• Journal of the Korean Society for Precision Engineering
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• v.28 no.7
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• pp.769-776
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• 2011

In order to cope with the requirements of smaller patterns, larger surfaces and lower costs in the fields of displays, optics and energy, greater attentions is now being paid to the development of micro-pattern machining technology. Compared with flat molds, roll molds have the advantages of short delivery, ease of manufacturing larger surfaces, and continuous molding. This paper presents the state-of-the-art of the micro pattern machining technology on the roll molds and introduces some research results on the machining process technology. The copper and nickel-phosphorous-alloy plating process, machining process technology for uniform micro patterns. micro cutting simulation and the real time monitoring system for micro machining are summarized. The developed technologies have led the complete localization of the prism sheets and will be applied to the direct forming process with succeeding research & development.

• Journal of Powder Materials
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• v.22 no.2
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• pp.134-137
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• 2015

The monolayer engineering diamond particles are aligned on the oxygen free Cu plates with electroless Ni plating layer. The mean diamond particle sizes of 15, 23 and $50{\mu}m$ are used as thermal conductivity pathway for fabricating metal/carbon multi-layer composite material systems. Interconnected void structure of irregular shaped diamond particles allow dense electroless Ni plating layer on Cu plate and fixing them with 37-43% Ni thickness of their mean diameter. The thermal conductivity decrease with increasing measurement temperature up to $150^{\circ}C$ in all diamond size conditions. When the diamond particle size is increased from $15{\mu}m$ to $50{\mu}m$ (Max. 304 W/mK at room temperature) tended to increase thermal conductivity, because the volume fraction of diamond is increased inside plating layer.

• Journal of the Korean Society for Heat Treatment
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• v.21 no.3
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• pp.144-149
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• 2008

It has been reported that copper and copper alloys have a large anisotropy of functional properties such as electrical, thermal and mechanical properties, which means that the texture of polycrystalline alloy should be considered to achieve better properties. In this study, the determination of grain growth orientation and texture formation in the cold-rolled, heat-treated and Ni-plated hybrid copper sheets was investigated. Grain growth direction and texture formation were analyzed by the X-ray pole figure. The influence of texture on the mechanical properties could be quantitatively confirmed by the results from the orientation distribution function and the tensile test. The heat-treated texture in the cold-rolled hybrid copper sheet is also investigated and discussed.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.4
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• pp.8-13
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• 2015

In this study, we fabricated and characterized a nanostructured surface based on a plastic injection molding with a local mold heating (LMH) system. A metal mold core with a closed packed nano convex array (CVA) was achieved by integrated engineering procedures: (1) master template fabrication by anodic aluminum oxidation (AAO), (2) nickel electroforming (NE) process, and (3) post-processing by precision machining. The nickel mold core was utilized to replicate a surface with a closed packed nano concave-array (CCA) based on injection molding using cyclic olefin copolymer (COC) as a plastic material. In particular, an LMH system was introduced to enhance transcription quality of the nano structures by delaying solidification of molten polymer near the surface of the mold core.

• Journal of the Korean institute of surface engineering
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• v.41 no.6
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• pp.312-324
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• 2008

In this study, the functional property as a super abrasive material was secured for CBN powder by the electroless Ni-P plating on the surface of the particle. The plating solution has been prepared to control the surface morphology by regulating surfactants and process conditions. The effects of processing parameters on the surface morphology of CBN powder was discussed. The results are summarized as follows; A stable plating tendency was achieved from 1 hour after quantitatively dropping reducing agent. It was observed that more than 50% of the weight gain was obtained by Ni-P coating on the surface of CBN super abrasive powder. The morphology of the Ni-P coating layer is consisted of botryoidal and spiky type and it could be controlled by regulating processing parameters. Superior characteristic in terms of surface morphology was found in the nonionic surfactant XL-80N. It was found that XL-80N considerably decreased surface tension of CBN powder and Ni-P alloy surface then enhance wettability as well as plating rate. Metal coated CBN powder as a raw material of resin bond wheel has been developed through this investigation.

• Textile Coloration and Finishing
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• v.22 no.1
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• pp.77-82
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• 2010

Highly conductive yarn was successfully obtained using electroless nickel plating method with palladium activation. In the presence of palladium seed on surface of fibers as a catalyst, continuos nickel layer produced on surface of fibers by reducing $Ni${2+}$ ion in the electroless plating bath to $Ni^0$. It was found that the Pd-activation using $SnCl_2$ and $PdCl_2$ to deposit palladium seeds on the surface of fibers plays a key role in the subsequent electroless plating of nickel. It also found that electroless nickel plating on the fibers can induce the nickel-plated $ELEX^{(R)}$ fibers to improve the electrical conductivity of the fibers. The thickness of nickel coating layer on the Pd-activated $ELEX^{(R)}$ fibers and specific conductivity of the fiber were increased through electroless plating time. The temperature of nickel plating bath was very effective to enhance the nickel deposition rate.

• Journal of the Korean institute of surface engineering
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• v.50 no.1
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• pp.24-28
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• 2017

The electrodeposition of Ni-Co alloy from a sulfamate bath was investigated. The cobalt content in the Ni-Co deposits is more influenced by the temperature or stirring effect than the current density in the process parameters. As cobalt contents in the Ni-Co deposited layer increased from 0 wt.% up to 43 wt.%, hardness value of the layer rised from 400 Hv up to 700 Hv and crystal orientation (111) increased. However, (200) and crystal size significantly reduced. The tensile and yield strength also increased, while the modulus of elasticity showed the maximum value of $10.4N/mm^2$ at 29 wt.%.

• Journal of Welding and Joining
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• v.35 no.3
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• pp.1-6
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• 2017

The effect of metal turnover (MTO) of electroless Ni plating bath on the brittle fracture behavior of electroless nickel electroless palladium immersion gold (ENEPIG)/Sn-3.0wt%Ag-0.5wt%Cu(SAC305) solder joint was evaluated in this study. The MTOs of the electroless Ni for the ENEPIG surface finish were 0 and 3. As the MTO increased, the interfacial IMC thickness increased. The brittle fracture behavior of the ENEPIG/SAC305 solder joint was evaluated with high speed shear (HSS) test. The HSS strength decreased with increasing the MTO of the electroless Ni bath. The brittle fracture increased with increasing the shear speed of the HSS test. The percentage of the brittle fracture for the 3 MTO sample was much higher than that for the 0 MTO sample.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.708-711
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• 1999

The Cu/Ni/Au lamellar structure is extensively used as an under bump metallization on silicon file, and on printed circuit board(PCB) pads. Ni is plated Cu by either electroless Ni plating, or electrolytic Ni plating. Unlike the electrolytic Ni plating, the electroless Ni plating does not deposit pure Ni, but a mixture of Ni and phosphorous, because hypophosphite Is used in the chemical reaction for reducing Ni ions. The fracture crack extended at the interface between solder balls of plastic ball grid (PBGA) package and conducting pads of PCB. The fracture is duets to segregation at the interface between Ni$_3$Sn$_4$intermetallic and Ni-P layer. The XPS diffraction results of Cu/Ni/Au results of CU/Ni/AU finishs showed that the Ni was amorphous with supersaturated P. The XPS and EDXA results of the fracture surface indicated that both of the fracture occurred on the transition lesion where Sn, P and Ni concentrations changed.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.2266-2268
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• 2000

본 논문에서는 스캐닝 미러의 일종으로, 광저장 장치의 픽업헤드용으로 미세회전을 하면서 레이저 빔을 편향시키는 용도로 사용되는 미러를 제작하고 구동실험을 하였다. 제작된 미러의 크기는 $2400{\times}2400{\times}64{\mu}m^3$이고, 빔 스프링은 $500{\times}9.6{\times}64{\mu}m^3$이다. 니켈 전해 도금으로 29${\mu}m$ 높이의 구동 전극을 제작하였고(세가지 모델: 공기통로가 없는 전극, 공기통로와 간격이 각각 200${\mu}m$인 전극, 공기통로와 간격이 각각 100${\mu}m$인 전극), 미러판과 전극을 조립하여(미러판과 전극 사이의 간격은 각각 29${\mu}m$, 26${\mu}m$, 26${\mu}m$) 구동실험을 하였다. 공진 주파수의 계산간은 576Hz, 측정값은 3개의 미러에서 모두 568Hz이었다. 전극과 미러판의 간격이 최대 접근거리 18${\mu}m$가 되도록 미세 회전을 시켰을 때, 공기통로가 없는 전극에서는 공진 주파수가 524Hz, 공기통로가 200${\mu}m$인 전극에서는 544Hz로 각각 감쇠되었고, 공기통로가 100${\mu}m$인 전극에서는 그대로 568Hz이었다.