• Title/Summary/Keyword: 고장 메커니즘

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Reliability Evaluation of Semiconductor using Ultrasound (초음파를 이용한 반도체의 신뢰성 평가)

  • Jang, Hyo-Seong;Ha, Job;Jhang, Kyung-Young
    • Journal of the Korean Society for Nondestructive Testing
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    • v.21 no.6
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    • pp.598-606
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    • 2001
  • Recently, semiconductor packages trend to be thinner, which makes difficult to detect defects therein. A preconditioning test is generally performed to evaluate the reliability of semiconductor packages. The test procedure includes two scanning acoustic microscope (SAM) tests at the beginning and end of the entire test, in order to help detect physical defects such as delaminations and package cracks. In particular, of primary concern are package cracks and delaminations caused by moisture absorbed under ambient conditions. This paper discusses the failure mechanism associated with the moisture absorbed and encapsulated in semiconductors, and the use SAM to detect failures such as tracks and delaminations grown during the preconditioning test.

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Study on the Performance Verification Method and Failure Mechanism of Grading Capacitor of a Two-break Circuit-breaker (2점절 차단기 균압용 콘덴서 절연파괴 고장 메커니즘 및 성능검증 방법에 관한 연구)

  • Oh, SeungRyle;Han, Kisun;Kim, TaeKyun
    • KEPCO Journal on Electric Power and Energy
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    • v.5 no.1
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    • pp.11-15
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    • 2019
  • Recently, the circuit-breaker rated voltage is getting higher as the transmission voltage increases. To increase the circuit-breaker rated voltage, a multi-break circuit-breaker which has two or more breakers in series is adopted. For multi-break circuit-breaker, a grading capacitor is used to mitigate the Transient Recovery Voltage(TRV) and control the voltage distribution across the individual interrupter units. However, all over the world, there are many failures such as mechanical damage, explosion due to insulation breakdown. Therefore, it is necessary to study the causes of failure and the new performance verification method. In this paper, we investigate the causes of dielectric breakdown of the grading capacitors in the KEPCO power system and propose the performance verification method.

Review of Failure Mechanisms on the Semiconductor Devices under Electromagnetic Pulses (고출력전자기파에 의한 반도체부품의 고장메커니즘 고찰)

  • Kim, Dongshin;Koo, Yong-Sung;Kim, Ju-Hee;Kang, Soyeon;Oh, Wonwook;Chan, Sung-Il
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.18 no.6
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    • pp.37-43
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    • 2017
  • This review investigates the basic principle of physical interactions and failure mechanisms introduced in the materials and inner parts of semiconducting components under electromagnetic pulses (EMPs). The transfer process of EMPs at the semiconducting component level can be explained based on three layer structures (air, dielectric, and conductor layers). The theoretically absorbed energy can be predicted by the complex reflection coefficient. The main failure mechanisms of semiconductor components are also described based on the Joule heating energy generated by the coupling between materials and the applied EMPs. Breakdown of the P-N junction, burnout of the circuit pattern in the semiconductor chip, and damage to connecting wires between the lead frame and semiconducting chips can result from dielectric heating and eddy current loss due to electric and magnetic fields. To summarize, the EMPs transferred to the semiconductor components interact with the chip material in a semiconductor, and dipolar polarization and ionic conduction happen at the same time. Destruction of the P-N junction can result from excessive reverse voltage. Further EMP research at the semiconducting component level is needed to improve the reliability and susceptibility of electric and electronic systems.

Failure Analysis by Fracture Study of Connecting Rod Bolts in Diesel Engine for Military Tracked Vehicles (군용 궤도차량 디젤엔진의 커넥팅 로드 볼트 파손 검토를 통한 고장원인분석)

  • Oh, Dae San;Kim, Ji Hoon;Seo, Suk Ho
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.21 no.7
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    • pp.191-200
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    • 2020
  • Tracked military vehicles are operated under harsher conditions and climates than ordinary vehicles, and the components require high degrees of reliability and durability. A diesel engine is the main power generator, and when the vehicle breaks down, there is a high possibility of causing a large-scale accident. Therefore, analyzing the cause of engine failure can be important for preventing similar cases that may occur. In this study, we clarified the mechanism of engine failure according to an overhaul test, hardness measurement, and an analysis of the fracture surface. The overhaul test confirmed that a bolt was separated from the connecting rod (number 4). In addition, the hardness measurement results of the connecting rod bolt conformed to the standard, and it was found that the bolt fracture was ductile fracture through an analysis of the fracture surface. Based on the results, it was concluded that damage to a diesel engine of a tracked military vehicle was caused by separating and damage caused by loosening of the connecting rod bolts, resulting in cascading damage. The results of the study could be used as reference examples and could be useful for another study on engine failure analysis.

A Study on Design for Reliability for the PBA of Warship based on Reliability Physics Analysis (신뢰성 물리학 분석 기반 함정탑재 PBA 신뢰성 설계에 대한 연구)

  • Cha, Jong-Han;Park, Kyoung-Deok;Lee, Ki-Won;Bak, Byeong-Ho;Kim, Hee-Earn;Kwon, Hyeong-Ahn
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.20 no.12
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    • pp.535-545
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    • 2019
  • The PBA of ship weapon system should be installed and operated under harsh environmental conditions and so it should be highly reliable to endure the mission profiles during its entire lifetime. In the case of PBA failure during operation, rapid maintenance is highly likely to be difficult due to problems such as supply of parts, which can have a devastating effect on the mission. In order to validate the reliability of PBA, a series of tests are performed with PBA samples, but they require time, testing facilities, samples, expenses and failure analysis if failed. The reliability of PBA is predicted on the basis of specifications such as MIL-HDBK-217F, but this specification does not take into account failure mechanisms for specific design details, environment and usage, interconnects and its characteristics that drive many failures of PBA in the field. Therefore, this study predicts the reliability of PBA using an RPA tool and proposes the RPA methodology as a validation process at the design stage. With RPA, it is now possible to achieve design validation including inherent failure mechanism, identification of weakest link, alternative design options, and test plan development.

The Assessing Comparative Study for Statistical Process Control of Software Reliability Model Based on Logarithmic Learning Effects (대수형 학습효과에 근거한 소프트웨어 신뢰모형에 관한 통계적 공정관리 비교 연구)

  • Kim, Kyung-Soo;Kim, Hee-Cheul
    • Journal of Digital Convergence
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    • v.11 no.12
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    • pp.319-326
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    • 2013
  • There are many software reliability models that are based on the times of occurrences of errors in the debugging of software. Software error detection techniques known in advance, but influencing factors for considering the errors found automatically and learning factors, by prior experience, to find precisely the error factor setting up the testing manager are presented comparing the problem. It is shown that it is possible to do asymptotic likelihood inference for software reliability models based on infinite failure model and non-homogeneous Poisson Processes (NHPP). Statistical process control (SPC) can monitor the forecasting of software failure and thereby contribute significantly to the improvement of software reliability. Control charts are widely used for software process control in the software industry. In this paper, we proposed a control mechanism based on NHPP using mean value function of logarithmic hazard learning effects property.

A Study of Testing Embedded System Software Based on Failure Mechanisms (고장메커니즘 기반의 임베디드 시스템 SW 테스트 방법에 관한 연구)

  • Jeong, Si-Young;Jang, Joong-Soon;Lee, Sang-Yong
    • Journal of Applied Reliability
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    • v.7 no.4
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    • pp.137-148
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    • 2007
  • Rapid increase of embedded systems in electronic and mechanical control systems requires reliable and error-free embedded software. State-based testing methods like FSM are usually used to assure the reliability of embedded software. However, because of possibility of explosion of test cases, only partial test cases are considered in practical tests, which cannot guarantee that all the possible errors are investigated. This study proposes a test procedure based on failure mechanisms that may occur in embedded systems, which can not only assure that certain kinds of possible errors are detected but reduce the testing time. The proposed procedure is applied to vehicle air control system.

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Reliability Estimation of Agricultural Machinery Components Based on QFD and Failure Mechanism Analysis (QFD와 고장메커니즘 분석에 의한 농기계부품의 신뢰성평가)

  • Jung, Won
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.33 no.4
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    • pp.209-217
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    • 2010
  • Reliability tools such as QFD and FMEA identify voice of customer related to product design, its use, how failures may occur, the severity of such failures, and the probability of the failure occurring. With these identified items, a development team can focus on the design process and the major issues facing the product in its potential use environment for the customer. The purpose of this research is to develop a reliability estimation process of agricultural machinery components using QFD, FMEA, and field failure data. Based on QFD method, customer requirements, engineering design elements and part characteristics were deployed. Using the field failure data, failures are investigated, and Weibull B10 life are estimated. This estimation process is useful for preparing the design input and planning the durability target.

Root cause analysis on the phenomenon of voltage drop of connector used in the automotive throttle body control (스로틀 바디 제어신호 전달용 커넥터의 이상전압 강하 현상 원인 규명)

  • Cho, Young-Jin;Chang, Seog-Weon
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1792-1797
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    • 2007
  • This paper try to find root-cause of failure in a connector used in transmitting signals for throttle body control in automotives by analyzing possible failure causes and performing experiments to simulate the cable failure in field. The connector comprises fins, wires, and case moldings. The failure is due to degradation of initial clamping force required fixing fins and wires in the connector. Expansion and compression of the case molding material surrounding fins would cause the degradation. Investigations of strict initial claming force and control of thermal expansion property of the molding are required to prevent the failure.

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A study on the structure-vibration analysis of power transformer(154kV Single Phase) (전력용 변압기(154kV 단상)의 구조진동 해석에 관한 연구)

  • Kim, Young-Dal;Park, Woo-Yong;Kim, Seun-Dae
    • Proceedings of the KIEE Conference
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    • 2008.04b
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    • pp.203-206
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    • 2008
  • 전력용 변압기의 고장 원인이 과도 진동에 의한 기계적 결함이 대부분을 차지하고 있으며, 그 원인 120Hz배수 조합으로 이루어진 진동이다. 전력용변압기에 작용되는 기계적 가진력을 유형별로 분류하고, 기계나 구조물에 미치는 진동전달 경로를 통해 전력용변압기의 기계적 손상 메커니즘을 규명한다. 일반적으로 120Hz 성분의 진동이 변압기변의 외함, 부싱, 부흐홀쯔, 방압변 및 탭체인쳐의 진동영향에 대해 확인하였다.

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