• Journal of Conservation Science
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• v.37 no.5
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• pp.525-535
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• 2021

This study identified material properties through scientific analysis on Jikgeumdan(satin with gold threads) from Donggungbi-Wonsam and the gold threads used in the embroidery. The Donggungbi-Wonsam's base of gold threads were estimated to have used mulberry fiber's Korean paper(Hanji) because non-wood-based fibers were observed. The X-ray spectrometer showed that the Tongsuseulan of Donggungbi-Wonsam was a flat gold thread of pure gold and Jikgeumdan of flat silver thread of its Saekdong and Hansam. High sulfur levels were detected in the flat silver thread, which appeared to have formed silver sulfide by either manufacturing process using sulfur or conservation environment. he dragon insignia's embroidery is also described as two types twisted gold threads; pure gold and alloying-gold and silver. while dragon insignia's border line is decorated with a twisted gold thread of pure gold. In particular, it was investigated that adhesives such as an animal glue, a protein-based compound by gas chromatography mass spectrometry. Additionally, XRF and Raman spectroscopy analysis on the mixture substances between the metal surface and the base paper of gold threads identified talc and quartz in the gold threads and Seokganju(hematite) in the flat silver threads.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.2
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• pp.527-534
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• 2019

Japanese sumac (Rhus javanica) is one of the common herbaceous plants growing over the country. This study was conducted to investigate the extraction characteristics and physiological activities inluding nitrite scavenging ability of the water extracts from leaf, fruit and bark of Japanease sumac. Extraction yield was 6.62~13.84%, free amino acids were detected as 24 kinds with 37.9 mg/100g in leaf extract, 23 kinds with 27.0 mg/100g in fruit extract and 27 kinds with 39.0 mg/100g in bark extract, respectively, and seven kinds essential amino acids were detected. Total contents of flavonoids equivalent to naringin were 587.2 mg/100g in bark extract, 557.3 mg/100g in fruit extract and 379.9 mg/100g in leaf extract, respectively. Total contents of phenolics equivalent to gallic acid were 111.2 mg/100g in leaf extract, 108.4 mg/100g in fruit extract and 80.4 mg/100g in bark extract, respectively. The nitrite scavenging ability of extracts was order of 61.93% in bark extract>57.38% in fruit extract>55.49% in leaf extract, and was 78.1~100% of those of BHT (butylated hydroxytoluene) equivalents at pH 1.2. The electron donating ability was order of 47.38% in fruit extract>43.06% in leaf extract>38.55% in bark extract, and was compared to 65.6%, 58.8% and 53.6% of those of BHT equivalents, respectively. The reduction power was evaluated to 37% higher in leaf extract, 43% higher in fruit extract and 46% higher in bark extract than those of BHT equivalents. The metal chelating ability of extracts was considerably low and was order of 27.3% in bark extract>20.6% in leaf extract>11.2% in fruit extract.

• Journal of the Korean Society of Radiology
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• v.13 no.3
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• pp.445-451
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• 2019

The fluorescence intensity and fluorescence lifetime of $Ba_2GdV_3O_{11}$, a vanadate compound based on $Ba^{2+}$ ion, were investigated by adding $Eu^{3+}$ as a rare earth ion which is an alkaline earth metal, which is distributed around active ions and has a large influence on fluorescent properties when used as a host in a phosphor. $Ba_2GdV_3O_{11}:Eu^{3+}$ phosphor was synthesized by solid state method and the crystallinity of the phosphor was confirmed by X - ray diffraction analysis. The fluorescence properties of the $Ba_2GdV_3O_{11}:Eu^{3+}$ phosphor were measured using optical and laser. The energy transfer and diffusion of the $Ba_2GdV_3O_{11}:Eu^{3+}$ phosphor are highly dependent on the concentration of $Eu^{3+}$. When the concentration of $Eu^{3+}$ is low, it shows strong fluorescence to the CT band. However, as the concentration of $Eu^{3+}$ increases, the fluorescence due to 4f - 4f transition is strong. The concentration of $Eu^{3+}$ ion increased and the energy between ions was diffused, and the lifetime of fluorescence decreased. Energy transfer occurs between two $Eu^{3+}$ ions at low $Eu^{3+}$ concentration and energy diffusion occurs at high $Eu^{3+}$ concentration.

• Journal of Life Science
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• v.29 no.2
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• pp.231-238
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• 2019

This study evaluated the antioxidant activity of the extract and fractions of Alnus firma. Alnus firma had the highest total phenolic content ($452.80{\pm}7.01{\mu}g$ gallic acid equivalents/mg) in a methanol (MeOH) fraction and the highest total flavonoid content ($112.29{\pm}11.14{\mu}g$ rutin equivalents/mg) and antioxidant capacity ($936.23{\pm}0.07{\mu}g$ ${\alpha}$-tocopherol equivalents/mg) in an ethylacetate (EA) fraction. The antioxidant activities of various solvent extract fractions of Alnus firma were evaluated using various antioxidant assays, including ${\beta}$-carotene-linoleate assay, reducing power assay, 1,1-diphenyl-2-picrylhydrazyl (DPPH) radical scavenging assay, metal chelating activity assay, superoxide anion radical scavenging assay, and lipid peroxidation inhibition assay using the ferric thiocyanate method. These activities were compared with those of ascorbic acid, butylated hydroxyanisole (BHA), gallic acid (GA), butylated hydroxytoluene (BHT), and ${\alpha}$-tocopherol. First, at a $250{\mu}g/ml$ concentration, the EA and MeOH fractions of A. firma showed 92.43% and 89.20% DPPH radical scavenging activity, respectively. Second, $50{\mu}g/ml$ of the EA fraction exhibited 72.49% superoxide anion radical scavenging activity, a little greater than the same dose of GA (60.88%). Finally, 0.5 and 1 mg/ml of the EA fraction showed 73.45% and 73.29% inhibition of peroxidation in the ${\beta}$-carotene-linoleic acid system, respectively. The decreasing order of reducing power was EA fraction > n-butanol (BuOH) fraction > dichloromethane (DCM) fraction > n-hexane (HX) fraction. The results obtained in the present study indicated that Alnus firma can be used as an easily accessible potential source of natural antioxidants.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.65-70
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• 2021

In this study, interfacial properties and mechanical properties of joints were reported after Cu pads finished with organic solderability preservative (OSP) on flame retardant-4 (FR-4) printed circuit board (PCB) and electronic components were joined with a Sn-57Bi-1Ag solder paste by using a laser bonding process. The laser bonding process was performed under various bonding conditions with changing a laser power and a bonding time and effects of bonding conditions on interfacial and mechanical properties of joints were analyzed. In order to apply for industry, properties of bonding joints using a reflow bonding process which are widely used were compared. When the laser bonding process were performed, we observed that Cu₆Sn₅ intermetallic compounds (IMCs) were fully formed at the interface although the bonding times were very short about 2 and 3 s. Furthermore, void formations of the joints by using the laser bonding process were suppressed at the joints with comparing to the reflow bonding process and shear strengths of bonding joints were higher than that by using the reflow bonding process. Therefore, in spite of a very short bonding time, it is expected that joints will be stably formed and have a high mechanical strength by using the laser bonding process.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.71-79
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• 2021

In this study, we have successfully fabricated the Sn-Ni paste and evaluated the bonding properties for high-temperature endurable EV (Electric Vehicle) power module applications. From evaluating of the micro-structural changes in the TLPS (Transient Liquid Phase Sintering) joints with Sn and Ni contents in the Sn-Ni pastes, a lack of Ni powders and Ni particle agglomerations by Ni surplus were observed in the Sn-20Ni and Sn-50Ni joints (in wt.%), respectively. In contrast, relatively dense microstructures are observed in the Sn-30Ni and Sn-40Ni TLPS joints. From differential scanning calorimetry (DSC) thermal analysis results of the fabricated Sn-Ni paste and TLPS bonded joints, we confirmed that the complete reactions of Sn with Ni to form Ni-Sn intermetallic compounds (IMCs) at bonding temperatures occurred, and there is no remaining Sn in the joints after TLPS bonding. In addition, the interfacial reactions and IMC phase changes of the Sn-30Ni joints under various bonding temperatures were reported, and their mechanical shear strength were investigated. The TLPS bonded joints were mainly composed of residual Ni particles and Ni₃Sn₄ intermetallic phase. The average shear strength tended to increase with increasing bonding temperature. Our results indicated a high shear strength value of approximately 30 MPa at a bonding temperature of 270 ℃ and a bonding time of 30 min.

• Applied Chemistry for Engineering
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• v.22 no.4
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• pp.367-375
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• 2011

Succinic acid ester derivatives have been used as additives for the base oil of metal working fluids and pressure working oils. In this paper, a series of succinic acid alkyl half-esters were synthesized with over 97% yields by ring-opening reaction of succinic anhydride and fatty alcohol and were soluble in 100 N base oil within 1 wt% concentration. The structures and purities of ester derivatives were confirmed by $^1H-NMR$ and FT-IR spectrum and GC analysis. Anti-corrosion properties of the esters in sea water were evaluated through ASTM D665 method and weight loss method and compared to that of succinic alkyl esters without carboxylic acid group in the molecule. As the results, anti-corrosion properties of succinic acid alkyl half-esters with carboxylic acid group were better than those of succinic acid alkyl esters without carboxylic acid group. And, Anti-corrosion properties of the esters with a shorter alkyl chain of high concentration showed better performance than those with longer alkyl chain of low concentration. Inhibition efficiency % (IE%) of the esters was over 95% in the concentration of 80 ppm and corrosion rate (CR) was below 0.3 mm/year at the same concentration. Thus, the corrosion properties of succinic acid alkyl half-esters result from the carboxylic acid groups in molecules.

• Korean Journal of Food Science and Technology
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• v.53 no.3
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• pp.252-259
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• 2021

Barley contains health-beneficial compounds, such as phenolic acids, flavonoids, lignans, and tocopherols. The antioxidant activities of pearled and wholegrain hull-less, premature, and black barley harvested in Jeju were investigated by measuring total phenolic content (TPC), total flavonoid content (TFC), phenolic compounds, tocopherols (T), and tocotrienols (T3), along with their in vitro antioxidant activities. Consequently, TPC and TFC in wholegrain barley groups were higher than those in pearled barley. Gallic acid (1.55-2.98 ㎍/g) and protocatechuic acid (0.67-2.84 ㎍/g) were the predominant phenolic compounds in barley. Total T and T3 concentrations of wholegrain barley groups were significantly higher than those of pearled barley (p<0.05). Except for the metal chelating effect and reducing power, the in vitro antioxidant activities of wholegrain barley were significantly higher than those of pearled barley. These results indicate that wholegrain Jeju barley can be used as a natural antioxidant source in the food industry.

• Journal of Korea Foundry Society
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• v.41 no.6
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• pp.535-542
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• 2021

In this study, to improve the interfacial bond strength of cast iron-aluminum dissimilar materials, graphite was removed to a certain depth from the cast iron surface through de-graphitization heat treatment. As the heat treatment time increased, the depth at which graphite was removed increased, showing a linear relationship between the heat treatment time and depth. Aluminum was filled to a certain depth on the de-graphitized cast iron surface through die-casting method, and no intermetallic compounds were formed on the cast iron-aluminum interface. The interfacial bonding strength showed a value of 90 MPa regardless of the heat treatment time, which is very high compared to the 12MPa bonding strength of the material without de-graphitization heat treatment. This result is thought to be due to the mechanical bonding of the undercut structure as the liquid aluminum, penetrated by the high pressure die-casting process, solidified in the de-graphitized region of the cast iron.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.55-61
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• 2022

In this study, properties of Pb-free solder joints which were combined using Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder with a mid-temperature type of melting temperature and Sn-57Bi-1Ag Pb-free solder with a low-temperature type of melting temperature were reported. Combined Pb-free solder joints were formed by reflow soldering processes with ball grid array (BGA) packages which have SAC305 solder balls and flame retardant-4 (FR-4) printed circuit boards (PCBs) which printed Sn-57Bi-1Ag solder paste. The reflow soldering processes were performed with two types of temperature profiles and interfacial properties of combined Pb-free solder joints such as interfacial reactions, formations of intermetallic compounds (IMCs), diffusion mechanisms of Bi, and so on were analyzed with the reflow process conditions. In order to compare reliability characteristics of combined Pb-free solder joints, we also conducted thermal shock test and analyzed changes of mechanical properties for joints from a shear test during the thermal shock test.