• Title/Summary/Keyword: 계면 전단강도

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Analysis of Interfacial Shear Strength of Fiber/Epoxy Composites by Microbond Test and Finite Element Method (미소접합시험과 유한요소법을 통한 섬유/에폭시 복합재의 계면 전단강도 해석)

  • Kang, Soo-Keun;Lee, Deok-Bo;Choi, Nak-Sam
    • Composites Research
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    • v.19 no.4
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    • pp.7-14
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    • 2006
  • Interfacial shear strength between epoxy and carbon fiber has been analyzed utilizing the microbond specimen with an epoxy micro-droplet adhered onto single carbon fiber. The interfacial shear stress distributions along the fiber/matrix interface were calculated by finite element analysis using three kinds of finite element models such as droplet model, circular-crosssection model and pull-out model. Conclusions were obtained as follows. (1) Interfacial shear stress distribution showed that larger stresses were concentrated in the fiber/matrix interface for microbond test than for pull-out test. Thus, debonding at the fiber/matrix interface during microbond test was liable to occur at low load level. (2) Microbond test showed higher interfacial strength which was caused by various effects of micro-droplet geometry and size as well as stress concentration in the region contacting with the micro-vise tip.

Interfacial shear strength test by a hemi-spherical microbond specimen of carbon fiber and epoxy resin (탄소섬유/에폭시의 반구형 미소접합 시험편에 대한 계면강도 평가)

  • Park, Joo-Eon;Gu, Ja-Uk;Kang, Soo-Keun;Choi, Nak-Sam
    • Composites Research
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    • v.21 no.4
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    • pp.15-21
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    • 2008
  • Interfacial shear strength between epoxy and carbon fiber was analyzed utilizing a hemi-spherical microbond specimens adhered onto single carbon fiber. The hemi-spherical microbond specimen showed high regression coefficient and small standard deviation in the measurement of interfacial strength as compared with a droplet and an inverse hemi-spherical one. This seemed to be caused by the reduced meniscus effects and the reduced stress concentration In the region contacting with a pin-hole loading device. Finite element analysis showed that the stress distributions along the fiber/matrix interface in the hemi-spherical specimen had a stable shear stress distribution along the interface without any stress mode change. The experimental data was also different according to the kinds of loading device such as the microvise-tip and the pin-holed plate.

Effects of Thermal and Mechanical Fatigue Stress on Bond Strength in Bracket Base Configurations (열적, 기계적 피로응력이 교정용 브라켓의 결합강도에 미치는 영향)

  • Kim, Jong-Ghee;Kim, Sang-Cheol
    • The korean journal of orthodontics
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    • v.30 no.5 s.82
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    • pp.625-642
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    • 2000
  • The purpose of this study is to evaluate the effects of mechanical and thermal fatigue stress on the shear, tensile and shear-tensile combined bond strengths(SBS, TBS, CBS) in various orthodontic brackets bonded to human premolars with chemically cured adhesive(Ortho-one, Bisco, USA). Five types of commercially available metal brackets with various bracket base configurations of Photoetched base(Tomy, Japan), Non-Etched Foil Mesh base(Dentaurum, Germany), Micro-Etched Foil Mesh base(Ortho Organizers, USA), Chessboard base(Daesung, Korea), and Integral base(3M Unitek, USA) were used. Samples were divided into 3 groups, the first group was acted with shear-tensile combined loads($45^{\circ}$) of 200g for 4 weeks(mechanical fatigue stress), the second group was subjected to the 5,000 thermocycles of 15 second dwell time each in $5^{\circ}C\;and\;55^{\circ}C$ baths(thermal fatigue stress), and the third group was the control. Bond strengths were measured at the crosshead speed of 0.5mm/min. The cross-section of bracket base/adhesive interface and the fracture surface were examined with the stereoscope and the scanning electron microscope. The resin remnant on bracket base surface was assessed by ART(Adhesive Remnant Index). The obtained results were summarized as follows, 1. In static bond strength, Photoetched base bracket showed the maximum bond strength and Integral base bracket showed the minimum bond strength(p<0.05). In all brackets, shear bond strength(SBS) was in the greatest value and shear-tensile combined strength(CBS) was in the least value(p<0.05). 2. After mechanical fatigue test, Photoetched base bracket showed the maximum bond strength and Integral base bracket showed the minimum bond strength(p<0.05). In Photoetched base bracket and Micro-Etched Foil Mesh base bracket, shear bond strength(SBS), tensile bond strength(TBS) and shear-tensile combined strength(CBS) were decreased after mechanical fatigue test(p

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Interfacial Evaluation of Single Ramie and Kenaf Fibers/Epoxy Composites Using Micromechanical Technique (Micromechanical 시험법을 이용한 Kenaf 및 Ramie 섬유 강화 에폭시 복합재료의 계면물성 평가)

  • Park, Joung-Man;Tran, Quang Son;Jung, Jin-Gyu;Kim, Sung-Ju;Hwang, Byung-Sun
    • Journal of Adhesion and Interface
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    • v.6 no.2
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    • pp.13-20
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    • 2005
  • Interfacial shear strength (IFSS) of environmentally friendly natural fiber reinforced polymer composites plays a very important role in controlling the overall mechanical performance. The IFSS of various Ramie and Kenaf fibers/epoxy composites was evaluated using the combination of micromechanical test and nondestructive acoustic emission (AE) to find out optimal conditions for desirable final performance. Dynamic contact angle was measured for Ramie and Kenaf fibers and correlated the wettability properties with interfacial adhesion. Mechanical properties of Ramie and Kenaf fibers were investigated using single-fiber tensile test and analyzed statistically by both uni-and bimodal Weibull distributions. An influence of clamping effect on a real elongation for both Ramie and Kenaf fibers were evaluated as well. Two different microfailure modes, axial debonding and fibril fracture coming from fiber bundles and single fiber composites (SFC) were observed under tension and compression.

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Effect of Cu Containing Solders on Shear Strength of As-soldered BGA Solder Joints (BGA 솔더 조인트의 전단강도에 미치는 Cu 첨가 솔더의 영향)

  • 신창근;정재필;허주열
    • Journal of the Microelectronics and Packaging Society
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    • v.7 no.2
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    • pp.13-19
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    • 2000
  • Shear strengths of BGA solder joints on Cu pads were studied for Cu-containing Sn (0, 1.5, and 2.5 wt.% Cu) and Sn-40Pb (0 and 0.5wt.% Cu) solders, with emphasis on the roles of the Cu-Sn intermetallic layer thickness and the roughness of the interface between the intermetalic layer and solder. The shear strength test was performed for as-soldered solder joints with various soldering reaction times up to 4 min. The addition of Cu to the pure Sn solder results in an enhanced growth of the intermetallic layer whereas the effect of Cu addition to the Sn-40Pb solder is primarily on the reduction of the roughness of the intermetallic/solder interface. The critical thickness of the intermetallic layer for a maximum shear strength depends on the solder materials, which was measured to be ~ 2.3 $\mu\textrm{m}$ for Sn-Cu solders and ~ 1.2 $\mu\textrm{m}$ for Sn-Pb-Cu solders. The shear strength at the critical intermetallic layer thickness seems to increase as the intermetallic/solder interface becomes rougher. This is in accordance with the observation that the sheared fracture occurred initially within the solder tends to shift towards the intermetallic/solder interface as the intermetallic layer grows above the critical thickness.

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Evaluation of Friction Properties between Geostrip/Sandpaper Interface (지오스트립/샌드페이퍼 계면에서의 마찰특성 평가)

  • Lim, Ji-Hye;Byun, Sung-Won;Jeon, Han-Yong
    • Journal of the Korean Geosynthetics Society
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    • v.5 no.4
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    • pp.27-33
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    • 2006
  • Frictional properties between geostrip and sand paper interface were estimated considering soil particle size also the friction coefficients and angles were determined with normal stress. Three kinds of geostrips of design strength 50, 70, 100 KN/m were used and 5 sandpapers of P100, P220, P320, P400, P600 were used also. Shear strength between geostrip and sand paper interface with design strength showed big difference and this is due to the uniform surface pattern of each geostrip when contact to sandpaper without regard to design strength. Shear strength of geostrip was increased with design strength and geostrips/P100 sandpaper interface showed the biggest value. Finally, all of geostrips showed the decrease phenomena of post-peak strength and this is due to the abrasion of geostrip surface by shear test.

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Comparison of Shear Strength and Shear Energy for 48Sn-52In Solder Bumps with Variation of Reflow Conditions (리플로우 조건에 따른 Sn-52In 솔더범프의 전단응력과 전단에너지 비교)

  • Choi Jae-Hoon;Oh Tae-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.4 s.37
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    • pp.351-357
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    • 2005
  • Comparison of shear strength and shear energy of the 48Sn-52In solder bumps reflowed on Cu UBM were made with variations of reflow temperature from $150^{\circ}C$ to $250^{\circ}C$ and reflow time from 1 min to 20 min to establish an evaluation method for the mechanical reliability of solder bumps. Compared to the shear strength, the shear energy of the Sn-52In solder bumps was much more consistent with the solder reaction behavior and the fracture mode at the Sn-52In/Cu interface, indicating that the bump shear energy can be used as an effective tool to evaluate the mechanical integrity of solder/UBM interface.

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Shear Strength of Sn-3-5Ag-$\chi$Bi Solder Balls Reflowed on Cu/Ni-Co/Au Metallizations (Bi가 첨가된 Sn-3.5Ag 솔더볼과 Cu/Ni-Co/Au 하부층과의 접합 강도 연구)

  • Shin, Seung-Woo;Yoo, Jin
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.05a
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    • pp.98-103
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    • 2002
  • BGA(Ball Grid Array) 패키지의 솔더볼 패드 중의 하나인 Au/Ni-Co/Cu 금속층 위에 Bi가 첨가된 Sn-3.5Ag-$\chi$Bi 솔더볼을 리플로우시켰다. 리플로우한 후 130 $^{\circ}C$에서 열처리함에 따른 계면상 및 솔더 내부의 상변화를 관찰하였다. 계면에는 (Ni,Co)$_3$Sn$_4$외에 (Au,Ni,Co,Bi)Sn$_4$가 생성되었음을 관찰할 수 있었고, 솔더 내부에는 (Au,Ni,Co,Bi)SH$_4$, Ag$_3$Sn, Bi 상이 혼재되어 있었다. Nano-indentation에 의한 경도 측정 결과, Bi 함량 증가에 따라 경도는 증가하였으나, 볼전단(Ball Shear) 테스트 결과는 Bi가 증가됨에 따라 오히려 볼전단 강도값이 감소하였다. 이는 파면 검사 결과, 파괴 경로가 주로 계면의 금속간 화합물과 솔더 사이에서 진행함에 기인한 것이다. 솔더 내부의 파괴 경로를 가진 2.5Bi가 가장 우수한 볼전단 강도값을 나타내었는데, 이는 솔더내의 Bi의 고용강화에 기인한 것으로 보인다.

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Beam Tests for Static and Fatigue Interface Shear Strength between Old and Njew Concretes (신구콘크리트 계면의 전단강도 측정을 위한 정하중 및 피로하중 보실험)

  • 최동욱
    • Magazine of the Korea Concrete Institute
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    • v.9 no.3
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    • pp.137-147
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    • 1997
  • Interface shear strength of' concrete under static loading and deterioratiion of interface strength by fatigue loading in shear were experimentally investigated using composite beam test specimens. Thirteen beams were constructed. Five composite beams were tested statically until interface delaminations were observed in the static tests. Seven composite beam and one monolithically cast beam were subjected to two to three million cycles of fatigue load. Test variables were interface roughness, interface shear reinforcement, and presence of interface bond. The average interface shear strength of the composite beams with bonded-rough interface was 6, 060 kPa. No interface delamination was observed after cycling for the composite beams with bonded - rough interface and interface bond was not influenced by repeated application of the shear stress of 2.000 kPa(about 1/3 of the static interface shear strength). Smooth interface and unbonded-rough interface with shear reinforcement deteriorated under repeated shear loading.

Evaluation of Mechanical Property of Carbon Fiber/Polypropylene Composite According to Carbon Fiber Surface Treatment (탄소섬유 표면처리에 따른 탄소섬유/폴리프로필렌 복합재료의 기계적 물성 평가)

  • Han, Song Hee;Oh, Hyun Ju;Kim, Seong Su
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.37 no.6
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    • pp.791-796
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    • 2013
  • In this study, the mechanical properties of a carbon fiber/polypropylene composite were evaluated according to the carbon fiber surface treatment. Carbon fiber surface treatments such as silane coupling agents and plasma treatment were performed to enhance the interfacial strength between carbon fibers and polypropylene. The treated carbon fiber surface was characterized by XPS, SEM, and single-filament tensile test. The interlaminar shear strength (ILSS) of the composite with respect to the surface treatment was determined by a short beam shear test. The test results showed that the ILSS of the plasma-treated specimen increased with the treatment time. The ILSS of the specimen treated with a silane coupling agent after plasma treatment increased by 48.7% compared to that of the untreated specimen.