• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.03a
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• pp.316-322
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• 1998

Super precision working technique and machine tool have been developing continually thanks to advanced electronic field. To obtain good result. it is necessary to investigate surface state in grinding with ${\mu}{\textrm}{m}$ level. There were so many researches to satisfy these demands using non-contact methods through the computer vision. In this study, the texture of working surface was analyzed. cooccurrence matrice was obtained from the surface roughness. Texture parameter was obtained by means of position operator compose of $\theta$. d according to variation of angle direction and distance. As a result, it was found that surface texture was more effected by direction ($\theta$) then distance(d).

• Journal of the korean academy of Pediatric Dentistry
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• v.28 no.4
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• pp.638-642
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• 2001

Recently, plasma arc curing system for curing resin composites has been introduced. This is characterized by a high output of light energy, which has the advantage of reducing the chair time and thereby making the treatment more comportable for the patients as well as for the dentist. The purpose of this study was to compare the shear bond strengths of light-cured orthodontic adhesive polymerized with conventional halogen light and plasma arc light. The 2 curing devices used were the XL3000 (3M, USA) conventional curing light and the Flipo (LOKKI, France) plasma arc light. The results from the present study can be summarized as fellows; 1. The mean shear bond strength for three groups were quite similar for 50 second conventional light group, 2 second plasma arc curing light group, 5 second plasma arc curing light group. 2. There was no statistically significant difference for three groups(p>0.05).

• The korean journal of orthodontics
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• v.25 no.5 s.52
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• pp.605-611
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• 1995

The purpose of this study was to evaluate effects of time on shear bond strengths of a light-cured glass ionomer cement and chemically cured resin cement to enamel, and to observe the failure patterns of bracket bondings. Shear bond strength of a light-cured glass ionomer cement were compared with that of a resin cement. Metal brackets were bonded on the extracted human bicuspids. Specimens were subjected to a shear load(in an Instron machine) after storage at room temperature for 5 and 15 minutes; after storage in distilled water at $37^{\circ}C$ for 1 or 35 days. The deboned specimens were measured In respect of adhesive remnant index. The data were evaluated and tested by ANOVA, Duncan's multiple range test, and t-test, and those results were as follows. 1. The shear bond strength of light-cured glass ionomer cement is higher than that of resin cement at 5 and 15 minutes. 2. The shear bond strengths of both light-cured glass ionomer cement and resin cement increase with time. There was no significant difference in those of both 1 day group and 35 day group 3. Light-cured glass ionomer cement is suitable as orthodontic bracket adhesives

• Restorative Dentistry and Endodontics
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• v.29 no.6
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• pp.504-514
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• 2004

This study compared the dentin shear bond strengths of currently used dentin bonding agents that were irradiated with an LED (Elipar FreeLight, 3M-ESPE) and a halogen light (VIP, BISCO). The optical characteristics of two light curing units were evaluated. Extracted human third molars were prepared to expose the occlusal dentin and the bonding procedures were performed under the irradiation with each light curing unit. The dentin bonding agents used in this study were Scotchbond Multipurpose (3M ESPE), Single Bond (3M ESPE), One-Step (Bisco), Clearfil SE bond (Kuraray), and Adper Prompt (3M ESPE), The shear test was performed by employing the design of a chisel-on-iris supported with a Teflon wall. The fractured dentin surface was observed with SEM to determine the failure mode. The spectral appearance of the LED light curing unit was different from that of the halogen light curing unit in terms of maximum peak and distribution. The LED LCU (maximum peak in 465 nm) shows a narrower spectral distribution than the halogen LCU (maximum peak in 487 nm). With the exception of the Clearfil SE bond (P < 0.05), each 4 dentin bonding agents showed no significant difference between the halogen light-cured group and the LED light-cured group in the mean shear bond strength (P > 0.05). The results can be explained by the strong correlation between the absorption spectrum of camphoroquinone and the narrow emission spectrum of LED.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.3
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• pp.304-311
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• 2020

The purpose of this study is to change plant growth according to the light quantity of LED light source and to standardize plant factories technology according to the optimal LED light range. Growth was relatively stable at the 1,400 lx and 1,600 lx intensities, and growth continued with increasing light intensity, but growth slowed down with growth without leaves (Ed- I don't understand). The growth characteristics at 400 lx to 800 lx were sustained to some extent during the experimental period, but the growth of the larvae was maintained until the 7th day and the growth of leaves was not developed. From 1,000 lx to 1,400 lx, brightness, leaf growth and daily growth increased, and the growth cycle exhibited a repeating cycle of growth and slowdown. In addition, 1,600 lx and 1,800 lx showed similar growth to that at 1,400 lx, but leaf growth was high. However, at 1,800 lx, the growth was slightly higher than at 1,400lx and it slowed down over time. In addition, the stronger the light, the higher the temperature around the plant and the greater the dryness of the leaves due to the heat emitted from the light source.

• The Journal of the Acoustical Society of Korea
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• v.17 no.6
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• pp.3-7
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• 1998

Methylcyclohexane의 초음파 흡수측정을 0.1-2MHz의 주파수 범위, 온도 30-60℃에 걸쳐 1MHz이하에서 정확한 초음파 흡수측정이 가능한 광 회절 초음파 공명법을 사용하여 행하였다. 그 결과, axial과 equatorial에 의한 완화는 단일 완화현상을 보였고 그 스펙트럼 으로부터 완화 주파수와 완화강도를 결정하였다. 완화 주파수의 온도 의존성으로부터 활성 화에너지(△H*)=10.0㎉/㏖을, 완화 강도의 온도 의존성에서 엔탈피 차(△H)=1.8㎉/㏖을 각각 구하였다.

• 한국정보통신설비학회:학술대회논문집
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• 2007.08a
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• pp.19-21
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• 2007

디지털용 Uncooled DFB 레이저 다이오드를 이용하여 광대역 아날로그 피드포워드 광송신기를 제작하였다. 광송신기의 상호변조왜곡 성분 및 잡음성분을 제거하기 위해 광 피드포워드 보상기법을 사용하였으며, 다중서비스를 위해 $2.05{\sim}2.60$ GHz(550 MHz)에서 상호 변조왜곡 성분이 10 dB 이상 억제되었고, 상대강도잡음은 1.5 dB 이상 억제되었다. 2.3 GHz 에서 3 차 상호변조왜곡성분이 21.3 dB, SFDR 이 7.11 dB 향상된 결과를 얻었다. 또한 단일 모드 광섬유 전송 실험을 통해 전송길이에 따른 3 차 상호변호 왜곡성분의 크기 변화를 확인하였다.

• Korean Journal of Optics and Photonics
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• v.29 no.3
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• pp.99-103
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• 2018

Optical coherence elastography (OCE) is based on optical coherence tomography (OCT), which is a noninvasive, high-resolution, cross-sectional imaging technique. In this paper, we have developed dynamic optical coherence elastography to measure elasticity, a mechanical property of tissue, by phase difference. A piezoelectric actuator was used for sinusoidal mechanical loading of samples. Before applying this method to biomaterial, we assessed the feasibility of OCE with samples of sponge, eraser, and sharp lead. Cross-sectional and phase-difference images of the sample were obtained under sinusoidal loading. The strain rate was calculated from the phase-difference information. To obtain the envelope of the phase-difference oscillations along the horizontal direction, Hilbert transformation was performed at each depth. The elevation of the envelope was represented by color mapping, and we could measure the relative elasticity within the sample by comparing the elevations. Finally, there was an advantage when we calculated the shear rate using self-interference in the sample arm, instead of the interference between sample and reference arms.

• Proceedings of the Acoustical Society of Korea Conference
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• 1998.06d
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• pp.35-39
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• 1998

Methyl과 ethyl formate의 초음파 흡수계수를 0.15-2 MHz의 주파수 범위, 온도 5-3$0^{\circ}C$에 걸쳐 1MHz 이하에서 정확한 초음파 흡수측정이 가능한 광 회절 초음파 공명법을 이용하여 측정하였다.그 결과, cisdhk trans 에 의한 초음파 완화 현상은 전형적인 단일 완화현상을 보였고, 그 스페트럼으로부터 완화주파수와 완화강도를 결정할 수 있었다. 완화 주파수와 완화강도의 온도 의존성으로부터 활성화 에너지(ΔH#)와 에너지 차(ΔH)를 구하였다. 측정된 methyl과 ethyl formate의 활성화 에너지는 각각 9.8과 8.9kcal/mol 이었고, 에너지 차는 각각 2.3 과 2.2kcal/mol로 나타났다

• Restorative Dentistry and Endodontics
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• v.35 no.2
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• pp.125-133
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• 2010

Objectives: Rapid polymerization of overlying composite resin causes high polymerization shrinkage stress at the adhesive layer. In order to alleviate the shrinkage stress, increasing the light intensity over the first 5 seconds was suggested as an exponential curing mode by an LED light curing unit (Elipar FreeLight2, 3M ESPE). In this study, the effectiveness of the exponential curing mode on reducing stress was evaluated with measuring microtensile bond strength of three adhesives after the overlying composite resin was polymerized with either continuous or exponential curing mode. Methods: Scotchbond Multipurpose Plus (MP, 3M ESPE), Single Bond 2 (SB, 3M ESPE), and Adper Prompt (AP, 3M ESPE) were applied onto the flat occlusal dentin of extracted human molar. The overlying hybrid composite (Denfil, Vericom, Korea) was cured under one of two exposing modes of the curing unit. At 48h from bonding, microtensile bond strength was measured at a crosshead speed of 1.0 mm/min. The fractured surfaces were observed under FE-SEM. Results: There was no statistically significant difference in the microtensile bond strengths of each adhesive between curing methods (Two-way ANOVA, p > 0.05). The microtensile bond strengths of MP and SB were significantly higher than that of AP (p < 0.05). Mixed failures were observed in most of the fractured surfaces, and differences in the failure mode were not observed among groups. Conclusion: The exponential curing method had no beneficial effect on the microtensile dentin bond strengths of three adhesives compared to continuous curing method.