Three Dimensional Metrology of Surface Mounted Solder Pastes Using Bounding Box Formed by Histogram of Gradient Vectors of Point Cloud (점군의 기울기벡터 히스토그램에 의해 형성된 구속상자를 이용한 표면실장 솔더페이스트의 3차원 Metrology)
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- Proceedings of the Korean Society of Precision Engineering Conference
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- 2003.06a
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- pp.674-677
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- 2003