• Aerospace Engineering and Technology
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• v.1 no.2
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• pp.11-18
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• 2002

The structural load analysis of 50m class airship was performed. The airship maneuver condition for analysis was defined. Aerodynamic, inertia and buoyance models were built. Control surface motion to make defined maneuver condition were calculated. Load factors, load, shear and bending moment envelops were developed for full airship and tailwing. Gondola design loads were developed.

• Journal of the Society of Naval Architects of Korea
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• v.33 no.4
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• pp.106-123
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• 1996

This paper experimentally investigates the characteristics of Al-honeycomb sandwich panels which are considered as a promising primary strength member of weight critical large structures. Some tests on the aluminum honeycomb panels subject to 3-point bending or uniaxial compression or crushing load are carried out. Based on the test results, linear elastic response, buckling/ultimate strength and crushing/energy absorption capacity are discussed. Some guidelines for design of aluminum honeycomb panels are given.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.68-69
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• 2011

마그네슘 판재의 온간 스프링백 거동 예측을 위한 재료 거동 모델을 고찰하였다. V-굽힘 시험에 관한 기존 문헌의 결과와 비교하여 재료 모델의 타당성을 토하였다. 스프링백 거동의 정량화를 위해 온간 S-rail 프레스금형에 의한 성형 시험을 수행하였다. 성형 시험은 다양한 온도, 속도, 성형깊이 조건에서 수행하였으며 시험 결과를 서로 비교하였다. 재료 모델을 사용하여 S-레일 성형에 따른 스프링백 예측을 위한 유한요소해석을 수행하고 그 결과를 시험 측정값과 비교하였다. 이로부터 재료 모델의 한계와 가능성을 고찰하였다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.10
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• pp.1377-1384
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• 2010

The objective of this study is to determine the best material model that represents the deformation behavior of the Sn37Pb solder alloy accurately. First, a specimen is fabricated and subjected to a thermal cycle with temperatures ranging from the room temperature to $125^{\circ}C$. An experiment is conducted to examine deformation by Moire interferometry. Three different constitutive equation models are used in the finite element analysis (FEA) of the thermal cycle. In order to minimize the difference between the FEA results and the experimental results, the material parameters of the solder alloy are considered to be unknown and are determined by conducting optimization. As a result of the study, the Anand model is found to represent the deformation behavior of the solder most accurately.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.12
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• pp.1849-1856
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• 2010

Glass/resin/glass laminate structures are used in the automobile, biological, and display industries. The sandwich structures are used in the micro/nanoimprint process to fabricate a variety of functional components and devices in fields such as display, optics, MEMS, and bioindustry. In the process, micrometer- or nanometer-scale patterns are transferred onto the substrate using UV curing resins. The demodling process has an important impact on productivity. In this study, we investigated the fracture behavior of glass/resin/glass laminates fabricated via UV curing. We performed measurements of the adhesion force and the interfacial energy between the mold and resin materials using the four-point flexural test. The bending-test measurements and the load-displacement curves of the laminates indicate that the fracture behavior is influenced by the interfacial energy between the mold and resin and the resin thickness.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.12
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• pp.1549-1556
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• 2011

Tensile and creep tests were performed at various temperatures to investigate the mechanical properties of plastics used in automotive instrument panels. Mechanical properties such as Young's modulus and Poisson's ratios changed markedly with the test temperature. Three-point bending creep tests were performed for three kinds of plastics under four loading conditions. Coefficients in the time-hardening power law creep equation were obtained from the experiment, and the creep behavior was represented by a simple expression. The results of finite element creep analysis showed good agreement with the experimental results, while the difference between the numerical and experimental results increased with the load.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.22 no.6
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• pp.565-572
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• 2009

This work intends to establish the reliability and fracture toughness $K_{IC}$ criterion of welded joints by EGW for high strength EH36-TMCP ultra thick plate. For this, firstly thermo elasto-plastic analysis has been carried out on two pass X-groove butt joint model to clarify the thermal and mechanical behaviour(residual stress, plastic strain, magnitude of stress and their distribution and production mechanism). Moreover, to establish fracture criterion, analysis of fracture toughness $K_{IC}$ has been performed under the notch machined and residual stress with the load condition on EGW welded joints. A quantitative fracture criterion for EGW welded joints is suggested by using $K_{IC}$.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.11-19
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• 2009

Thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Experiments are conducted for three types of WB-PBGA package that have full grid pattern and perimeter pattern with/without central connections. Bending deformations of the assemblies and average strains of the solder balls are investigated, with an emphasis on the effect of solder interconnection grid patterns, Thermal strain distributions and the location of the critical solder ball in package assemblies are quite different with the form of solder ball grid pattern. For the WB-PBGA-PC, The largest of effective strain occurred in the inner solder ball of perimeter closest to the chip solder balls. The critical solder ball is located at the edge of the chip for the WB-PBGA-FG, at the most outer solder ball of central connections for the WB-PBGA-P/C, and at the inner solder ball closest to the chip for the WB-PBGA-P.

• Journal of Aerospace System Engineering
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• v.16 no.6
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• pp.99-105
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• 2022

This paper studied the mechanical characteristics of boom structures by verifying the modeling method of representing unit cells of triaxial woven fabric (TWF) composites. The modeling of the representative unit cell obtained the ABD matrix by analysing the behaviour of tensile, shear, bending, and torsion using the periodic boundary conditions for the beam element. This study aimed to validate the ABD matrix by comparing the tensile analysis output from a finite element program with the experimental results from an MTS 810 machine. Additionally, the mechanical characteristics of a TWF composite boom structure were determined through bending analysis and experiments. The findings of this research are expected to be beneficial for developing structures using TWF composites.

• Composites Research
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• v.20 no.3
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• pp.8-16
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• 2007

Bending collapse of light-weight square tubes used for vehicle structure components is a dominant failure mode in oblique collision and rollover of vehicles. In this paper bending performances of aluminum-GFRP hybrid tube beams were evaluated in relation with bending deformation behavior and energy absorption characteristics. Aluminum/GFRP hybrid tube beams fabricated by inserting adhesive film between prepreg and metal layer were used in the bending test. Failure mechanisms of hybrid tubes under a bending load were experimentally investigated to analyze the bending performance as a function of ply orientation and composite layer thickness. Ultimate bending moments and energy absorption capacity of hybrid tube beams were obtained from the measured load-displacement corves. It was found that aluminum/GFRP hybrid tubes could be converted to rather stable collapse mode showing excellent energy absorption capacity in comparison to the pure aluminum tube beams. In particular, the hybrid tube beam with $[0^{\circ}/90^{\circ}]s$ composite layer showed a large improvement by about 78% in energy absorption capacity and by 29% in specific energy absorption.