• Composites Research
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• v.29 no.4
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• pp.203-208
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• 2016

Metal and polymer sandwich composites, which are made of sheet metal sheath and polymer or fiber reinforced plastic core, have been reconsidered as an alternative to sheet metal due to their lightness and multifunctional properties such as damping and sound-proof properties. For the successful applications of these composites, the delamination prediction based on the adhesion strength is important element. In this study, the numerical simulation of the delamination behavior of polymeric adhesive tapes with metallic surfaces was performed using cohesive zone elements and finite element software. The traction-separation law of the cohesive zone element was defined using the fracture energy derived from peel mechanics and experimental results from peel test and implemented in finite element software. The peel test of the polymeric adhesive film against steel surface was simulated and compared with experiments, demonstrating reasonable agreement between simulation and experiment.

• Journal of the korean academy of Pediatric Dentistry
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• v.40 no.2
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• pp.89-97
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• 2013

The purpose of this study is to investigate fluoride release in the oral cavity from polymer adhesive tape which is NaF coated PVA. 45 healthy adults were divided into 3 groups by the type of topical fluoride applied: 60seconds taste$^{(R)}$ APF gel (group 1), FluoroDose$^{(R)}$ varnish (group 2) and NaF-PVA (group 3). Topical fluoride was applied to the facial surface of maxillary 12 teeth and unstimulated whole saliva was collected to measure fluoride release after 1, 3, 6, 12, 24, and 48 hours. Fluoride-sensitive electrode was used for measuring the fluoride concentration in the saliva samples. All three groups showed significantly higher value for fluoride concentration than the baseline after 1 and 3 hours (p < 0.05). After 6 hours, group 3 showed significantly higher fluoride concentration than the baseline (p < 0.05) and also showed significantly higher value for fluoride concentration than group 1 and group 2. Between group 1 and group 2, however, there was no significant difference statistically with respect to fluoride concentration value (p > 0.05).

• Polymer(Korea)
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• v.37 no.2
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• pp.184-195
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• 2013

Acrylic pressure sensitive adhesive (PSA) tapes were used for the automotive, the electrical and the electronic industries and the display module junction. In this study, the manufacture of high-strength structural tape used 2-ethylhexyl acrylate (2-EHA) and acrylic acid (AAC), and UV irradiation for photo-polymerization, and the semi-structural properties of acrylic PSA tape with the AAC content and inorganic filler $SiO_2$ content were investigated. The initial adhesion strength was lowered by the rigidity of molecule chains due to the use of AAC, and the adhesion strength increased with increasing wetting time. The wetability, contact angle, and SEM images of PSA tapes with various contents of AAC were determined. Without filler, the peel strength and dynamic shear strength of PSA tape showed inverse correlation but the peel strength and dynamic shear strength increased with increasing filler content. From these correlations the PSA tapes could be optimized for the applications requiring high performance.

• Polymer(Korea)
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• v.38 no.3
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• pp.397-405
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• 2014

To manufacture of high-performance semi-structural double-sided adhesive tape, 2-ethylhexyl acrylate (2-EHA) and acrylic acid (AAC) were used, and the syrup was prepared by UV irradiation in this study. The effects of the thickness, various inorganic filler contents, and filler types on the semi-structural properties of acrylic double-sided adhesive tape were investigated. The peel strength increased with increasing thickness and wetting time. In case of the thin thickness (under $250{\mu}m$) with decreasing true density of inorganic filler, the peel strength increased with increasing wetting time. The initial peel strength showed a higher value at a big size of inorganic filler, and the filler's size in adhesive tapes was confirmed by SEM images. The peel strength and dynamic shear strength increased as a proportional relationship with various inorganic fillers and contents, and these inorganic fillers in $0.1{\mu}m$ thickness indicated more effect on the dynamic shear strength of double-sided adhesive tape. From these results the thin acrylic double-sided adhesive tape determined to be use for applications as a high-performance semi-structural.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2001.04a
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• pp.156-157
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• 2001

최근 제지업계는 원가절감과 환경보전을 위하여 고지 재활용율 증대와 공정 폐쇄화 를 추구하고 있다. 이와 같은 변화는 특히 국산 고지의 활용 비율이 높은 골판지 원지 공정 에서 여러 가지 문제를 유발하는 원인이 되고 있으며, 그 가운데에서도 점착성 이물질에 의 한 공정 오염과 이에 따른 생산성과 제품의 품질 저하가 심각한 문제점으로 대두되고 있다. 점착성 이물질, 즉 스닥키는 공정개선이나 제품 품질의 향상을 위해 투입되는 고분자 첨가 제와는 달리 주로 고지에 함유되어 있는 핫벨트, 점착성 테이프, 라벨, 도공파지 혹은 OMG 로부터 유래되는 합성고분자로 라텍스, 영크, 복사 토너 등 다양한 조성을 지니며 그 크기에 따라 매크로 스틱키와 마이크로 스틱키로, 성질에 따라 일차 스틱키와 이차 스틱키로 구분 된다. 매크로 스틱키는 일반적으로 라이너지 지료에서 0.15mm의 슬롯크기를 가지는 스크린 에 의해 걸러지는 점착성 이물질을 말하며, 마이크로 스틱키는 그 이하의 크기를 갖는 스탁 키를 일걷는다. 또 일차 스틱키는 고지 해리 시 발생한 스틱키를, 이차 스틱키는 계 내에 분 산된 상태로 존재하다 환경의 변화에 의하여 점착성을 나타내는 스틱키를 말한다.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.111-118
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• 2018

In order to develop a local stiffness-variant stretchable substrate with the soft PDMS/hard PDMS/FPCB configuration consisting of two stiffness-different polydimethylsiloxane (PDMS) parts and flexible printed circuit board, a FPCB was bonded to PDMS using the acrylic-silicone double-sided tape and the interfacial adhesion of the PDMS/FPCB was evaluated. The pull strength of the FPCB, which was bonded to the fully cured PDMS using the silicone adhesive of the double-sided tape, was 259 kPa and the delamination during the pull test occurred at the interface between the PDMS and the silicone adhesive. On the contrary, the bonding process, for which the FPCB was bonded using the silicone adhesive to the PDMS partially cured for 15~20 minutes at $60^{\circ}C$ and then the PDMS was fully cured for 12 hours at $60^{\circ}C$, exhibited the remarkably enhanced pull strength of 1,007~1,094 kPa. With the above mentioned bonding process, the delamination during the pull test was observed at the interface between the FPCB and the acrylic adhesive of the acrylic-silicone double sided tape.

• Polymer(Korea)
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• v.39 no.3
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• pp.514-521
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• 2015

In this study, we would like to describe peel strength and dynamic shear property on various substrates of multi-layered structural double-sided adhesive tape with or without adhesive (AD) prepared by UV curing for an automobile, construction, and display junction. According to adapt the adhesive, the peel and dynamic shear strength of adhesion tape prepared with acrylic foam or various plastic substrates increased with increasing molecular weight, however, decreased over 650000 molecular weight. The adhesion property shows high value at the thin AD layer with decreasing temperature. The interface property shows highest at MW 615000 (AD-4), and the interface junction below MW 615000 resulted to divide from acrylic foam and adhesive layer. From this study, the multi-layered structural double-sided adhesive tapes seem to be a useful for industrial area such as a low surface energy plastic material and curved substrate.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.4
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• pp.503-509
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• 2019

The demand for smaller, faster, and multi-functional mobile devices in increasing at a rapidly increasing rate. In response to these trends, Stacked Chip Scale Package (SCSP) is used widely in the assembly industry. A film type adhesive called die attach film (DAF) is used widely for bonding chips in SCSP. The DAF requires high flowability at high die attachment temperatures for bonding chips on organic substrates, where the DAF needs to feel the gap depth, or for bonding the same sized dies, where the DAF needs to penetrate bonding wires. In this study, the mixture design of experiment (DOE) was performed for three raw materials to obtain the optimized DAF recipe for low elastic modulus at high temperature. Three components are acrylic polymer (SG-P3) and two solid epoxy resins (YD011 and YDCN500-1P) with different softening points. According to the DOE results, the elastic modulus at high temperature was influenced greatly by SG-P3. The elastic modulus at $100^{\circ}C$ decreased from 1.0 MPa to 0.2 MPa as the amount of SG-P3 was decreased by 20%. In contrast, the elastic modulus at room temperature was dominated by YD011, an epoxy with a higher softening point. The optimized DAF recipe showed approximately 98.4% pickup performance when a UV dicing tape was used. A DAF crack that occurred in curing was effectively suppressed through optimization of the cure accelerator amount and two-step cure schedule. The imizadole type accelerator showed better performance than the amine type accelerator.

• Journal of the Korean Vacuum Society
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• v.18 no.1
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• pp.1-8
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• 2009

Hydrophilic Surface modification of Polysarene (PS) was performed by Atmospheric Pressure Plasma (APP). Air or 0, gases were used for carrier gases and RF power was changed from 150 to 350 W. We controlled the treatment time as 1 time to 4 time passing through the plasma region. when the carrier gas was air, the water contact angle on the PS surface was decreased from $91^{\circ}$ to $20^{\circ}$. And the surface energy increased from 45.74 dyne/cm to 68.48 dyne/cm. In case of the $O_2$ plasma treatment, at 300 W of RF power and 4 times treatment, the water contact angle on the PS. Surface was decreased from $91^{\circ}$ to $17^{\circ}$ and the surface energy was increased from 45.74 dyne/cm to 69.73 dyne/cm. The surface energy was increased by polar force not by dispersion force. Improvement of surface properties can be explained by the formation of new hydrophilic groups which is identified as C-O, C=O by XPS analysis. The contact angle of APP treated PS surface kept in air was increased with time elapse, but maintained same value when it was kept in water. We treated the PS surface by APP and deposited Cu as $4,000\;{\AA}$ and $8,000\;{\AA}$ by thermal evaporation. The adhesion between sample and Cu thin film improvement of treated PS surface against untreated sample. could be verifiable by Tape test (ASTM D3359)