• Title/Summary/Keyword: 나노 채널 구조

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A Study on Inductive Power Line Communication with Metal Block Channel (금속블록 채널이 있는 유도형 전력선통신에 관한 연구)

  • Sohn, Kyung-Rak;Kim, Hyun-Sik
    • Journal of IKEEE
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    • v.25 no.1
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    • pp.95-100
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    • 2021
  • If we know the location of the hull block and the welding feeder in the shipyard, we can easily obtain the location information of the worker. That data is very useful for implementing a workplace safety monitoring system. However, it is difficult to apply a fixed communication network to the workplace due to the specificity of the hull structure and welding process. In this study, inductive power line communication, which can replace dedicated communication line, was reviewed. A ferrite core was used as an inductive coupler to be installed on the power cable of the welding machine, and a nano-crystalline core was applied as a coupler to be fastened to the support rod of the metal block. In order to visualize the operating principle of the proposed couplers, 3D modeling and finite element analysis were performed with the COMSOL AC/DC module. In the communication performance test using an aluminum profile, when the communication channel was formed by the contact of the welding electrode, the bandwidth was kept above 6 Mbps.

Fabrication of Multi-Fin-Gate GaN HEMTs Using Honeycomb Shaped Nano-Channel (벌집구조의 나노채널을 이용한 다중 Fin-Gate GaN 기반 HEMTs의 제조 공정)

  • Kim, Jeong Jin;Lim, Jong Won;Kang, Dong Min;Bae, Sung Bum;Cha, Ho Young;Yang, Jeon Wook;Lee, Hyeong Seok
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.33 no.1
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    • pp.16-20
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    • 2020
  • In this study, a patterning method using self-aligned nanostructures was introduced to fabricate GaN-based fin-gate HEMTs with normally-off operation, as opposed to high-cost, low-productivity e-beam lithography. The honeycomb-shaped fin-gate channel width is approximately 40~50 nm, which is manufactured with a fine width using a proposed method to obtain sufficient fringing field effect. As a result, the threshold voltage of the fabricated device is 0.6 V, and the maximum normalized drain current and transconductance of Gm are 136.4 mA/mm and 99.4 mS/mm, respectively. The fabricated devices exhibit a smaller sub-threshold swing and higher Gm peak compared to conventional planar devices, due to the fin structure of the honeycomb channel.

Fabrication of Nano-Channeled Tin Oxide Film Electrode and Evaluation of Its Electrochemical Properties (나노 채널 구조를 가진 산화 주석 박막 전극 제조 및 전기화학적 특성 평가)

  • Park, Su-Jin;Shin, Heon-Cheol
    • Korean Journal of Materials Research
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    • v.22 no.1
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    • pp.1-7
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    • 2012
  • Thin film electrode consisting purely of porous anodic tin oxide with well-defined nano-channeled structure was fabricated for the first time and its electrochemical properties were investigated for application to an anode in a rechargeable lithium battery. To prepare the thin film electrode, first, a bi-layer of porous anodic tin oxides with well-defined nano-channels and discrete nano-channels with lots of lateral micro-cracks was prepared by pulsed and continuous anodization processes, respectively. Subsequent to the Cu coating on the layer, well-defined nano-channeled tin oxide was mechanically separated from the specimen, leading to an electrode comprised of porous tin oxide and a Cu current collector. The porous tin oxide nearly maintained its initial nano-structured character in spite of there being a series of fabrication steps. The resulting tin oxide film electrode reacted reversibly with lithium as an anode in a rechargeable lithium battery. Moreover, the tin oxide showed far more enhanced cycling stability than that of powders obtained from anodic tin oxides, strongly indicating that this thin film electrode is mechanically more stable against cycling-induced internal stress. In spite of the enhanced cycling stability, however, the reduction in the initial irreversible capacity and additional improvement of cycling stability are still needed to allow for practical use.

Analysis of the MOSFET Transport Characteristics using MicroTec Tool (MicroTec을 이용한 MOSFET 전송 특성 분석)

  • Han, Ji-Hyung;Jung, Hak-Kee;Lee, Jae-Hyung;Jeong, Dong-Soo;Lee, Jong-In;Kwon, Oh-Shin
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2008.10a
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    • pp.596-599
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    • 2008
  • 본 연구에서는 MicroTec을 이용하여 MOSFET 전송 특성을 분석하였다. MicroTec의 Semsim은 디바이스 시뮬레이터로써 입력 바이어스에 의해 공정 시뮬레이션인 SiDif와 디바이스 조립인 MergIC에 의해 소자를 시뮬레이션 한다. 소자에 대한 스케일링은 정전압 스케일링을 사용하였고, 채널의 길이는 100nm, 50nm, 25nm로 변화하면서 비교 분석하였다. MicroTec의 이동도 모델중 Lombardi, Constant, Yamaguchi 모델을 선택하여 이동도 모델을 비교하였다. 전류-전압 특성 곡선을 비교하였을때 Lombardi 모델과 Yamaguchi 모델보다 Constant 모델에서 결과값이 높게 나타는 것을 알 수 있었다. 또한 MicroTec의 유용성을 조사하여 시뮬레이터로서 적합함과 나노구조 소자의 스케일링 이론의 적합함을 보았다.

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Charge trap flash 메모리 소자의 셀 간 간격의 변화에 따른 셀 사이의 간섭 현상

  • Park, Hun-Min;Jang, Sang-Hyeon;Yu, Ju-Hyeong;Kim, Tae-Hwan
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.194-194
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    • 2010
  • Charge trap flash (CTF) 구조를 가진 플래시 메모리 소자는 기존의 플래시 메모리 소자에 비해 쓰고 지우는 속도가 빠르고, 데이터의 저장 기간이 길며, 쓰고 지우는 동작에 의한 전계 스트레스에 잘 견디는 장점을 가지고 있다. 이러한 장점에도 불구하고 CTF 플래시 메모리에서도 수십 나노 이하로 소자의 셀 사이즈가 감소함에 따라 단 채널 효과, 펀치스루 현상 및 셀 사이의 간섭현상이 발생함에 따라 이러한 문제들을 해결해야 한다. 인접한 셀 사이에 발생하는 간섭 현상에 대해선 플로팅 게이트를 사용한 플래시 메모리 소자에 대하여 많은 연구가 진행되었으나, CTF 플래시 메모리 소자에서 나타나는 셀 사이의 간섭현상에 대한 연구는 만히 진행되어 있지 않다. 본 연구에서는 CTF 플래시 메모리 소자의 셀 사이의 간격이 작아짐에 따라 발생하는 인접한 셀 간의 간섭 현상에 대해 관찰하였다. CTF 플래시 메모리 소자의 셀 사이의 간격에 따른 비교를 위하여 각 소자의 셀을 구성하는 터널링 산화막, 질화막 및 블로킹 산화막의 두께를 동일하게 하였다. 각 셀 사이의 간격이 감소함에 따라 발생하는 소자의 전기적 특성을 TCAD 시뮬레이션 툴인 Sentaurus를 사용하여 계산하였다. 인접한 셀의 상태에 따라 발생하는 간섭 효과를 확인하기 위해 word line (WL)과 bit line (BL) 방향에 있는 주변 셀의 프로그램 상태에 따른 선택한 셀의 문턱전압이 변화 정도를 관찰하였다. 시뮬레이션 결과는 셀 사이의 간섭효과가 WL 방향에 의한 간섭 현상보다 BL 방향에 의한 간섭 현상보다 크다. 시뮬레이션한 전류-전압 특성 결과는 CTF 플래시 메모리 소자가 비례 축소할 때 인접하는 셀 사이에 간격이 15 nm 이하로 줄어들 경우에 간섭 현상이 급격히 증가하였다.

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MXene Based Composite Membrane for Water Purification and Power Generation: A Review (정수 및 발전을 위한 맥신(MXene) 복합막에 관한 고찰)

  • Seohyun Kim;Rajkumar Patel
    • Membrane Journal
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    • v.33 no.4
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    • pp.181-190
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    • 2023
  • Wastewater purification is one of the most important techniques for controlling environmental pollution and fulfilling the demand for freshwater supply. Various technologies, such as different types of distillations and reverse osmosis processes, need higher energy input. Capacitive deionization (CDI) is an alternative method in which power consumption is deficient and works on the supercapacitor principle. Research is going on to improve the electrode materials to improve the efficiency of the process. A reverse electrodialysis (RED) is the most commonly used desalination technology and osmotic power generator. Among many studies conducted to enhance the efficiency of RED, MXene, as an ion exchange membrane (IEM) and 2D nanofluidic channels in IEM, is rising as a promising way to improve the physical and electrochemical properties of RED. It is used alone and other polymeric materials are mixed with MXene to enhance the performance of the membrane further. The maximum desalination performances of MXene with preconditioning, Ti3C2Tx, Nafion, and hetero-structures were respectively measured, proving the potential of MXene for a promising material in the desalination industry. In terms of osmotic power generating via RED, adopting MXene as asymmetric nanofluidic ion channels in IEM significantly improved the maximum osmotic output power density, most of them surpassing the commercialization benchmark, 5 Wm-2. By connecting the number of unit cells, the output voltage reaches the point where it can directly power the electronic devices without any intermediate aid. The studies around MXene have significantly increased in recent years, yet there is more to be revealed about the application of MXene in the membrane and osmotic power-generating industry. This review discusses the electrodialysis process based on MXene composite membrane.

Electrical Properties of Two-dimensional Electron Gas at the Interface of LaAlO3/SrTiO3 by a Solution-based Process (용액 공정을 통해 제조된 LaAlO3/SrTiO3 계면에서의 이차원 전자 가스의 전기적 특성)

  • Kyunghee Ryu;Sanghyeok Ryou;Hyeonji Cho;Hyunsoo Ahn;Jong Hoon Jung;Hyungwoo Lee;Jung-Woo Lee
    • Journal of the Microelectronics and Packaging Society
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    • v.31 no.1
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    • pp.43-48
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    • 2024
  • The discovery of a two-dimensional electron gas (2DEG) at the interface of LaAlO3 (LAO) and SrTiO3 (STO) substrates has sparked significant interest, providing a foundation for cutting-edge research in electronic devices based on complex oxide heterostructures. However, conventional methods for producing LAO thin films, typically employing techniques like pulsed laser deposition (PLD) within physical vapor deposition (PVD), are associated with high costs and challenges in precisely controlling the La and Al composition within LAO. In this study, we adopted a cost-effective alternative approach-solution-based processing-to fabricate LAO thin films and investigated their electrical properties. By adjusting the concentration of the precursor solution, we varied the thickness of LAO films from 2 to 65 nm and determined the sheet resistance and carrier density for each thickness. After vacuum annealing, the sheet resistance of the conductive channel ranged from 0.015 to 0.020 Ω·s-1, indicating that electron conduction occurs not only at the LAO/STO interface but also into the STO bulk region, consistent with previous studies. These findings demonstrate the successful formation and control of 2DEG through solution-based processing, offering the potential to reduce process costs and broaden the scope of applications in electronic device manufacturing.

Development of a general purpose molecular simulation system from microscopic to mesoscopic scales (미시영역에서 중간역역까지 적용 가능한 범용 분자 시뮬레이션 시스템의 개발)

  • Oh, Kwang-Jin
    • The KIPS Transactions:PartD
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    • v.12D no.6 s.102
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    • pp.921-930
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    • 2005
  • In this paper, a general purpose molecular simulation system which has been developed by the author, are described. One of the most advantageous features is that the molecular simulation system can handle a coarse-grained model as well as an all-atom mode. Therefore, we can simulate mesoscopic phenomena as well as microscopic phenomena with the help of Langevin dynamics simulation and dissipative particle dynamics simulation techniques. Thus we could study anesthesia, protein folding, biopolymer flow in microchannel with single framework, which spans from microscopic to mesoscopic scales. We expect that we can also simulate many other bio/nano systems of technological importance which are not feasible by means of molecular dynamics simulation technique. Finally, performance data are shown and a bottleneck is identified for future optimization.

Steep subthreshold slope at elevated temperature in junctionless and inversion-mode MuGFET (고온에서 무접합 및 반전모드 MuGFET의 문턱전압 이하에서 급격히 작은 기울기 특성)

  • Lee, Seung-Min;Park, Jong-Tae
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.17 no.9
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    • pp.2133-2138
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    • 2013
  • In this paper, the variation of a steep subthreshold slope at elevated temperature in nanowire n-channel junctionless and inversion mode MuGFETs has been compared. It has been observed that the subthreshold slopes are increased with the increase of the operation temperature in junctionless and inversio-mode transistors. The variation of a subthreshold slope with operation temperature is more significant in junctionless transistor than inversion-mode transistor. The temperature dependence on the variation of a subthreshold slope for different fin widths shows a similar behavior regardless of fin width. From the temperature dependence on the variation of a subthreshold slope for different substrate biases, it has been observed that the variation of a subthreshold slope is less significant when the substrate bias was applied. It is worth noting that one can achieve a subthreshold slope of below 41mV/dec at elevated temperature of 400K using the junctionless MuGFETs with a positive substrate bias.

Comparative Analysis of PBTI Induced Device Degradation in Junctionless and Inversion Mode Multiple-Gate MOSFET (PBTI에 의한 무접합 및 반전모드 다중게이트 MOSFET의 소자 특성 저하 비교 분석)

  • Kim, Jin-Su;Hong, Jin-Woo;Kim, Hye-Mi;Lee, Jae-Ki;Park, Jong-Tae
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.17 no.1
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    • pp.151-157
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    • 2013
  • In this paper, a comparative analysis of PBTI induced device degradation in nanowire n-channel junctionless and inversion mode Multiple-Gate MOSFET(MuGFETs) has been performed. It has been observed that the threshold voltage is increased after PBTI stress and the threshold voltage variation of junctionless device is less significant than that of inversion mode device. However the degradation rate of junctionless device is less significant than that of inversion mode device. The activation energy of the device degradation is larger in inversion mode device than junctionless device. In order to analyze the more significant PBTI induced device degradation in inversion mode device than junctionless device, 3-dimensional device simulation has been performed. The electron concentration in inversion mode device is equal to the one in junctionless device but the electric field in inversion mode device is larger than junctionless device.