• Magazine of the Korea Concrete Institute
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• 제11권2호
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• pp.221-230
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• 1999

Corrosion of rebars can occur if there are cracks, moisture and availability of oxygen or carbonation proceeds, chloride penetrates and diffuses in concrete. Once rebars in concrete corrodes, subsequently accompanied with scaling, spalling in concrete cover. As a result of them, the RC structure is seriously deteriorated. In this study, theoretical review and experiments for cathodic protection(CP) have been performed to control corrosion of rebars in concrete contained chlorides and pre-crack. For CP the impressed current system was applied, the protection effect was investigated when rebars was directly contacted with salt water due to crack and open to much chlorides in concrete. In order to investigate the effect of protection, when CP was energized for 1 year, half-cell potential, potential-decay with current density, corrosion ratio, etc. were measured. With the cathodic protection by impressed current system, the depolarized values of all specimen were met NACE Standard, the effect of 34~84% of the ratio of corrosion area and 84~86% of cross-section reduction were calculated.

• Economic and Environmental Geology
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• 제46권5호
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• pp.445-453
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• 2013

The Uiseong Tapriri Five-Storied Stone Pagoda (National Treasure No. 77) is typical stone cultural heritage in Unified Silla Dynasty, Korea. The pagoda has been occurred black, brown discoloration and microcrack, exfoliation, granularity decomposition with white discoloration because of continuous weathering. As the results of analysis for the contaminants, chemical weatherings are generated that black contaminant by manganese oxide, brown contaminant by iron oxide, white contaminants by gypsum and taranakite. And physical weatherings, such as microcrack, exfoliation, are occurred by salt(gypsum) crystallization. Therefore, these need to remove the contaminants according to the conservation treatment manual, and regular monitoring using P-XRF to preserve long-term the Five-Storied Stone Pagoda at Tapri-ri, Uiseong.

• Polymer(Korea)
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• 제24권4호
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• pp.571-577
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• 2000

A new type of filler for epoxy-clay nanocomposites has been prepared by the reaction of octadecyltrimethylammonium bromide and layered sodium montmorillonite (MMT) via an ion-exchange reaction. The gallery space was further modified by grafting the aminopropyl groups via a reaction between a octadecyltrimethylammonium-MMT and 3-aminopropyltriethoxysilane (APS). The interlayer modification of MMT was confirmed by XRD, IR, and solid-state $^{29}$ Si CP/MAS NMR. Furthermore, clay-polymer nanocomposites have been synthesized by the polymerization of diglycidyl ether of bisphenol A(DGEBA) and $C_{18}$ H$_{37}$ N($CH_3$)$_3$-APS-MMT. The resulting hybrid nanocomposites were characterized by XRD, transmission electron microscopy (TEM) and scanning electron microscopy (SEM). The results proved that the organomontmorillonite could be exfoliated and uniformly dispersed in the epoxy matrix.

• Proceedings of the Materials Research Society of Korea Conference
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• 한국재료학회 2003년도 춘계학술발표강연 및 논문개요집
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• pp.200-200
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• 2003

고체산화물 연료전지(SOFC)에서 사용되는 연결재의 주 기능은 각 단위 셀의 연료극과 다음 셀의 공기극을 전기적으로 연결하여, 공기와 사용연료의 분리역할을 하기 위하여 사용된다. SOFC용 연결재는 다른 구성요소 소재보다, 높은 전자 전도성, 낮은 이온전도성, 우수한 기계 적강도가 요구되며, SOFC는 고온에서 작동되기 때문에, 상온에서 작동온도까지 다른 요소 소재들과 유사한 열팽창계수와 물리, 화학적으로 안정성이 요구된다. 현재 연결재 제조기술은 EVD, CVD, plasma spraying, tape casting 등 다양하게 연구되고 있으며, 본 연구는 세라믹 연결재 증착방법 중 저렴한 비용으로 대량 생산이 용이한 습식법(dip coaling)을 적용하여, 연료극 지지체식 flat-tube형 고체산화물 연료전지의 지지체를 위해 세라믹 연결재를 제조하고, 그 특성을 연구하였다. 세라믹 연결재로써 선정한 합성조성은 LaCr $O_3$에 Ca이 치환 고용된 L $a_{0.6}$C $a_{0.41}$Cr $O_3$으로 pechini법으로 합성하였다. 합성된 조성은 100$0^{\circ}C$에서 5시간 하소후 가속 Ball Milling하여 0.5$\mu\textrm{m}$의 평균입자크기를 얻을 수 있었다. XRD 상분석결과 perovskite상 (L $a_{1-x}$ Ca/x/Cr $O_3$)과 CaCr $O_4$를 얻을 수 있었다. slurry를 제조하여 막의 밀착성을 증진시키기 위해 sand blasting시킨 flat tube지지체에 진공펌프를 이용하여 소재내부와 외부의 압력차로 dip coating한 후, 140$0^{\circ}C$로 소결 하였다. coating 결과 박리현상은 없었으나, 표면과 단면의 SEM분석결과 다소 porous한 박막층이 형성되었으며, Ca이온이 지지체로 permeation되는 현상이 발생하였다. 이와 같은 결과로부터 보다 치밀한 박막생성을 위해, slurry 제조조건을 변화시켰으며, Ca이온의 migration을 막기 위해 barrier layer를 이용하였다 완전 소결된 지지체는 가스투과도와 전기전도도측정을 통하여 특성을 평가하였다.였다.다.

• Transactions of the Korean Society of Mechanical Engineers B
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• 제41권10호
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• pp.659-665
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• 2017

When an electrically conducting fluid flows through a staggered tube bank, the heat transfer and fluid flow features are changed by the externally introduced magnetic field. This study provides a numerical investigation of this phenomenon. Heat and fluid flows are investigated for unsteady laminar flows at Reynolds numbers of 50 and 100 with the Hartmann number gradually increasing from zero to 100. As the Hartmann number increases, and owing to the effects of the introduced magnetic field, the velocity boundary layer near the tube wall is thinned, the flow separation is delayed downstream, and the shrinkage of a recirculation zone formed near the rear side is observed. Based on these thermo-fluid deformations, the resulting changes in the local and average Nusselt number are investigated.

• 한국방재학회:학술대회논문집
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• 한국방재학회 2011년도 정기 학술발표대회
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• pp.154-154
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• 2011

최근 세계 각지에서 발생하는 대규모 터널 화재사고는 많은 사상자를 동반하고 이에 따른 경제적, 사회적 손실 또한 방대하게 진행되는 실정이다. 터널 구조물의 화재 특성상 외부에 쉽게 노출되지 않기 때문에 화재 발생 시 화재에 노출된 표층이 박리되거나 비산해서 단면결손이 생기는 폭렬 현상(explosive spalling)이 발생하게 된다. 이러한 폭렬 현상은 붕괴와 같은 대형 참사로 이어질 가능성이 크다. 따라서 본 연구에서는 터널 내 화재 발생 시 콘크리트 구조물의 폭렬에 의한 붕괴를 예방하기 위하여 이액형 상온경화 실리콘 고무와 인체에 무해한 친환경 첨가제인 펄라이트를 일정한 혼합비(5wt%, 10wt%, 15wt%, 20wt%)로 혼합하여 고성능 난연 복합체를 제조하고, 열적 특성과 난연 특성을 연구를 진행하였다. 열적 특성에 관한 시험으로 TGA를 측정하였으며, 난연 특성에 관한 시험으로는 화염 시험, 내화로 시험, 탄화로 시험을 진행하였다. 우선 TGA 시험은 $20^{\circ}C/min$ 승온 속도로 $800^{\circ}C$까지 실험을 하였고, 화염 시험은 제작한 시편과 gas torch($1200^{\circ}C$)의 화염 거리를 약 10cm로 하여 약 1시간 동안 시험을 하였다. 내화로 시험은 내화로 장치를 이용하여 RABT curve(5분만에 $1200^{\circ}C$도달 후 한 시간 동안 유지 후 냉각, 총 시험 시간 180분) 조건을 만족하는 환경에서 제작한 시편을 콘크리트에 부착하여 콘크리트의 내부온도를 측정하였다. 탄화로 시험은 탄화로 장치를 이용하여 $2^{\circ}C/min$ 승온속도로 $900^{\circ}C$까지 실험을 하여 외부 형태 변화를 관찰하였다. 각각의 시험 결과 TGA 열분해 결과 순수한 실리콘 고무보다 난연제인 펄라이트를 첨가했을 때 더 높은 온도에서 초기 분해 거동을 보였으며, 최종 잔류량은 80%를 보였고, 5 wt%의 펄라이트가 혼합된 시편의 최종 잔류량이 높은 것으로 보아 열분해에 가장 강한 조성임을 알 수 있었다. 화염 시험 결과 펄라이트가 혼합된 모든 시편에서 $300^{\circ}C$가 넘지 않은 결과를 보였다. 이는 제조된 복합체가 화염에 직접적으로 장시간 노출이 되어도 안전하다는 것을 알 수 있다. 내화로 및 탄화로 시험 결과 펄라이트가 15wt%와 20wt%가 첨가된 시편들보다 5wt%와 10wt% 첨가된 시편들이 고온에서 안정하다는 것을 보였다.

• Journal of the Microelectronics and Packaging Society
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• 제14권4호
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• pp.49-56
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• 2007

Effects of post-baking treatment conditions on the interfacial adhesion between electroless plated Ni and polyimide film were evaluated using $180^{\circ}C$ peel test. Measured peel strength values monotonically decrease from $38.6{\pm}1.1g/mm\;to\;26.8{\pm}2.2g/mm$ for the variations of post-baking treatment temperatures from $80^{\circ}C\;to\;180^{\circ}C$, respectively. Wet chemical treatment on the polyimide surface produces carboxyl and amide functional groups on the surface which is closely related to the change in interfacial adhesion between electroless Ni and polyimide films. It is speculated that interfacial adhesion seems to be controlled by carbonyl oxygen bonding near cohesive failure region during post-baking treatment.

• Journal of the Microelectronics and Packaging Society
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• 제18권2호
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• pp.29-33
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• 2011

Research about the geometry design of lead pin was carried based on the normal or shear stress of the interface between a lead pin and a PCB in terms of delamination failure. The taguchi method with four design factors of three levels and FEA(Finite element Analysis) are carried under $20^{\circ}$ bending and 50 ${\mu}m$ tension of lead pin. The contact width, d2, between head round and copper pad in PCB is the highest affection factor among design factors by analysis of contribution analysis. Equivalent von Mises stress of 18.7% reduction design is obtained by the parameter design of the taguchi method. Maximum normal stress occurred at contact position between solder outer surface and a Cu pad in PCB. Also, maximum shear stress happened at contact position between solder outer surface and SR layer of PCB. From these calculated results, delamination of the PGA package may be occurred from outer interface of solder to inner interface of solder.

• Journal of the Microelectronics and Packaging Society
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• 제27권3호
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• pp.89-93
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• 2020

Complex warpage behavior of the electronic packages causes internal stress so many kinds of mechanical failure occur such as delamination or crack. Efforts to predict the warpage behavior accurately in order to prevent the decrease in yield have been approached from various aspects. For warpage prediction, silicon is generally treated as a homogeneous material, therefore it is described as showing no warpage behavior due to thermal loading. However, it was reported that warpage is actually caused by residual stress accumulated during grinding and polishing in order to make silicon wafer thinner, which make silicon wafer inhomogeneous through thickness direction. In this paper, warpage behavior of the single-side polished wafer at solder reflow temperature, the highest temperature in packaging processes, was measured using 3D digital image correlation (DIC) method. Mechanism was verified by measuring coefficient of thermal expansion (CTE) of both mirror-polished surface and rough surface.

• Proceedings of the Korea Concrete Institute Conference
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• 한국콘크리트학회 2008년도 추계 학술발표회 제20권2호
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• pp.935-940
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• 2008

When reinforced concrete is subjected to high temperature as in fire, there is deterioration in its properties of particular importance are loss in compressive strength, cracking and spalling of concrete, destruction of the bond between the cement paste and the aggregates and the gradual deterioration of the hardend cement paste. Assessment of fire-damaged concrete usually starts with visual observation of color change, cracking and spalling of the surface. In this paper, it was reported the trends of research and practical use on the Explosive Spalling Properties and Performance Based of Structural Design of the High-Strength Concrete.