• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.11
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• pp.1135-1140
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• 2012

Two-step metallization processes have been proposed to achieve high-efficiency silicon solar cells, where the front-side grids are formed by silver plating after the formation of a nickel seed layer with a mask. Because the conventional mask patterning process is performed by an expensive selective printing method using either UV resist or phase change ink, however, the combination of a simple coating and laser-selective ablation processes is proposed in this study as an alternative means. As a masking material, the solar cell wafer was coated with either inexpensive wax having a low melting temperature or a fluorocarbon solution, and then, an electrode image was patterned by selectively removing the masking material using the laser. It was found that the fluorocarbon coating was not only superior to the wax coating in terms of pattern uniformity but it also increased the efficiency of the solar cell by 0.16%, as confirmed by statistical f and t tests.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.7
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• pp.859-866
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• 2010

In this study, microinjection molding process using the newly developed micromold system, namely modularized and sectioned micromold system (MSMS), has been carried out for a replication of multi-level microstructures. The present MSMS consisted of several micromold modules, each having cross-sectional microstructures on the top surface. The micromold modules were precisely fabricated by deep X-ray lithography and subsequent nickel electroforming. By assembling the micromold modules, an MSMS having multi-level microstructures, which could be used as a mold system in micromolding processes, was obtained. In this manner, polymeric multi-level microstructures, such as the triangular prism microstructures on a stepped surface, were successfully replicated by the microinjection molding process.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.1 no.2
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• pp.117-127
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• 1991

The exposure level of chromium and nickel for chrome and nickel plating workers were evaluated. Chromium and nickel concentrations in serum from 82 exposed workers and 66 controls, who were not exposed occupationally to metals, were analyzed by flameless atomic absorption spectrophotometry. The results were as follows : 1. The recovery percent of chromium and nickel concentrations in personal air samples were 95-108.2%, 88.0-107.7%, precisions (C.V., %) were 2.7-3.1%, 2.1-4.4%. respectively. 2. The recovery percent of chromium and nickel concentrations in serum were 93.6-106.4%, 91.3-107.9% and precisions (C.V. %) were 1.1-7.6%, 2.4-5.4% respectively. 3. The exposure level of chromium and nickel concentrations in the place of preparation process were $2.0{\pm}2.00{\mu}g/m^3$, chromplating were $35.7{\pm}53.07{\mu}g/m^3$, $2.8{\pm}3.42{\mu}g/m^3$, nickelplating were $4.6.0{\pm}5.8{\mu}g/m^3$, $18.62{\pm}4.41{\mu}g/m^3$, and covering were $2.9{\pm}2.02{\mu}g/m^3$, $1.1{\pm}0.47{\mu}g/m^3$ respectively. There were significant difference of concentrations for chromium and nickel in workplaces by groups statistically. 4. Chromium concentrations in serum of exposed group and control were $0.68{\pm}0.399{\mu}g/l$, $1.41{\pm}0.748{\mu}g/l$, respectively. There were significant difference of concentrations for chromium and nickel in serum by groups statistically. 5. Chromium and nickel concentrations in serum of exposed group were not significant by workplaces.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.81-81
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• 2010

전자 패키징은 미세화, 경량화, 저가화를 지향하고 신뢰성의 향상을 위해 발전해 왔다. 이러한 경향은 전자부품 자체의 성능 향상 뿐 아니라 전자부품을 장착, 고정할 수 있게 하는 인쇄회로 기판(PCB : Printed Circuit Board)의 성능에 많은 관심을 가지게 되었다. 전기적 신호의 손실을 줄이기 위해 전기, 전자 산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(FPCB : Flexible PCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(RPCB : Rigid PCB)이 그 대상이다. 본 논문에서는 이 PCB중에서도 RPCB와 FPCB간의 열압착 방식으로 접합 시 전극간의 접합 양상을 보았다. 이 열압착 방식은 기존에 PCB를 접합하는데 사용하고 있는 connector를 이용한 체결법을 대체하는 기술로써 솔더를 중간층(interlayer)로 이용하여 열과 압력으로 접합하는 방식이다. 이 방식을 connector를 사용하는 방식에 비해 그 부피가 작고 I/O개수에 크게 영향 받지 않으며 자동화 공정이 쉬운 장점을 가지고 있다. 접합의 대상 중 RPCB의 경우는 무전해 니켈 금도금(ENIG : Electroless Nickle Immersion Gold)로 제작하였으며 FPCB의 경우는 ENIG와 유기보호피막(OSP : Organic solderability preservation) 처리하였다. 실험에 사용한 PCB는 $300\;{\mu}m$ pitch의 미세피치이며 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)과 Sn-3.0Ag (in wt%)를 사용하였다. 접합 온도와 접합 시간 그리고 접합 압력에 따라 최적의 접합 조건을 도출하였다. 접합 강도는 $90^{\circ}$ Peel Test를 통해서 측정하였으며 접합면 및 파괴면은 SEM과 EDS를 통하여 분석하였다.

• Journal of the Korean institute of surface engineering
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• v.4 no.1
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• pp.5-15
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• 1971

"Rapid Determination of Boric Acid in Nickel Plating Solution" by the addition of Na$_2$C$_2$O$_4$ and thus preventing the precipitation of i(OH)$_2$ during titiration , has previously been reported. In this paper, the exact amount of glycerine and the complexing possibility of oxalate with nickel has been determined by measn of conductivity titrations. This experimental work has been supported by the mathematical application of the Debye-Huckel and mass action equitions as well as statistical analysis. The results were ; (1) Fro determining boric acid in nickel plating solution, 20 ml of 400ml/ι glycerine was sufficient, since 97% of the H$_3$BO$_3$ was dissoicated by this addition. (2) In the absence of Na$_2$C$_2$O$_4$ the continious precipitation of Ni(OH)$_2$ during titration with NaOH even past end -point for boric acid determination resulted in considerable anlaytical error. (3) In the presence of Na$_2$C$_2$O$_4$ during titration , Ni++ combined with C$_2$O$_4$-to form NiC$_2$O$_4$. The solution with this precititate of very fine, colloidal , trantsparent particles, remained quite clear for approximately 2 hours. Therefore it was shown that the presence of Na$_2$C$_2$O$_4$ prevents the formation of gross Ni(OH)$_2$ precititation by forming NiC$_2$O$_4$ instead of a complex salt with Ni++ , which did not interfere with the visible determination of the end point for boric acid with NaOH titation. This observous may be interpreted in the light of the previously published solubility ratio for NiC$_2$O$_4$ and Ni(OH)$_2$, 0.3mg/100g H$_2$O(25$^{\circ}C$), respectively. Precipitation of the less soluble , albeit transparent salt, NiC$_2$O$_4$ precluded therefore the precipitation of the Ni(OH)$_2$ salt.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.30 no.6
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• pp.1-6
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• 2002

Micro engine that includes Micro scale combustor is fabricated. Design target was focused on the observation of combustion driven actuation in MEMS scale. Combustor design parameters are somewhat less than the size recommended by feasibility test. The engine structure is fabricated by isotropic etching of the photosensitive glass wafers. Electrode is formed by electroplating of the Nickel. Photosensitive glass can be etched isotropically with almost vertical angle. Bonding and assembly of structured photosensitive glass wafer from the engine. Combustor size was determined to be 1mn scale. Piston in cylinder moves by fuel injection and reaction. In firing test, adequate engine operation including ignition, flame propagation and piston motion was observed. Present study warrants further application research on MEMS scale internal combustion power units.

• Journal of the Korean institute of surface engineering
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• v.40 no.3
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• pp.125-130
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• 2007

Many fundamental studies have been carried out regarding waste water and hazardous gas treatment technology using the photolysis effect of $TiO_2$. However, photolysis of both organic and organic-inorganic binders immobilizing $TiO_2$ makes permanent use impossible. In this study we manufactured a catalytic electrode by nickel-$TiO_2$ composite plating in order to immobilize $TiO_2$. The surface properties according to the current density changes of cathode and concentration changes of $TiO_2$ powder in nickel plating bath has been analysed with EDX, XRF, SEM, Raman spectrometer etc. The characterization of the catalytic electrode in decomposition of organic compound has been obtained by using UV-Visible spectrophotometer through analysing concentration changes of methyl orange solution containing the catalytic electrode vs. time with projecting UV-light in the solution. The study shows that a catalytic electrode of nickel-$TiO_2$ composite plating with high-efficiency in decompostion of organic compound has been formed under high concentration of $TiO_2$ powder and low current density of cathode.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.6
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• pp.367-374
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• 2000

This paper presents a method to fabricate freestanding structures by (100) silicon anisotropic etching and nickel electroless plating. The electroless plating process is simpler than the electroplating, and provides good coating uniformity and improved mechanical properties. Furthermore, the (100) silicon anisotropic etching in KOH solution with being aligned to <100> direction provides vertical (100) sidewalls on etched (100) surface. In this paper, the effects of the nickel electroless plating condition on the properties of electroless plated metal structures are investigated to apply fabrication of micro structures and then various micro structures are fabricated by nickel electroless plating. And then, the structures are released by silicon anisotropic etching in KOH solution with a large gap between the structure and the substrate. The fabricated cantilever structures are $210\mum$. wide, $5\mum$. thick and $15\mum$. over the silicon substrate, and the comb structure has the comb electrodes which are $4\mum$. wide and $4.3\mum$. thick separated by$1\mum$. It is released by silicon anisotropic etching in KOH solution. The gap between the structure and the substrate is $2.5\mum$.

• Journal of Practical Engineering Education
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• v.6 no.2
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• pp.105-110
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• 2014

In this work, mechanical characteristics of titanium diaphragm have been studied as a potential robust substrate and a diaphragm material for automotive tire pressure sensor. Lamination process techniques combined with traditional micromachining processes have been adopted as suitable fabrication technologies. To illustrate these principles, capacitive pressure sensors based on titanium diaphragm have been designed, fabricated and characterized. The fabrication process for micromachined titanium devices keeps the membrane and substrate being at the environment of 20 MPa pressure and $200^{\circ}C$ for a half hour and then subsequently cooled to $24^{\circ}C$. Each sensor uses a stainless steel substrate, a laminated titanium film as a suspended movable plate and a fixed, surface micromachined back electrode of electroplated nickel. The finite element method is adopted to investigate residual stresses formed in the process. Besides, out-of-plane deflections are calculated under pressures on the diaphragm. The sensitivity of the fabricated device is $9.45ppm\;kPa^{-1}$ with a net capacitance change of 0.18 pF over a range 0-210 kPa.

• Journal of the Korean institute of surface engineering
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• v.44 no.3
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• pp.117-123
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• 2011

We investigated the spectroscopic and electrochemical properties of the citrate-based CuNi solution at different solution pH and analyzed various surface properties of CuNi codeposition layer. By combining UV-Visible spectroscopic data with potentiodynamic polarization curves, it could be found that the complexation of $Ni^{2+}$-citrate pair was completed at lower solution pH than $Cu^{2+}$-citrate pair and was affected by the coexistent $Cu^{2+}$ ions, while the complexation between $Cu^{2+}$ ions and citrate was not sensitive to the presence of $Ni^{2+}$ ions. Also, the electron transfer from cathode to $Cu^{2+}$-citrate and$Ni^{2+}$-citrate was hindered by strong complexation between $Cu^{2+}/Ni^{2+}$ ions and citrate and so apparent codeposition current densities were reduced as the solution pH increases. CuNi codeposited layers had a higher Cu content when they were prepared at high pH solution due to the suppression of Ni deposition, and when codeposition was executed in an agitated condition due to the acceleration of mass transfer of $Cu^{2+}$ ions in the solution. Actually, solution pH had little effect on the surface morphology and deposits orientation, but greatly influenced the corrosion resistance in 3.5% NaCl solution by modifying the chemical composition of CuNi layers and so pH 3 was expected as the most suitable solution pH in the viewpoint of corrosion coatings.