• Title/Summary/Keyword: 구리정량

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Si 기판상에 도금된 구리 박막의 이방성 에칭 특성

  • Kim, Sang-Hyeok;Park, Chae-Min;Mun, Seong-Jae;Lee, Hyo-Jong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2017.05a
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    • pp.67.1-67.1
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    • 2017
  • 구리는 탄성이방성이 큰 재료로 Si 박막상에 성장시키면 (111) 방향으로 우선 배향된 박막을 얻을 수 있다. 본 연구는 이러한 (111) 우선 방위를 갖는 Cu 박막의 전기도금층의 재결정 후의 매우 평탄한 표면을 갖는 박막에서 에칭에 따른 박막의 단차와 표면형상을 통해 결정방위별 에칭 특성을 비교 분석한 결과이다. 10 vol% 질산용액에서 에칭한 결과는 구리의 용해에 따라 각 결정면에 대한 고유의 facetted surface morphology를 나타내며, 대표적인 결정 방위인 (111), (110), (100)에 대해 triangular flake, ridge and rectangular pyramidal shapes을 나타내는 것을 알 수 있었다. 에칭속도의 정량적 측정을 위해 120초간 2.2M 농도의 질산용액으로 에칭을 실시하였고, nanosize의 as-plated initial region, (111), (110), (100) oriented regions의 각각에서 383, 270, 276, 317 nm/min의 에칭속도를 갖는 것을 확인하였다. Facet surface의 관찰을 통해 에칭반응이 (111) front surface를 갖는 열역학적 평형상태에서 일어나며, 이러한 결정방위별 에칭속도 차이는 각 결정S면이 갖는 Kink or ledge의 밀도의 차이에 기인할 것으로 판단된다. 즉, 에칭이 평형상태에서 step flow mechanism에 의해 열역학적 평형상태를 유지하면서 진행이 된다. 본 연구는 향후 다양한 에칭관련 용액 효과, 구리 박막의 응력 및 불순물에 의한 효과를 볼 수 있는 기본 방법을 제공해 줄 것으로 기대한다.

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Analysis of the Korean Copper Price Elasticity using Time-Varying Model (시변 모형을 이용한 국내 구리 가격탄력성 분석)

  • Kangho Kim;Jinsoo Kim
    • Environmental and Resource Economics Review
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    • v.33 no.2
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    • pp.135-157
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    • 2024
  • In this study, we analyzed the changes in copper consumption according to copper price fluctuations and identified the domestic copper price elasticity. A total of 408 time series data from January 1989 to December 2022 were analyzed using the vector autoregressive (VAR) model with net import volume, price, and production index as variables. In addition, to identify changes in the correlation between variables over time, the dynamic relationship between variables was identified using the time-varying vector autoregressive (TV-VAR) model. As a result of the analysis, it was confirmed that the negative price elasticity for copper is -0.1835. In addition, the interquartile range was -0.3130 ~ 0.0886, with no consistent trend over time, but mainly negative elasticity. This study can be used to quantify the expected impact of various policy proposals and changes related to minerals.

Preconcentration and Determination of Copper(II) Using Octadecyl Silica Membrane Disks Modified by 2-Propylpiperidine-1-carbodithioate and Flame Atomic Absorption Spectrometry (2-Propylpiperidine-1-carbodithioate로 수식화한 Octadecyl 실리카 막으로 구리(II)의 예비농축 및 불꽃 원자흡수분광법으로의 정량)

  • Moghimi, Ali;Mossalayi, Haydar
    • Journal of the Korean Chemical Society
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    • v.52 no.2
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    • pp.148-154
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    • 2008
  • A simple and fast method for extraction and determination of trace amounts of copper(II) ions using octadecyl-bonded silica membrane disks modified with 2-propylpiperidine-1-carbodithioate (PPCD)I and atomic absorption spectrometry (AAS) is introduced. Extraction efficiency and the influence of flow rates, pH, and type and smallest amount of stripping acid were investigated. Maximum capacity of the membrane disks modified with 2 mg of the anthraquinone derivative used was found to be 425μg Cu2+. The limit of detection of the proposed method is 7 ng/ml. The method is applied to the recovery of Cu2+ from different synthetic samples and a spring water sample.

Determination of Cyanide Ion in the Presence of Sulfide Ion by Differential Pulse Cathodic Stripping Voltammetry (시차펄스 음극벗김 전압전류법에 의한 황화이온의 존재하에서 시안화이온의 정량)

  • Park, Se Yeon;Kwon, Young Soon
    • Analytical Science and Technology
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    • v.6 no.1
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    • pp.47-55
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    • 1993
  • The quantitative determination of trace cyanide ion in the presence of sulfide ion has been studied by addition of cupric ion using differential pulse Cathodic Stripping Voltammetry. The detection limit of cyanide ion in the presence of $5.0*10^{-5}M$ sulfide ion and $1.0*10^{-3}M$ cupric ion was $2.0*10^{-7}M$ in KCI-Phosphate buffer(pH=7.0) at accumulation potential -0.30V and accumulation time 3.0 min.

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Effects of Wet Chemical Treatment and Thermal Cycle Conditions on the Interfacial Adhesion Energy of Cu/SiNx thin Film Interfaces (습식표면처리 및 열 사이클에 따른 Cu/SiNx 계면접착에너지 평가 및 분석)

  • Jeong, Minsu;Kim, Jeong-Kyu;Kang, Hee-Oh;Hwang, Wook-Jung;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.1
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    • pp.45-50
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    • 2014
  • Effects of wet chemical treatment and thermal cycle conditions on the quantitative interfacial adhesion energy of $Cu/SiN_x$ thin film interfaces were evaluated by 4-point bending test method. The test samples were cleaned by chemical treatment after Cu chemical-mechanical polishing (CMP). The thermal cycle test between Cu and $SiN_x$ capping layer was experimented at the temperature, -45 to $175^{\circ}C$ for 250 cycles. The measured interfacial adhesion energy increased from 10.57 to $14.87J/m^2$ after surface chemical treatment. After 250 thermal cycles, the interfacial adhesion energy decreased to $5.64J/m^2$ and $7.34J/m^2$ for without chemical treatment and with chemical treatment, respectively. The delaminated interfaces were confirmed as $Cu/SiN_x$ interface by using the scanning electron microscope and energy dispersive spectroscopy. From X-ray photoelectron spectroscopy analysis results, the relative Cu oxide amounts between $SiN_x$ and Cu decreased by chemical treatment and increased after thermal cycle. The thermal stress due to the mismatch of thermal expansion coefficient during thermal cycle seemed to weaken the $Cu/SiN_x$ interface adhesion, which led to increased CuO amounts at Cu film surface.

Simultaneous Determination of Zinc, Cadmium, Lead and Copper in Tungsten Matrix by Differential Pulse Anodic Stripping Voltammetry (펄스차이 벗김전압전류법에 의한 텅스텐 중 아연, 카드뮴, 납 및 구리의 미량성분 동시분석)

  • Bae, Jun Ung;Lee, Seong Ho
    • Journal of the Korean Chemical Society
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    • v.38 no.2
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    • pp.146-150
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    • 1994
  • The simultaneous determination of Zn, Cd, Pb and Cu in 1.000%(w/v) tungsten matrix by differential pulse anodic stripping voltammetry at a hanging mercury drop electrode has been studied. Tartaric acid(pH=5.00) was used as a supporting electrolyte. Optimum analytical conditions were found that the deposition potential was -1.2 volt(vs. Ag/AgCl), the deposition time was 3 minutes. The linear concentration range of all trace metal ions in 1.000%(w/v) tungsten matrix were 10 to 50 ppb. And the detection limit(3${\sigma}$) of zinc, cadmium, lead and copper were 1.25, 1.02, 1.69, and 1.02 ppb respectively. This method was superior to the ICP-AES method which detection limits(3${\sigma}$) in 1.000%(w/v) tungsten matrix were 8.0, 5.0, 120 and 5 ppb respectively.

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Magnetic Resonance Imaging uses 3D Printed Material of Headset (Noise Reduction Effect) (자기공명영상 검사 시 3D 프린팅 재료를 이용한 헤드셋 연구 (소음저감 효과))

  • Choi, Woo Jeon;Kim, Dong Hyun
    • Journal of the Korean Society of Radiology
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    • v.12 no.3
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    • pp.335-341
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    • 2018
  • With the improvement of medical state, patients' expectations for the most advanced medical equipment are increasing. Particularly, Magnetic Resonance Image (MRI) is used as one of the core image diagnosis methods in all clinical area. However, it has been reported that many of patients who go through the examination suffer from anxiety to the severe noise level during the examination. In this study, both the noise reduction evaluation of headsets with sound-blocking materials added to existing sound-absorbing materials and the existence of sound blocking materials as artifacts on the examination image are tested. An MRI test noise is recorded as a speaker by cross-ordination the sound material (sponge) and the sound material (acrylic plate, copper plate, and 3D copper plate) inside the headset made from 3D pring. A quantitative assessment of headsets showed that the average headset value was 81.8 dB. The average dB value of the most soundproof material combination(Copper, acrylic plate, sponge, sponge) headsets on headsets with added charactering material was measured at 70.4 dB, and MRI showed that the copper was diamagnetic substance and excluded. The second most soundproof headset(Sponge, acrylic plate, 3D copper plate, sponge) was measured at 70.6 dB and MRI showed no artifacts. The same simulation of the material printed with a 3D copper PLA containing approximately 40 % copper powder resulted in no artifacts, therefore, the material output as a 3D printing was better suited for use. For MRI related research, the mutual development of 3D printing is highly anticipated.

Analysis of dominant impurities in Cu and Ta films using SIMS and GDMS (SIMS와 GDMS를 이용한 구리와 탄탈 박막내의 주요불순물 분석)

  • ;Minoru Isshiki
    • Journal of the Korean Vacuum Society
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    • v.13 no.2
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    • pp.79-85
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    • 2004
  • Secondary ion mass spectrometry(SIMS) and glow discharge mass spectrometry(GDMS) were used to determine the impurity concentrations of hydrogen, carbon, and oxygen elements in the Cu and Ta films, and the results of SIMS and GDMS analysis were carefully considered. The Cu and Ta films were deposited on Si (100) substrates at zero substrate bias voltage and a substrate bias voltage of -50 V(Cu films) or -125 V(Ta films) using a non-mass separated ion beam deposition method. As a result of SIMS with Cs+ ion beam, in the case of the Cu and Ta films deposited without the substrate bias voltage, many strong peaks were observed, which is considered to be detected as a the cluster state such as CxHx, OxHx, CxOxHx. All the peaks of SIMS results could be interpreted by the combination of these dominant impurities. Moreover, it was confirmed that the quantitative results of GDMS analysis were accordant to the SIMS results.

Studies on X-Ray Fluorescence Analysis of Sulfide Ores by Solution Technique (II). Analysis of Iron, Copper and Cobalt (용액법을 이용한 황화광석의 X-선 형광분석에 관한 연구 (제2보). 철, 구리 및 코발트의 분석)

  • Young-Sang Kim;Kee-Chae Park
    • Journal of the Korean Chemical Society
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    • v.26 no.5
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    • pp.320-325
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    • 1982
  • Utilyzing the solution prepared for the sulfur determination, the amounts of iron, copper and cobalt in the sulfide ore were determined by X-ray fluorescence spectrometry. The samples were dissolved with the mixed solutions of ,$Br_2\;and\;HNO_3$ and a major constituent of $SiO_2$was repelled from the solution by HF treatment several times. The analytical results agreed with the data obtained by conventional methods within ${\pm}$1.5% for Fe of the range of 20 to 50%, ${\pm}$1.0% for Cu of 10 to 15%, and ${\pm}$0.4% for Co of 1 to 5%. The present method was tolerably found to be reproducible.

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Determination of Copper, Lead, Cadmium and Zinc in Water by Square Wave Polarography with Dithizone-Chloroform Extraction Method (디티존-클로로포름 抽出, 短形波폴라로그래피에 의한 물중의 구리, 납, 카드뮴 및 아연의 定量)

  • Su-Chan Moon
    • Journal of the Korean Chemical Society
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    • v.19 no.6
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    • pp.428-433
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    • 1975
  • 500 ml of a sample water was extracted with 10 ml of 0.01 % dithizone-$CHCl_3$three times. When $CHCl_3$ layer was back extracted with 10 ml of 0.1 N HCl containing mercuric ion, the free metal ions come into aqueous layer. The aqueous layer was added with 2 ml of 2 N KCl and was washed with 10 ㎖ of $CHCl_3$two times in order to remove the trace dithizone, and then was recorded square wave polarogram. The concentration of copper, lead and cadmium can be determined up to 3 ppb and that of zinc up to 14 ppb with an error of 10 %.

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