• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.7
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• pp.701-706
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• 2015

In this study, experimental and computer simulation results are compared and analyzed. Three-dimensional (3D) fabricated matrices from an MJM 3D printer were joined with poly-acetate thermoplastic polymers using a diode laser. A power range of 5-7 W was used to irradiate the boundary of two polymers. The heated polymers flowed into the matrices of the 3D fabricated structure, and reliable mechanical joining was achieved. Computer simulation showed the temperature distribution in the polymers, and flow direction was estimated based on the flux and temperature information. It was found that the more than the minimum energy threshold was required to effectively join the polymers and that two scans at low-speed were more effective than four scans at high speed.

• Applied Chemistry for Engineering
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• v.10 no.6
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• pp.852-856
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• 1999

The objective of this study was to prepare hydrogel beads which were useful microbial immobilization to remove nitrogen and phosphorous in the industrial wastewater. Two different polyols(PEG, PTMG) terminated with photo-crosslinkable methacrylate groups were synthesized. Structures of the prepolymers and the UV cured hydrogels were characterized by using $^1H$-NMR and FT-IR spectroscopy. Water content, mechanical strength and pore sizes of the hydrogels having different MW of polyols and different ratios of PEG/PTMG were investigated. Hydrogels prepared from PEG(MW1000) only or the mixture of PEG(MW1000) and PTMG(MW2900) with 7:3 by weight were considered as potential candidates for the matrix for the immobilization of microorganism.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.2
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• pp.130-136
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• 2000

Generally, the build-up printed circuit board manufactured by the sequential process with etching, plating, drilling etc. requires many types of equipments and lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing prototype in the developing stage. In this study, we introduce a screen printing technology to prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as the formation of liquid resin thin layer, the solidification by UV/IR light, and via filling with conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with to the conventional process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.04a
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• pp.45-46
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• 2008

The conventional biased vertical alignment (BVA) mode has several advantages such as rubbing- and protrusion-free, wide-viewing angle and stable LC dynamics against external pressure. However manufacturing process of BVA mode is difficult task because the pixel and bias electrode signal are different in each frame. To solve this problem, we investigated the pattern free vertical alignment (PFVA) by using the UV-curable reactive mesogen (RM), in which the LC molecules were made to be pre-tilted. Eventually transmittance and response time in PFVA mode were found to be improved as compared to BVA mode.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1400-1403
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• 2007

The 3DP(three dimensional printing) technology is one of the SFF(solid freeform fabrication) technologies which has recently come into a spotlight due to its suitability to various field. A manufacturing process of product is using many pattern formation technology. The 3DP technology uses multi nozzle that can fabricate three dimensional object of high speed and accuracy. In this paper, we introduce a development of the office type solid freeform fabrication system. This system is used UV resin and multi-piezo head.

• Journal of Powder Materials
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• v.13 no.3 s.56
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• pp.211-216
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• 2006

In an attempt to reduce processing cost and to improve resolution of PDPs, micro mold transfer processing route for barrier ribs of plasma display panel was attempted. In this study, the parameters that may cause defects during the process were identified, which include the shrinkage during UV curing process, stress due to evaporation of organic components, and sintering shrinkage. Considering such parameters, UV curable paste was developed and barrier ribs of PDPs were successfully processed via the process. This work demonstrated the possibility of build-up route in manufacturing barrier ribs of PDP.

• Proceedings of the KIEE Conference
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• 2001.11c
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• pp.172-175
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• 2001

쾌속조형기술은 제품 설계나 기타 물체의 형상 데이터로부터 광경화성 수지, 금속 등 다양한 재료를 이용하여 수 시간 내에 실물 모형을 제작할 수 있는 기술이다. 쾌속조형기술은 주로 자동차나 제품의 모형제작에 주로 사용되어 왔다. 사이버메드에서는 인체에 대한 3차원 형상화 기술과 쾌속조형기술을 이용하여 개인별로 상이한 인체 골격에 대한 비교적 저렴한 비용으로 실물 모형을 제작할 수 있는 기술을 개발하여, 국내 및 일본의 병원에서 수술 계획 및 모형 수술에 직접 적용하고 있다. 이 논문은 쾌속 조형 기술, 인체의 3차원 형상화 기술의 개요와 그 동향, 그리고 이를 결합한 수술용 인체 골격모형의 제작 기술과 적용 사례에 대해서 기술하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.1089-1092
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• 2001

In the stereolithography process, build parameters are laser power, scan velocity, scan width, bean diameter, layer thickness and so on. These values are determined according to product accuracy and build time. Build time can be reduced by improving of scan velocity, laser power, layer thickness, hatching space and so on. But variation of these parameters influence part accuracy, surface roughness, strength. This paper observed cure properties in various beam diameter. In order to examine these, relationships of scan velocity and cure depth, scan velocity and cure width according to various beam diameter in one scan line are measured. And cure thickness is measured according to beam diameter and scan velocity in scan surface of one layer. For reduction of build time, beam diameter and scan velocity is proposed in stereolithography process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.612-615
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• 2003

Maskless laser patterning process is developed using 3rd harmonic Diode Pumped Solid State Laser with near visible wavelength of 355 nm. Photo-sensitive curable polymer is irradiated by UV laser and developed using polymer solvent to obtain quasi-3D patterns. We performed basic experiments for the various process conditions such as laser power, writing speed, laser focus, and polymer optical property to gain the optimal conditions. Experimentally, the patterns of trapezoidal shape were manufactured into dimension of 8${\mu}{\textrm}{m}$ width and 5.4${\mu}{\textrm}{m}$ height. This process could be applied to fabricate a single mode waveguide without expensive mask projection method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.437-438
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• 2008

The Conventional patterned vertical alignment (PVA) device shows a very high contrast ratio at normal direction and does not require rubbing process. However it has a disclination area in which the liquid crystal can be collision in the boundary domain region. In this paper, we studied PVA(Z-shape) device in which the liquid crystal can be tilted down in multiple directions stably because the surface pretilt angle is controlled by photopolymerization of the UV - curable reactive mesogen (RM) under a proper condition. Consequently, the device shows improved electro optical properties as compared to conventional PVA mode.