• Title/Summary/Keyword: 금박막

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Electric Resistance of Gold Thin Film (금박막의 전기저항특성)

  • 박기수;정기형
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.8 no.2
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    • pp.1-5
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    • 1971
  • The resistances of gold thin film are measured as a function of thickness and temperature(300$^{\circ}$k~420$^{\circ}$k). In this paper, the experimental results are analysed using the theory which had been proposed by Sondheimer and Neugebauer and it is shown that the temperature coefficient of resistance of gold thin film become meatily zero at the value of thickness of about 45$\AA$ and its critical thickness is about 60$\AA$.

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국산기계업체탐방-금박인쇄.전사기 제조업체 태창기계공업사

  • Kim, Chi-Won
    • 프린팅코리아
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    • s.54
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    • pp.128-130
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    • 2006
  • 피인쇄물 위에 엷은 금은막을 금형으로 눌러 가공하는 금박인쇄는 인쇄물의 외관은 물론 상품가치를 높이기 위해 자주 하용되는 기술이다. 20여 년간 금박인쇄기를 비롯해 자동화 기계를 전문적으로 생산. 보급해오고 있는 태창기계공업사는 풍부한 제작 노하우와 철저한 장인정신을 바탕으로 소비자의 입맛에 맞는 저비용 고효율 장비의 개발.보급에 오늘도 여념이 없다.

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Sputtering으로 증착된 금(Au) 박막과 사파이어(Al203) 모재사이의 입계반응

  • 박재원;이광원;최병호
    • Proceedings of the Korean Vacuum Society Conference
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    • 1999.07a
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    • pp.142-142
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    • 1999
  • 열역학적 평형하에서 금(Au)은 사파이어(Sapphire: 다결정 Al203)와 반응을 하지 않으므로 접합성이 약하나 사파이어표면을 Ar 이온으로 에칭한후 금박막을 증착하였을 때 후 열처리 없이도 대단히 강한 접합(>70MPa)이 얻어졌다. 접합기구를 규명하기 위해 고 해상도 Auger 전자광분광기로 금/사파이어 쌍의 입계에 Ai-Al-O 화합물이 1-2 원자층 범위내에서 형성되어 있고 7KeV의 Ar 이온에너지로 3분간 조사하을 때 사파이어표면에 환원으로 인한 금속알루미늄이 형성되어 있음이 발견되었다. 이 이온조사로 인한 환원은 선택적 에칭으로 인한 것으로 TRIM 계산결과와도 일치하는 것이다. 따라서 금박막과 이온조사된 사파이어 사이의 강한 접합은 이온조사로 인한 사파이어 표면에 충돌할 때의 운동 에너지가 구동력이 되어 Au-Al-O 화합물의 형성으로 결론될 수 있다.

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The Construction of the SPR (Surface Plasmon Resonance) Sucrose Sensor (표면 플라즈몬 공명형 자당 센서의 제작)

  • Um, N.S.;Lee, S.M.;Hahm, S.H.;Koh, K.N.;Lee, S.H.;Kang, S.W.
    • Journal of Sensor Science and Technology
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    • v.7 no.4
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    • pp.279-284
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    • 1998
  • A surface plasmon resonance (SPR) sensor system for the determination of sucrose concentration was constructed with a gold thin film sensing chip. The properties of gold thin film are critical factors in exciting surface plasmon resonance phenomena. Therefore in the present paper, the fabrication conditions of gold thin film were investigated to optimize the SPR phenomena. The optimum thickness was obtained as $545{\AA}$ with $43.75^{\circ}$ resonance angle and good surface roughness limitation. about $3{\AA}$. The linear resonance angle shifts and rapid response were observed from the sucrose concentrations ranged from 0 to 40wt%.

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The Roles of Gold Plate (140${\mu}{\textrm}{m}$) Loaded on TLD-100 Chips in the High Energy Radiation Beams (고에너지 광자선속에서 TLD-100 chip 위에 있는 금박막(140 ${\mu}{\textrm}{m}$) 역할)

  • Vahc, Young-Woo;Park, Kyung Ran.
    • Progress in Medical Physics
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    • v.6 no.2
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    • pp.51-60
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    • 1995
  • Lithium Fluoride (LiF; TLD-100) crystal chips are normally used as thermolu minescence dosimeters (abbreviated as NC-100) for estimating the absorbed dose to the skin of a patient or in a solid water phantom undergoing radiotherapy with megavoltage photon (6 and 15MV) beams. In general, investigation has revealed a reduction in the sensitivity of NC-100 chips after many runs through heating cycles. A TLD-100 chip laminated with gold plate (140${\mu}{\textrm}{m}$) on the upper surface layer of its face toward the photon beam (abbreviated as GC-100) has properties different from that of a NC-100 chip activated by incident photons and contaminant electrons with various lower energies coming from the gantry head and air. Activation of the valence band electrons of GC-100 chips by incident photons, positrons and electrons-which come from the gold plate by mainly pair production process and partly from Compton scattering-results in more enhanced signal intensity, higher response per monitor unit, as well as a good linearity with monitor units and independence of dose rate. Since the electron beams (6 and 15 MeV) do not have the probability of pair production process with gold plate, there is only a small difference (about a 3.3% increase for 15 MeV) in the signal gaps in the TL readout for electron beams between GC- and NC-100 chips. The 3.3% increase is entirely due to the buildup caused by the 140 m gold plate. The sensitivity of GC-100 chips is much more susceptible to high energy photon beams than electron one because of pair production. The interaction of high energy photon with a material of high atomic number, such as the good plate in this case, results in a considerably significant probability of pair production. The gold plate on the NC-100 chips acts as not only an intensifier of their signals but also acts as a filter of contaminant electrons in therapeutic high energy X-ray beams.

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Humidity Dependence of Electrical Conductivity of Vacuum Evaporated Au Films on Glass (유리표면에 진공증착된 금박막의 전기전도도의 습도 의존성)

  • 이동영;박현수
    • Journal of the Korean Ceramic Society
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    • v.24 no.6
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    • pp.572-578
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    • 1987
  • The vacuum evaporated Au films on soda-lime glasses were measured by the electrical conductivity with the variation of the annealing time, relative humidity, and temperature. Au films structures were observed by scanning Electron Microscope and X-ray Diffractometer. As the annealing time and temperature increased, the electrical conductivity was increased due to the migration or annihilation of defects, but the electrical conductivity was decreased as with the relative humidity increased. Au films by XRD and SEM examination showed the negligible effect of chemical reactions.

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Measurement of Mechanical Properties of a Thermally Evaporated Gold Film Using Blister Test (블리스터 시험법을 이용한 열증착 금박막의 기계적 성질 측정)

  • Moon, Ho-Jeong;Ham, Soon-Sik;Earmme, Yun-Young;Cho, Young-Ho
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.20 no.3
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    • pp.882-890
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    • 1996
  • Mechanical properties, including Young's modulus, residual stress and rupture strength, of a thermally evaporated gold film have been measured form a blister test. In a theoretical study, the priniple of minimum potential energy and that of virtual work have been applied to the pressurized circular membrane problem, and load-deflection relations have been derived for typical membrane deflection mode of spheroidal shape. In an experimental study, circular gold membranes of 4800 A-thickness and 3.5mm diameter were fabricated by the silicon electropolishing technique. Mecahnical properties of the thin gold films were deduced from the load-deflection curves obtained by the blister test, Young's moduli, obtianed from blister test, have been in the range of 45-70 GPa, while those of bulk gold have been in the range of 78-80 GPa. Residual stresses in the evaporated gold films have been measured as 28-110MPa in tension, The rupture strength of the gold film has turned out to be almost equal to that of dental gold alloy (310-380MPa). It has been demonstrated that the present specimen fabrication method and blister test apparatus have been effective for simultaneous measurement of Young's modulus, residual stress and repture strength of thin solid films. Especially, the electropolishing technique employed here has provided a simple and practical way to fabricate thin membranes in a circular or an arbitrary shape, which could not be obtained by the conventional anisotropic silicon mecromachining technique.

The Effect of Nozzle Diameter on Heat Transfer to a Fully Developed Round Impinging Jet (완전 발달된 원형 충돌제트의 노즐 직경이 열전달에 미치는 영향)

  • Lee, Dae-Hee;Won, Se-Youl;Lee, Young-Min;Cho, Heon-No
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.24 no.4
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    • pp.519-525
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    • 2000
  • The effect of nozzle diameter on the local Nusselt number distributions has been investigated for an axisymmetric turbulent jet impinging on the flat plate surface. The flow at the nozzle exit has a fully developed velocity profile. A uniform heat flux boundary condition at the plate surface was created using gold film Intrex. Liquid Crystal was used to measure the plate surface temperature. The experiments were made for the jet Reynolds number (Re) 23,000, the dimensionless nozzle to surface distance (L/d) from 2 to 14, and the nozzle diameter (d) from 1.36 to 3.40 cm. The results show that the Nusselt number at and near the stagnation point increase with an increasing value of the nozzle diameter.

Heat Transfer characteristics of distance between impinging surface and a plane jet (평면제트와 충돌면과의 거리변화에 따른 열전달 특성)

  • 김동건
    • Journal of Advanced Marine Engineering and Technology
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    • v.22 no.5
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    • pp.588-594
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    • 1998
  • Heat transfer characteristics of distance between impinging surface and a plane jet were experi-mentally investigated. The local heat transfer coefficients were measured by a thermochromic liq-uid crystal(TLC) The jet Reynolds number studied was varied over the range from 10,000310 to 30,000310 the nozzle-to-plate distance (H/B) from 4 to 10. It was observed that the Nusselt number increases with Reynolds number the occurrence of the secondary peak in the Nusselt number is within the potential core region the potential core of the jet flow can reach the impinging surface so that the wall jet can a transition from laminar to turbulent flow resulting in a sudden increase in the heat transfer rate.

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An Investigation on Heat transfer Characteristics of Inclined Wall Attaching Offest jet (경사진 벽부착 제트의 열전달 특성에 대한 연구)

  • 심재경
    • Journal of Advanced Marine Engineering and Technology
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    • v.22 no.2
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    • pp.200-209
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    • 1998
  • Experiments have been conducted to determine heat transfer characteristics for a two-dimen-sional turbulent wall attaching offset jet at different oblique angles to a flat surface. The local Nusselt number distributions were measured using liquid crystal as a temperature sensor. Wall static pressure coefficient profiles were measured at the Reynolds number Re 53200(based on the nozzle width, D) the offset ratio H/D from 2.5 to 10 and the oblique angle a from $0^{\circ}$, to $40^{\circ}$ It is observed that the maximum Nusselt number point occurs slightly upstream of time-averaged reattachment point for all oblique angles. The correlations between the maximum Nusselt number and Reynolds number offset ration and oblique angle are presented.

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