• Korean Journal of Materials Research
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• v.11 no.4
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• pp.258-265
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• 2001

Compression and bending test have been conducted to evaluate the mechanical performance of CFRC at several different temperature up to $2000^{\circ}C$ . Tools and several grips for the test at high temperature were designed to obtain mechanical properties of CFRP. A major cause of increasing strength according to increasing the density and the temperature were analyzed. SEM method was utilized to find out the damage and the fracture mechanism. The new simple equation for the L(span length)/h(beam height) of specimens and for the failure criterion on the 4 point bending were proposed.

• Journal of Advanced Marine Engineering and Technology
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• v.7 no.2
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• pp.36-49
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• 1983

최근 높은 경제성과 용접성의 우수성에 의한 마찰 용접의 응용에 있어서 내열.내식 재료가 개스터어빈, 기관, 핵 발전기등의 기계 부품 생산 공업에 널리 이용되고 있다. 따라서 이종내열 합금강의 마찰 용접된 부품을 이용함에 있어서 내식.내마모 및 용접성 뿐만 아니라 고온 피로 강도와 크리이프 강도 등의 복합 특성에 관한 연구가 요구되고 있다. 본 연구에서는 마르텐사이트계 실크롬 내열강과 오오스테나이트계 닉켈크롬 스테인레스강의 이종 내식.내열 합금강의 최적 용접조건하에서 마찰 용접된 후의 시효 열처리가 용접재의 700 .deg.C 고온 회전 굽힘 피로강도 특성에 미치는 영향에 관하여 실험과 강도해석에 의해 조사되었고 용접후의 용체화 처리와 시효 열처리법에 의한 내열강 마찰 용접강도 개선법을 개발코저한 것이다.

• Korean Journal of Materials Research
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• v.6 no.9
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• pp.878-884
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• 1996

본 연구는 가스압소결 질화규소의 혼합모드에 있어서 파괴거동을 실온 및 100$0^{\circ}C$에서 조사하였다. 실험은 누프압흔을 도입한 시험편을 사용하여 소둔처리에 의해 잔류응력을 제거하고, 4점굽힘법을 이용하였다. 실험결과, 종래 제창되고 있는 파괴기준과 일치하지 않고, 그래서 새롭게 4차관수의 근사식을 제안하였다.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.2
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• pp.45-51
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• 2020

As flexible electronics will be used under high temperature and high humidity with repeated bending deformations, the effects of environmental condition and repeated mechanical deformations are considered simultaneously to achieve long-term reliability. In this study, the mechanical reliability of metal electrodes (Al, Ag, Cu) deposited on flexible polymer substrate is investigated under 4 different conditions: with and without repeated mechanical deformations and normal environmental or high temperature and high humidity conditions (85℃/85%). The mechanical failure does not occur in all the metal electrodes without mechanical deformation even under high temperature and high humidity conditions. The electrical resistance of metal electrode increased about 400% to 600% after 100,000 bending cycles under normal condition. For high temperature and high humidity condition, the electrical resistance of Al and Ag increased similarly. However, the resistance of Cu during bending fatigue test under high temperature and high humidity condition increased over 90000% because of the combined effect of corrosion and mechanical fatigue. This study can give a helpful information for designing electrode materials with high mechanical reliability under high temperature and high humidity.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.2
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• pp.520-528
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• 1996

Four point bending tests of the brazed joint composed of sintered silicon nitride and 0.2% carbon steel with Cusil ABA filler which were fabricated at 86$0^{\circ}C$ were performed at temperatures, 25, 100, 200, 300, 400, 50$0^{\circ}C$ From the experiments, the maximum bending strength was measured at 30$0^{\circ}C$ From the 3D FE analysis of the residual stress of the brazed joint, it was revealed that the thermally induced residual stresses were minimized when the environmental temperature was 35$0^{\circ}C$ Considering the degradation of the filler material at high temperatures, it was calculated that the maximum bending strength of the brazed joint occured just below the temperature of the minimum thermal residual stress and the thermal residual stress was the dominative parameter of the brazed joint.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.49 no.10
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• pp.813-820
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• 2021

In this study, a low-velocity impact test was performed to obtain the dynamic properties of solid propellants. The dynamic behavior of the solid propellant was examined by measuring the force and displacement of the impactor during the low-velocity impact test. The bending displacement was calculated by compensating for the local displacement caused by the low-velocity impact test in the form of three point bending and the shear displacement caused by using a short and thick solid propellant specimen. Stress and strain were calculated using compensated displacements and measured force, and dynamic properties of solid propellants were obtained from the stress-strain curve and compared with static bending test. The dynamic properties of solid propellant under the low-velocity impact loading at various operating temperature conditions such as room temperature(20 ℃), high temperature(63 ℃), and low temperature(-32 ℃) were compared and investigated.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.1
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• pp.17-22
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• 2016

Flexible organic light-emitting diode (OLED) devices consist of multi-stacked thin films or layers comprising organic and inorganic materials. Due to thermal coefficient mismatch of the multi-layer films, warpage of the flexible OLED is generated during high temperature process of each layer. This warpage will create the critical issues for next production process, consequently lowering the production yield and reliability of the flexible OLED. In this study, we investigate the warpage behavior of the flexible OLED for each bonding process step of the multi-layer films using the experimental and numerical analysis. It is found that the polarizer film and barrier film show significant impact on warpage of flexible OLED, while the impact of the OCA film on warpage is negligible. The material that has the most dominant impact on the warpage is a plastic cover. In order to minimize the warpage of the flexible OLED, we estimate the optimal material properties of the plastic cover using design of experiment. It is found that the warpage of the flexible OLED is reduced to less than 1 mm using a cover plastic of optimized properties which are the elastic modulus of 4.2 GPa and thermal expansion coefficient of $20ppm/^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.21-28
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• 2010

Creep behaviors of the solder balls in a flip chip package assembly during thermal cycling test is investigated.. A material models used in the finite element analysis are viscoplastic model introduced by Anand and creep model called partitioned model. Experiment of two temperature cycles using moir$\acute{e}$ interferometry is conducted to verify the reliability of material models for the analysis of thermo-mechanical behavior. Bending deformations of the assemblies and average strains of the solder balls due to temperature change and dwell time are investigated. The results show that time-dependent shear strain of solder by the partitioned model is in excellent agreement with those by moir$\acute{e}$ interferometry, while there is considerable difference between results by Anand model and experiment. In this paper, the partitioned model is employed for the time-dependent creep analysis of the FC-PBGA package. It is also shown that the thermo-mechanical stress becomes relaxed by creep behavior at high temperature during temperature cycles.