• Transactions of Materials Processing
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• v.3 no.1
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• pp.51-62
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• 1994

Cup drawing test and U-bending test were performed to evaluate the friction characteristics of sheet materials for the different deformation modes involved in stamping process. The coefficient of friction calculated from the each test was compared to that obtained from the draw bead friction test. It was clarified that the cup drawing test could be simply used for evaluating the friction characteristic of sheet material in deep drawing process with high contacting pressure. However the U-bending test is suitable to evaluate the frictional characteristic of sheet material in bending process with low contacting pressure.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.6
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• pp.104-108
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• 2002

Sandwich plate structure is widely used in various fields of industry due to its excellent strength and stiffness compared with weight. In this paper, the mechanical behavior of sandwich plate structure with honeycomb core considering buckling is investigated in detail. The focus of the analysis is to evaluate strength and stiffness of the plate structure with critical stress, natural frequency, and mode shapes. The results of this investigation are obtained from detailed finite element analysis for various parameters, such as length, height ratio, and thickness ratio of honeycomb core.

• Journal of Ocean Engineering and Technology
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• v.16 no.5
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• pp.66-72
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• 2002

Fracture behaviors of pipes with local wall thinning are very important for the integrity of nuclear power plant. However, effects of local wall thinning on strength and fracture behaviors of piping system were not well studied. Acoustic emission(AE) has been widely used in various fields because of its extreme sensitivity, dynamic detection ability and location of growing defects. In this study, we investigated failure modes of locally wall thinned pipes and AE signals by bending test. From test results, we could be divided four types of failure modes of ovalization, crack initiation after ovalization, local buckling and crack initiation after local buckling. And fracture behaviors such as elastic region, yielding region, plastic deformation region and crack progress region could be evaluated by AE counts, accumulative counts and time-frequency analysis during bending test. The result of the frequency range is expected to be basic data that can inspect plants in real-time.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.702-705
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• 1997

Sandwich plate structure is widely used in various fields of industry due to its excellent strength and stiffness compared with weight. In this paper, the mechanical behavior of sandwich plate structure with honeycomb core considering buckling is investigated in detail. The focus of the analysis is to evaluate strength and stiffness of the plate structure with critical stress, natural frequency, and mode shapes. The results of this investigation are obtained from detailed finite element analysis for various parameters, such as length, height ratio, and thickness ratio of honeycomb core

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2012.10a
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• pp.792-798
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• 2012

This study shows the vibration characteristics of an actuator with six wire-suspensions, used in optical pickups of optical disc drives (ODDs). In this paper, the vibration characteristics of this beam structure is induced mathematically. To obtain vibration modes of focusing direction, the vibration analysis is achieved in lateral and longitudinal directions of the structure. The accuracy of induced vibration characteristics is proved by comparing mode frequencies with a finite element analysis. Finally, it is shown that mode shapes can be modified by changing design parameters in mathematical expressions.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.22 no.11
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• pp.1128-1136
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• 2012

This paper analyzes the vibration characteristics of an optical pickup actuator, which has six wire-suspensions and is used in optical disc drives(ODDs). The vibration characteristics of the actuator is mathematically described by analyzing its beam configuration and motion condition confined to lateral and longitudinal directions of the beams. The accuracy of the vibration characteristics is proved by comparing mode frequencies with a finite element analysis. Finally, it is shown that mode frequencies and shapes can be modified by changing design parameters in mathematical expressions.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.36 no.12
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• pp.1201-1206
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• 2008

This study is focused on the investigation of the modal characteristics of the preliminary models of science technology satellite-3 (STSAT-3). Prior to the final decision of the composite structure model, several candidate structure models have been developed so as to find the most qualified structures with respect to the satellite structure systems' requirements and then utilize the information achieved to a real design. The main structure is composed of fiber reinforced composite faced honeycomb sandwich panel whose modal characteristics are found and compared to each other by means of finite element numerical analyses. Results from the current study demonstrate that a rectangular box shape having supporting inner panel shows relatively higher fundamental mode frequencies than octagonal box shape and etc., and regardless of the structure model shape tested herein, the fundamental mode turns out lateral bending mode.

• Journal of the Korean Institute of Gas
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• v.12 no.2
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• pp.57-62
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• 2008

Difference of failure modes was studied by finite element analysis for elbows with local wall thinning area particularly at inner surface of intrados of the elbow. Longitudinal wall thinning length, minimum thickness were kept constant but circumferential wall thinning width was varied to get $90^{\circ}$, $180^{\circ}$ and $360^{\circ}$ thinning width. Elastic-plastic analysis were carried out under the combined loading conditions of internal pressure and in-plane bending moment closing the elbow. Von Mises stress were obtained from the outer surface central surface location in intrados, extrados and crown parts in elbow. The results showed that the plastic deformation and failure started from the crown location when the thinning width small ($90{\sim}180^{\circ}$). However, plastic collapse started from the intrados location when the thinning width is approaching $360^{\circ}C$. This should be reflected to assess structural integrity of elbows after wall thinning measurement is made.

• Composites Research
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• v.22 no.6
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• pp.32-38
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• 2009

In this study, the energy absorption capabilities and failure modes of four different kinds of circular tubes made of carbon, Kevlar and carbon-Kevlar hybrid composites with epoxy resin have been evaluated. In order to achieve these goals, these tubes were fabricated with unidirectional prepregs and compressive tests were conducted for the tubes under 10mm/min loading speed. From the test results, carbon/epoxy tubes were collapsed by brittle fracturing mode and showed the best energy absorption capabilities, while Kevlar/epoxy tubes were crushed by local buckling mode and worst. The hybrid [$90_C/0_K$] tubes were failed in a local bucking mode and showed good post crushing integrity, whereas [$90_K/0_C$] tubes were failed in a lamina bending mode and bad post crushing integrity.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.45-52
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• 2011

It is known that test methods to evaluate solder joint reliability are die shock test, die shear test, 3points bending test, and thermal shock test. The present study investigated the effects of failure mode on 3 types (as-reflowed, $85^{\circ}C$/85%RH treatment, and $150^{\circ}C$/10hr aging) of solder joints for flip-chip BGA package by using various test methods. The test methods and configurations are reported in detail, i.e. die shock, die shear, 3points bending, and thermal shock test. We focus on the failure mode of solder joints under various tests. The test results indicate that die shock and die shear test method can reveal brittle fracture in flip-chip ball grid array (FCBGA) packages with higher sensitivity.