30 minute. A four-point tester, high resolution X-ray diffraction(HRXRD), field emission scanning electron microscopy (FE-SEM), transmission electron microscopy (TEM), and scanning probe microscopy(SPM) were used to examine the sheet resistance, phase transformation, in-plane microstructure, cross-sectional microstructure, and surface roughness, respectively. The nickel silicide on the 120 nm a-Si:H substrate showed high sheet resistance($470{\Omega}/{\Box}$) at T(temperature) < $450^{\circ}C$ and low sheet resistance ($70{\Omega}/{\Box}$) at T > $450^{\circ}C$. The high and low resistive regions contained ${\zeta}-Ni_2Si$ and NiSi, respectively. In case of microstructure showed mixed phase of nickel silicide and a-Si:H on the residual a-Si:H layer at T < $450^{\circ}C$ but no mixed phase and a residual a-Si:H layer at T > $450^{\circ}C$. The surface roughness matched the phase transformation according to the silicidation temperature. The nickel silicide on the 50 nm a-Si:H substrate had high sheet resistance(${\sim}1k{\Omega}/{\Box}$) at T < $400^{\circ}C$ and low sheet resistance ($100{\Omega}/{\Box}$) at T > $400^{\circ}C$. This was attributed to the formation of ${\delta}-Ni_2Si$ at T > $400^{\circ}C$ regardless of the siliciation temperature. An examination of the microstructure showed a region of nickel silicide at T < $400^{\circ}C$ that consisted of a mixed phase of nickel silicide and a-Si:H without a residual a-Si:H layer. The region at T > $400^{\circ}C$ showed crystalline nickel silicide without a mixed phase. The surface roughness remained constant regardless of the silicidation temperature. Our results suggest that a 50 nm a-Si:H nickel silicide layer is advantageous of the active layer of a thin film transistor(TFT) when applying a nano-thick layer with a constant sheet resistance, surface roughness, and ${\delta}-Ni_2Si$ temperatures > $400^{\circ}C$.

• Korean Journal of Environment and Ecology
• /
• v.26 no.5
• /
• pp.694-706
• /
• 2012

The purpose of this study was to offer the raw data for conservation and restoration of aquatic ecosystem by surveying and analysing a water quality, sediment, benthic macroinvertebrate, fish and hydrophyte in Junam reservoir. In the result of analysing the water quality, pH was 8.2~8.4, 6.0~7.5mg/${\ell}$ in COD, 10.0~10.3mg/${\ell}$ in SS, 8.3~11.5mg/${\ell}$ in DO, 0.1mg/${\ell}$ in T-P and 1.2~1.3mg/${\ell}$ in T-N. In case of the sediments, Cd was 0.47~0.52mg/kg, 7.08~7.43mg/kg in Cu, 0.22~0.32mg/kg in As, 0.02~0.03mg/kg in Hg, 6.20~7.45mg/kg in Pb, 32.80~39.70mg/kg in Ni, 513.0~543.0mg/kg in F and 137.0~140.0mg/kg in Zn. $Cr^{6+}$ was not detected. The benthic macroinvertebrates were 432 individuals including 3 phyla, 5 classes, 9 orders, 26 families, 33 genera and 39 species, and the ecological score of benthic macroinvertebrate community(ESB) was 25. The fishes were 8 families and 14 species, and the invasive alien species were 2 taxa including Micropterus salmoids and Lepomis macrochirus. The hydrophytes were 63 taxa including 28 families, 42 genera, 56 species, 1 subspecies and 6 varieties. The emergent plants were 38 taxa(60.3%), 5 taxa(7.9%) in floating-leaved plants and each 10 taxa(15.9%) in free-floating plants and submerged plants.

• Archives of design research
• /
• v.17 no.4
• /
• pp.241-250
• /
• 2004

In this research, the copper alloy plates C2200, C5210, C7701, C8113 were selected to make datum and to identify further usage of metal craft experimentation. For its experimentation, the general welding and TIG welding methods were researched; for 2nd experimentation, the Reticulation and Electroforming skill's differences in color and temperature were researched. With these methods 3 different kinds of works are introduced for sample studies. For this research, Dr. Lee, Dong-Woo who works in Poongsan Metal Co, supported 4 kinds of copper alloy metals. Which are Commercial bronze (Cu-Zn), Deoxidiged Copper(Cu-Sn-P), Nickel Silver (Cu-Ni-Zn), and White Bronze (Cu-Ni); they were applied partly and wholly by the method of Laminatin, Reticulation, Fusing, and Electroforming skills. In case of C2200, the brass, the A. C. TIG welding method is better under 2mm slight plate; the D.C. TIG welding is better upper 2mm plate; and 250~300$^{\circ}C$ is recommended for remain heat treatment. In case of C5210, not having Hydrogen in high temperature return period, doesn't need Oxygen in high temperature and hardening in comparative high temperature neither, it is good for welding. It contains Sn 2-9% ad P 0.03-0.4% generally; and in accordance with the growth rate of Sn contain amount, the harden temperature boundary become broad. In case of cold moment after welding, they are recommended that higher speed TIG welding, smaller melting site and less than 200$^{\circ}C$ for pre-heating temperature. In case of C7701, the 10-20% Ni, 15-30% Zn are widely used.. If it is upper 30% Zn, it become (${\alpha}+{\beta}$) system and adhesive power rate become lower, and the productivity become lower in low temperature but the productivity become higher in high temperature. Nickel Silver's resistance of electricity is well; and the heatproof and incorrodibility is good, too. Lastly, in case of C8113, good at persistence in salty and grind; high in strength of high temperature. In case of white brass, contain 10-30% Nickel and hardened in high temperature and become single phrase. For these reason, the crystallization particles easily become large, if the resistance become higher small amount of Pb, P, S separation rate become higher.