• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.6
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• pp.2463-2469
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• 2011

The failure of display modules in cellular phones due to drop impact depends on the materials, stiffnesses and shapes of the phones. In the early development stage of cellular phones, the behavior of the display modules due to drop impact is tested using jigs where the display modules are installed. In this study, jigs of cellular phones for drop impact test of OLED modules were designed. The material, thickness and number and orientation of ribs were considered as design variables. Jigs were designed in a way that responses of modules due to drop impact were similar to those of modules in cellular phones. The maximum principal stresses at the upper glasses of modules were considered as responses, which were analyzed using a commercial software ABAQUS/Explicit. The drop impact analysis at the height of 1.5 meters showed that the responses of OLED module in the developed jig were in a good agreement with those in cellular phone.

• Corrugated packaging logistics
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• v.8 no.39
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• pp.102-106
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• 2001

• Journal of the Computational Structural Engineering Institute of Korea
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• v.18 no.4 s.70
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• pp.373-383
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• 2005

The cask is used to transfer the radioactive material in various fields required to withstand hypothetical accident condition such as 9m drop impact in accordance with the requirement of the domestic requlations and IAEA. So far the impact force has been obtained by the finite element method with complex computational procedure. In this study, the dynamic impact response of the cask body is analyzed using the mode superposition method, and the analysis method is proposed. The results we also validated by comparing with previous experimental results and finite element analysis results. The present method Is simpler than finite element method and can be used to predict the global impact response of cask

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.8
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• pp.971-976
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• 2011

This paper presents the design concepts of a protector for a launch-reconnaissance robot that is to be deployed for data-collection in hazardous regions. The protector protects the reconnaissance robot inside from shock induced during the process of launch, flight, and landing. Since the outer shells of the protector are automatically opened wide by the unlocking mechanism during the landing stage, the reconnaissance robot can easily exit the protector and move around to carry out its mission. We carefully simulated a finite-element model of the protector with the robot and compared the results with the actual dynamic behavior of the system. Shock- response tests using a droptable showed that the proposed protector filled with silicon material successfully attenuated external shock.

• Aerospace Engineering and Technology
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• v.3 no.2
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• pp.191-196
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• 2004

Most of studies for landing gear have been performed to analyze the shock absorbing characteristics of oleo-pneumatic struts. But it is not easy to solve the dynamic specific properties of spring type composite landing gear using a present method. The shock absorbing abilities of oleo-pneumatic landing gear strut are under influence of the internal design method on the strut rather than the landing gear structure itself. Unlike oleo type, spring type composite strut absorbs the shock with structural strength and dynamic characteristics of the strut's material and shape. The tests and analysis for the shock absorbing rate and dynamic behavior of the spring type composite fixed landing gear for 4 seats small aircraft, have been performed using landing gear drop test rig.

• 한국방재학회:학술대회논문집
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• 2010.02a
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• pp.39.1-39.1
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• 2010

본 연구에서는 정하중 및 충격하중 하에서 FRP(fiber reinforced polymer) sheet의 보강 성능을 평가하기 위해 섬유와 레진의 종류, sheet 종류, 보강 방법에 따른 휨 실험을 실시하였다. 이를 위해 GFRP와 CFRP, AFRP sheets로 보강된 $100{\times}100{\times}400mm$ 각주형 콘크리트 공시체의 하면 보강, 중앙 U형 스트립, 그라고 이 둘을 동시에 보강한 시험체를 제작하였고, 정하중 휨 실험과 낙하식 충격하중 실험을 실시하였다. 정하중 실험에서 중앙부 U형 스트립으로 보강한 시험체는 섬유의 방향과 균열의 진전 방향이 일치하여 보강효과가 거의 없었지만 CFRP와 AFRP로 하면 및 이중 보강한 시험체는 높은 휨성능을 보였다. 반면 충격하중 실험에서는 중앙부 U형 스트립 보강이 다소 성능을 향상 시켰고, 하면 및 이중 보강한 시험체는 큰 변형과 높은 에너지 소산 능력을 보였다.

• The Journal of the Acoustical Society of Korea
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• v.30 no.2
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• pp.92-99
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• 2011

In Japan, bang machine has been considered to have problems about not only the impact force and frequency response which are different from the real impact sources such as children's jumping and running, but also damage in the wooden structure housing. Therefore, a new impactor for lower impact force to prevent demage in wooden structure housing was developed. The impact ball was adopted as the second standard impact source in JIS A 1418-2 and ISO 140-11. In the present study, floor impact sounds generated by impact ball with drop heights in four floors of mock-up building of Building Research Institute (BRI) similar to typical Japanese wooden structure housing were investigated and also compared to jumping sound. The results show that Impact ball sound dropped at 10 cm to 30 cm was most similar to jumping sound. And The impact sound levels at 250 and 500 Hz were more sensitive to drop height than other lower frequencies. The error that may occur from the difference of height of 10 cm up and down based on the standard drop height caused by the impact ball operated by human hands was approx. 1 dB or less only in its value of characteristic, but it must be carefully taken into Impact ball in the Korea Standard.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.11-17
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• 2009

The drop impact reliability comes to be important for evaluation of the life time of mobile electronic products such as cellular phone. The drop impact reliability of solder joint is generally affected by the kinds of pad and reflow number, therefore, the reliability evaluation is needed. Drop impact test proposed by JEDEC has been used as a standard method, however, which requires high cost and long time. The drop impact reliability can be indirectly evaluated by using high speed shear test of solder joints. Solder joints formed on 3 kinds of surface finishes OSP (Organic Solderability Preservation), ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) was investigated. The shear strength was analysed with the morphology change of intermetallic compound (IMC) layer according to reflow number. The layer thickness of IMC was increased with the increase of reflow number, which resulted in the decrease of the high speed shear strength and impact energy. The order of the high speed shear strength and impact energy was ENEPIG > ENIG > OSP after the 1st reflow, and ENEPIG > OSP > ENIG after 8th reflow.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.10
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• pp.99-108
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• 2007

As the structure of a mobile phone becomes thin to catch up with a slim product trend, the reliability of a LCD module is on the rise as a big issue for a product design. A drop test is the most basic and important verification method for a mechanical quality control but it requires much time and cost during a product development process. Thus many manufacturers have considered design guide lines using CAE and simulation for more effective usage of limited resources on the market. In this paper, the Maximum Principle Stress of a LCD glass panel is calculated on the basis of explicit FE Analyses method and input conditions are determined according to the general test standard. The design guideline for reliability improvements are suggested on the basis of the results of FE Analysis.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.21-27
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• 2007

Nickel bumps for ACF(anisotropic conductive film) flip chip application were fabricated by electroless and electro plating and their mechanical properties and impact reliability were examined through the compressive test, bump shear test and drop test. Stress-displacement curves were obtained from the load-displacement data in the compressive test using nano-indenter. Electroplated nickel bumps showed much lower elastic stress limits (70MPa) and elastic moduli ($7.8{\times}10^{-4}MPa/nm$) than electroless plated nickel bumps ($600-800MPa,\;9.7{\times}10^{-3}MPa/nm$). In the bump shear test, the electroless plated nickel bumps were deformed little by the test blade and bounded off from the pad at a low shear load, whereas the electroplated nickel bumps allowed large amount of plastic deformation and higher shear load. Both electroless and electro plated nickel bumps bonded by ACF flip chip method showed high impact reliability in the drop impact test.