Effect of Post-annealing on the Interfacial adhesion Energy of Cu thin Film and ALD Ru Diffusion Barrier Layer (후속 열처리에 따른 Cu 박막과 ALD Ru 확산방지층의 계면접착에너지 평가)
-
- Journal of the Microelectronics and Packaging Society
- /
- v.25 no.3
- /
- pp.7-12
- /
- 2018