• Title/Summary/Keyword: 굽힘거동

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The Patch Attachment Effect for Bending Behavior on the CF/Aramid Composites with Seawater Aging and Hole Damage (해수 열화 및 원공 손상 CF/Aramid 복합재의 패치 부착이 굽힘거동에 미치는 영향)

  • Woo Deok Kwon;Oh Heon Kwon;Yu Seong Yun
    • Journal of the Korean Society of Safety
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    • v.38 no.3
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    • pp.20-26
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    • 2023
  • Fiber-reinforced composite materials with carbon, glass, and aramid fibers are widely applied to industrial field structures due to their excellent properties. However, carbon fibers are vulnerable to external impacts, whereas aramid fibers degrade when exposed to water. This study evaluated carbon/aramid fiber composites degraded and damaged by high-temperature saline environments using acoustic emission (AE). The test specimen was molded using an autoclave and immersed in seawater at 70 ℃ for 224 days. In order to imitate the damage, a 3-mm-diameter hole was drilled using a diamond drill. Additionally, the specimen with the perforation was repaired by patch attachment processing. Three-point bending was used to conduct the flexural experiment, and an AE sensor with a 150-kHz resonance frequency was attached to evaluate the damage and the effect of patch attachment. AE accumulative counts obtained at the maximum load were 69.2, 67.1, and 91.2 for a high-temperature seawater deteriorated condition, a hole specimen, and a repaired patch specimen, respectively. Furthermore, the maximum amplitude of AE was detected at low values of 28 dB, 31.3 dB, and 30.3 dB.

Calculation of J-Integral by CMOD at Impact Behavior of 3-Point Bend Specimen (삼점 굽힘 시험편의 충격 거동에 있어서의 CMOD에 의한 J-적분의 계산)

  • Cho Jae-Ung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.6 no.6
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    • pp.542-546
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    • 2005
  • The J-integral used as a ductile crack initiation criterion has been discussed for the impact loaded elastic-plastic 3PB specimens. The experimental method to measure or estimate the J-integral history has been investigated and its result has been compared to the obtained elastic-plastic values by the finite element model of this study. These numerical results and the experimental curves are found to agree closely. J-integral can be calculated by only numerical analysis with the finite element model. It is proved that simple calculation can be made in order to find the possible value of J-integral by crack mouth opening displacement(CMOD) in the dynamic nonlinear fracture experiment of 3-point bend(3PB) specimen. The property of elastic-plastic material is considered at different impact velocities. The J-integral may be estimated from the crack mouth opening displacement which can be measured directly kom photographs taken during impact experiments.

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Beam-Type Bend Specimen for Interlaminar Fracture Toughness of Laminated Composite under Mixed-Mode Defmrmations (보 형태의 굽힘시편을 이용한 적층복합재료의 혼합모우드 층간파괴인성 평가)

  • 윤성호;홍창선
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.13 no.5
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    • pp.911-920
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    • 1989
  • It this study, beam-type bend specimen is used to evaluate the interlaminar fracture toughness of laminated composite under mixed-mode deformations. The specimen is loaded under three-point bending and hence produced mixed-mode deformations in the vicinity of the crack tip according to the variation of the thickness ratio on delamination plane. Total energy release rate is obtained by elementary beam theory considering the effect of shear deformation. The partitioning of total value into mode-I and mode-II components is also performed. The mixed-mode interlaminar fracture toughness is evaluated by experiments on specimens with several thickness ratios of delamination plane. As the part of delamination plane is thicker, the effect of shear deformation on total energy release rate is increased. Beam-type bend specimen men may be applied to obtain informations on the mixed-mode interlaminar fracture behavior of laminated composites.

Study on the Dynamic Stress-Strain Behavior of Solid Propellant Using Low-Velocity Impact Test (저속충격시험을 이용한 고체추진제의 동적 응력-변형률 특성 연구)

  • Hwang, Jae-Min;Go, Eun-Su;Jo, Hyun-Jun;Kim, In-Gul;Kim, Jae-Hoon
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.49 no.10
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    • pp.813-820
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    • 2021
  • In this study, a low-velocity impact test was performed to obtain the dynamic properties of solid propellants. The dynamic behavior of the solid propellant was examined by measuring the force and displacement of the impactor during the low-velocity impact test. The bending displacement was calculated by compensating for the local displacement caused by the low-velocity impact test in the form of three point bending and the shear displacement caused by using a short and thick solid propellant specimen. Stress and strain were calculated using compensated displacements and measured force, and dynamic properties of solid propellants were obtained from the stress-strain curve and compared with static bending test. The dynamic properties of solid propellant under the low-velocity impact loading at various operating temperature conditions such as room temperature(20 ℃), high temperature(63 ℃), and low temperature(-32 ℃) were compared and investigated.

Sensitivity Analysis of Coupled Horizontal and Torsional Vibration of Hull Girder (선체 저차 수평.비틂 연성 고유진동 감도해석)

  • Dae-Seung Cho;Sa-Soo Kim;Doo-Yong Na
    • Journal of the Society of Naval Architects of Korea
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    • v.36 no.2
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    • pp.105-113
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    • 1999
  • This paper resents a prediction method of natural frequencies of coupled horizontal and torsional vibration of hull girder based on design sensitivity analysis in case of the changes of system parameters. The sensitivity analysis is formulated applying the direct differentiation method and transfer matrix method. In the analysis, warping, shear deformation due to torsion and the continuity condition at the connected part of open and closed hull section are considered. Using the presented method. The affection for natural frequencies by the change of system parameters, especially cargo and added mass and their centers, is numerically investigated for a real large container carrier.

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두꺼운 복합적층판의 기계적 체결 거동에 대한 유한요소 해석

  • 김유준;김형근;황태경;도영대
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 1997.11a
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    • pp.29-29
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    • 1997
  • 각광 받는 구조재료인 섬유강화 복합적층재에 대한 기계적 체결 거동은 본질적인 재료의 이방성에 의해서 파단강도가 파단 모우드와 매우 밀접한 관련을 갖는 것으로 알려져 있다. 따라서, 복합적층판 체결부의 정밀 구조 설계에서는 단순화에 따른 오차를 줄이고 정밀해에 의한 설계 및 해석이 요청된다. 특히, 층간응력 성분을 무시할 수 없는 두께를 갖는 복합적층 판의 기계적 체결부 해석이나 실제 구조물의 체결부에서 발생하는 굽힘이나 비틀림과 같은 하중 상태를 묘사하기 위해서도 정밀한 3차원 응력 해석은 필요하다. 하지만, 지금까지 기계적 체결부의 거동에 관한 연구는 층간응력 성분들을 어느정도 무시할 수 있는 얇은 평판에 대한 2차원 응력해석에 주로 국한되어 왔으며, 일부 수행된 체결부에 대한 3차원 응력 해석의 경우 여러 단점을 갖는 3차원 연속체 요소에 의한 유한요소 해석이 수행되었을 뿐이다.본 연구는 층간응력 성분들을 무시할 수 없는 두께를 갖는 복합적층판의 기계적 체결부 해석에 지금까지 사용되어온 3차원 연속체 요소에 의한 유한요소 방법이 갖는 단점들을 개선한 Layerwise 유한요소법을 이용하여 3차원 응력해석을 수행하였다. 특히, 선형상보성원리에 근거한 최적설계 기법을 응용하여, 기계적 체결시 핀과 적층판의 홀 사이에 발생하는 하중 전달 과정을 모사하고, 접촉력에 의한 홀 주위의 복잡하고 국부적인 응력 집중현상을 규명하여본다.

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유연성 소자 적용을 위한 $SiO_x$ 보호막의 특성 평가

  • Jeong, Yu-Jeong;Jeong, Jae-Hye;Yun, Jeong-Heum;Lee, Seong-Hun;Lee, Geon-Hwan
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.452-452
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    • 2010
  • 차세대 디스플레이로서 주목 받고 있는 유연성 정보표시 소자 개발에 대한 요구도가 날로 증대되고 있다. 유연성 정보표시 소자로서 플라스틱 기반 유연성 소자가 특히 주목 받고 있으나, 이의 실용화를 위해서는 플라스틱 기판에 적용 가능한 보호막 형성 기술 개발이 선행되어야 한다. 플라스틱 필름의 경우 높은 산소 및 수분 투과율 때문에 유연성 디스플레이의 응용에 걸림돌이 되고 있다. 플라스틱 기반 유연성 소자의 장수명화를 위해서는 수분과 산소의 투과를 방지하는 passivation layer 형성 기술이 필수적으로 요구된다. 본 연구에서는, polyethylene terephethalate (PET) 기판상에 증착된 $SiO_x$ 보호막의 합성에 있어서 중간층 유무에 따른 투습특성의 변화를 살펴보았다. 기화된 HMDSO (Hexamethyldisiloxane)와 Ar 및 $O_2$ 혼합기체를 이용하여 PECVD 방법으로 $SiO_x$ 박막을 합성하였다. 15 nm 두께의 $Al_2O_3$를 중간층으로 사용하여 중간층 유무에 따른 초기성장 거동 변화가 $SiO_x$ 박막의 투습 특성에 미치는 영향을 조사하였다. $SiO_x$ 박막 구조와 화학적 조성은 각각 FE-SEM과 FT-IR을 이용하여 분석하였으며, AFM을 이용하여 $SiO_x$ 박막 표면 미세 형상을 관찰하였다. 투습률은 MOCON사(社)의 Permatran-W 3/33 MA을 이용하여 측정하였다. 그리고 반복 굽힘 시험기를 이용하여 $SiO_x$ 보호막의 동적 투습 특성을 조사하였다. $Al_2O_3$ 중간층 유무에 따라 $SiO_x$ 박막의 투습률 (WVTR; water vapor transmission rate)은 ${\sim}10^{-1}g/m^2/day$(300 nm-thick $SiO_x$/PET)에서 ${\sim}5{\times}10^{-3}g/m^2/day$(300 nm-thick $SiO_x$/15 nm-thick $Al_2O_3$/PET)으로 변화하였다. 300 nm-thick $SiO_x$/15 nm-thick $Al_2O_3$/PET 시편의 경우 곡지름 50 mm에서 1,000회 반복 굽힘 후에도 투습률 변화를 보이지 않았다. 이와 같은 $SiO_x$ 박막의 투습 특성 변화는 $Al_2O_3$ 중간층 유무에 따른 초기 성장 거동의 변화로 해석된다. FE-SEM 및 AFM 표면 미세 구조 관찰을 통한 초기 성장 거동 변화 조사 결과, $Al_2O_3$ 중간층 없이 PET 기판위에 $SiO_x$ 박막 증착한 경우 3 차원 성장을 하는 반면, PET기판위에 $Al_2O_3$ 중간층 형성 후 $SiO_x$ 박막 증착하는 경우 2 차원 성장을 하게 됨을 관찰하였다. 따라서 본 연구를 통하여, 플라스틱 기반 유연성 표시 소자에 적용하기 위한 $SiO_x$ 보호막 합성 에 있어서 초기 성장 거동의 변화가 투습 특성에 민감한 영향을 미침을 알 수 있었다.

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4D Printing Materials for Soft Robots (소프트 로봇용 4D 프린팅 소재)

  • Sunhee Lee
    • Fashion & Textile Research Journal
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    • v.24 no.6
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    • pp.667-685
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    • 2022
  • This paper aims to investigate 4D printing materials for soft robots. 4D printing is a targeted evolution of the 3D printed structure in shape, property, and functionality. It is capable of self-assembly, multi-functionality, and self-repair. In addition, it is time-dependent, printer-independent, and predictable. The shape-shifting behaviors considered in 4D printing include folding, bending, twisting, linear or nonlinear expansion/contraction, surface curling, and generating surface topographical features. The shapes can shift from 1D to 1D, 1D to 2D, 2D to 2D, 1D to 3D, 2D to 3D, and 3D to 3D. In the 4D printing auxetic structure, the kinetiX is a cellular-based material design composed of rigid plates and elastic hinges. In pneumatic auxetics based on the kirigami structure, an inverse optimization method for designing and fabricating morphs three-dimensional shapes out of patterns laid out flat. When 4D printing material is molded into a deformable 3D structure, it can be applied to the exoskeleton material of soft robots such as upper and lower limbs, fingers, hands, toes, and feet. Research on 4D printing materials for soft robots is essential in developing smart clothing for healthcare in the textile and fashion industry.

A Steel Ball Impact Damage Behavior of RS-SiC Ceramic Materials (RS-SiC 세라믹 재료의 강구 입자충격 손상 거동)

  • Oh, Sang-Yeob
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.8
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    • pp.1015-1021
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    • 2010
  • In this study, the effect of the C/SiC composition ratio on the impact damage of a reaction sintered SiC (RS-SiC) plates was evaluated. An impact test was conducted by using an air gun. The impacter used was a steel ball with a diameter of 2 mm, and the impact velocities were 113, 122, and 180 m/s. The RS-SiC plates were $20\times20\times3$ mm with different C/SiC composition ratios. The ring crack diameters damaged by a steel ball were determined using SEM images. It was observed that the maximum diameter increased with increasing impact velocity, and it rapidly changed with increasing C/SiC composition ratio because of the effect of residual Si and the variation flexural strength. Cone cracks were formed in the case of C/SiC composition ratios of 0.4~0.5, this indicated that the impact damage changed from a ring crack to a cone crack in this critical range of C/SiC composition ratios. The C/SiC composition ratio of 0.3 was determined to be the optimal ratio for the RS-SiC manufacturing process.

Thermo-mechanical Behavior of WB-PBGA Packages with Pb-Sn Solder and Lead-free Solder Using Moire Interferometry (무아레 간섭계를 이용한 유연 솔더와 무연 솔더 실장 WB-PBGA 패키지의 열-기계적 변형 거동)

  • Lee, Bong-Hee;Kim, Man-Ki;Joo, Jin-Won
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.3
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    • pp.17-26
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    • 2010
  • Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.