• Journal of the Korean Wood Science and Technology
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• v.32 no.5
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• pp.29-38
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• 2004

In this study, we investigated the thermal properties of corn-starch filled polybutylene succinate-adipate (PBS-AD) bio-composites. Thermal analysis (TA) is used to describe the analytical method for measuring the chemical property and weight loss of composite materials as a function of temperature. The thermal stability of corn-starch was lower than that of pure PBS-AD. As corn-starch loading increased, the thermal stability and degradation temperature of the bio-composites decreased and the ash content increased. It can be seen that the degree of compatibility and interfacial adhesion of the bio-composites decreased because of the increasing mixing ratio of the corn-starch. As the content of corn-starch increased, there was no significant change in the glass transition temperature (T_g) and the melting temperature (T_m) for the bio-composites. The storage modulus (E') and loss modulus (E") of the corn-starch flour filled PBS-AD bio-composites were higher than those of PBS-AD, because of the incorporation of corn-starch increased the stiffness of the bio-composites. At higher temperatures, the decreased storage modulus (E') of bio-composites was due to the increased polymer chain mobility of the matrix polymer. From these results, we can expect that corn-starch has potential as a reinforcing filler for bio-composites. Furthermore, we recommend using a coupling agent to improve the interfacial adhesion between corn-starch and biodegradable polymer.

• Korean Journal of Crystallography
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• v.20 no.1
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• pp.1-8
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• 2009

이온산란 분광법(ISS: Ion Scattering Spectroscopy)은 표면 원자의 구조를 러더포드 후방산란법(RBS: Rutherford Backscattering Spectroscopy) 등과 같이 실공간에 대하여 직접 정보를 얻는 방법이다. 그 중에서도 산란각도를 $180^{\circ}$로 고정하여 산란이온 검출기를 설치한 직충돌 이온산란 분광법(ICISS: Impact Collision Ion Scattering Spectroscopy)은 산란된 이온의 궤적이 입사궤도와 거의 동일하기 때문에 산란궤적의 계산이 간단해지고, 최외층 뿐만 아니라 표면에서 수 층 깊이의 원자구조의 해석이 가능하다. 또한 비행시간형(TOF: Time-Of-Flight) 분석기를 채택하여 산란 이온 및 중성원자를 동시에 측정하면 입사 이온의 표면에서의 중성화에 관계 없이 산란 신호를 얻으므로 표면 원자의 결합 특성에 영향 받지 않고 사용할 수 있다. 본고에서는 ICISS의 원리, 장치, 측정방법 등을 소개한 제1편 및 반도체 표면구조, 금속/반도체 계면 등의 해석에 관하여 기술한 제2편에 이어서 세라믹 재료의 표면 원자 구조, 세라믹 박막의 원자 구조, 흡착 기체의 구조, 원소의 편석 등에 관한 연구 사례를 소개하고자 한다.

• Journal of Adhesion and Interface
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• v.23 no.2
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• pp.25-32
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• 2022

There has been a growing demand for water based-type PSA due to environmental regulations for solvent-type PSA. And accordingly, there is a growing expectation as well for tackifiers used to compensate for the problem of deterioration of physical properties. Therefore, In this study, water-based tackifiers were synthesized by changing the contents of hard and functional acrylic monomers CHMA, IBOA, and AA. And these were added to the pressure-sensitive adhesive at 10 phr and their physical properties were compared. Tackiness slightly decreased as CHMA increased and IBOA decreased. Since the intermolecular bonding force increased due to the increase in AA content, the lower the AA content showed better results. Peel strength increased as the tackifiers were added because the fluidity of the polymer chain increased. And higher AA content showed better results because more hydrogen bonds were formed. The holding power tended to decrease as CHMA increased because the content of IBOA relatively decreased which has a large influence on the holding power. And higher AA content showed better results.

• Journal of Adhesion and Interface
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• v.22 no.2
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• pp.47-56
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• 2021

Steel plates coated by self-healable polymer still can be rusted since it takes time to be healed. In this study, dual self-healing coating material is developed using corrosion inhibitor (DTBEDA) which can form hindered urea (HUB) as reversible cross-linking bond at the same time. Developed dual self-healing polymer is coated on steel plate, and scratch healing property was investigated by surgical blades and nano/micro indentation tester. The anticorrosion effect of DTBEDA was investigated by electrochemical impedance spectroscopy (EIS).

• The korean journal of orthodontics
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• v.40 no.5
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• pp.342-348
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• 2010

Objective: The aim of this study was to compare the shear bond strengths (SBS) of orthodontic brackets bonded to enamel with a self-etching primer after bleaching, desensitizer application and combined treatment. Methods: Forty-eight premolars were randomly divided into four groups, each with n = 12 premolar samples. The four groups were; Group1: 15% hydrogen-peroxide office bleaching agent (Illumin$\acute{e}$ Office-IO), Group 2: IO + BisBlock Oxalate Dentin-Desensitizer, Group 3: Bis Block Oxalate Dentin-Desensitizer, Group 4: No treatment (control). Twenty-four hours after bonding, the specimens were tested in SBS at a crosshead speed of 5 mm/min until the brackets debonded. The failure mode of the brackets was determined by a modified adhesive remnant index. Results: Bleaching, bleaching and desensitizer treatment, and desensitizer treatment alone all significantly reduced SBS of the orthodontic brackets ($p$ = 0.001). No statistically significant difference was found between Group 1, Group 2 and Group 3 (Group 1-Group 2, $p$ = 0.564; Group 1-Group 3, $p$ = 0.371; Group 2-Group 3, $p$ = 0.133). The predominant mode of failure for the treatment groups (Group1, Group 2 and Group 3) was at the enamel-adhesive interface leaving 100% of the adhesive on the bracket base. Conclusions: Bleaching and desensitizer treatment should be delayed until the completion of orthodontic treatment.

• Journal of the korean academy of Pediatric Dentistry
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• v.28 no.4
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• pp.566-574
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• 2001

For decades it has been a clinically accepted requirement, in case of salivary contamination, to re-etch conditioned enamel and dentin to proceed with the adhesive technique. Only a few reports have been so far dealing with the potential of one-bottle adhesive system to bond even when applied after salivary contamination and without re-etching. The purpose of this study was to evaluate the influence of the salivary contamination on the shear bond strength of dentin. The results were as follows: 1. In group II, in which saliva contamination and washing occurred before applying of Prime & Bond NT showed high shear bond strength as in control group. In Group III and IV, in which the cured adhesive was contaminated with saliva, showed significantly lower mean bond strength, 2. Relating long resin tags of $70\sim120{\mu}m$ were observed in samples of all groups under SEM. We could observed hybrid layer, resin tag and many lateral branches in every group. And there were no differences between groups.

• Polymer(Korea)
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• v.39 no.2
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• pp.240-246
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• 2015

Formation of a strong 3-dimensional interfacial network structure via chemical reaction between hydroxyl group on silica surface and NR chain by the addition of bis(triethoxysilylpropyl)tetrasulfide (TESPT) into silica-filled NR compound was observed by using Py-GC/MS and SEM. Addition of TESPT into silica-filled NR compound decreased scorch time ($t_{10}$) due to increased sulfur content, and reduced cure rate index (CRI) via continuous reaction between sulfur atoms in TESPT, which acted as a sulfur donor, and activators and/or accelerators. Addition of TESPT in the compound improved processability and mechanical properties of the compound. Overall, we observed that the addition of TESPT into the silica-filled NR compound formed a silica-TESPT-NR network, and thus the degree of crosslinking was increased resulting in improved mechanical properties.

• Journal of the korean academy of Pediatric Dentistry
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• v.29 no.4
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• pp.509-518
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• 2002

The purpose of this study was to evaluate the bonding of compomer to deciduous dentin which is known to have been developed to improve the weak properties of glass ionomer cement and composite resin. 120 sound primary molars were used for the shear bond strength test and another 24 for the scanning electron microscopic evaluation. Each material was ailed into polyethylene mold attached to exposed dentinal surface($3{\times}4mm$ in diameter) of sample blocks. Shearbond strength was measured using Universal testing machine and data were analyzed statistically with Oneway-ANOVA and Scheffe test. Scanning electron microscopic observation was performed in order to evaluate the pattern of distribution and penetration of resin tags and hybrid layer. Compomer groups(II-V) showed significantly higher bond strength values than glass ionomer group(I)(p<.05). Etching-compomer groups(III, V) showed the significantly higher bond strength than non-etching compomer groups(II, IV)(p<.05), but slightly lower values than composite resin group(VI) with no statistically significant difference(p>.05). No significantly different bond strength was found between compomer groups of different bonding system(p>.05). Scanning electron micrographs showed more irregular distribution of short and thin resin tags in non-etching compomer groups(II, IV) whereas the more regular and intimate distribution of long and thick tags in etching compomer groups(III, V) and composite resin group(VI). The evaluation of hybrid layer also showed more regular formation of thicker layer in etching compomer groups(III, V). Based on the results of present study, the use of compomer as an esthetic restorative material for primary molars might be justified.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.106-106
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• 1999

반도체 소자가 소브마이크론 이하로 집적화 되어감에 따라, RC 신호 지연 및 간섭 현상, 전력 소비의 증가 문제가 심각하게 대두되고 있다. 이러한 문제를 개선하기 위해서는, 현재 층간 절연막으로 상용화되어 있는 SiO2 박막을 대체할 저유전율 박막의 개발이 필수적이며, 많은 연구자들이 여러 가지 새로운 유기물질과 무기물질은 제안하고 있다. 반도체 공정상의 적합성을 고려할 때, 이들 여러물질 중에서 알킬기를 함유한 SiO2 박막(이하 'Si-O-C-H 박막'으로 표기)에 많은 관심이 집중되고 있다. Si-O-C-H 박막은 알킬기에 의해 형성된 나노 스케일의 기공에 의해 작은 유전율을 가지게 된다. 따라서, 박막내의 알킬기의 함유량이 많을수록 보다 작은 유전율을 얻을 수 있다. 그러나 과다한 알킬기의 함유는 Si-O-C-H 박막의 열적 특성을 열화시키는 부정적인 효과도 있다. 본 연구에서는 bis-trimethylsilylmethane(BTMSM, H9C3-Si-CH2-Si-C3H9) precursor를 이용하여 Si-O-C-H 박막을 증착하였다. BTMSM precursor의 중요한 특징중 하나는, 두 실리콘 원자 사이에 Si-CH2 결합이 존재한다는 사실이다. Si-CH2 결합은 양쪽의 Si에 의해 강하게 결합되어 있어서, BTMSM precursor를 사용하여 Si-O-C-H 박막은 유전상수도 작을 뿐 아니라, 열적으로도 안정된 특성이 얻어질 것으로 기대된다. Si-O-C-H 박막의 열적 안정성을 평가하기 위하여, 고온 열처리 전후의 FT-IR 스펙트럼 분석과 C-V(capacitance-voltage) 측정에 의한 유전상수 변화를 살펴보았다. 또한 증착된 박막의 미세구조 및 step coverage 특성 관찰을 위하여 SEM(scanning electron microscopy) 및 TEM(transmission electron micfroscopy) 분석을 하였다. 변화하였으며 이는 포토루미네슨스의 변화의 원인으로 판단된다. 연구하였다. CeO2 와 Si 사이의 계면을 TEM 측정에 의해 분석하였고, Ce와 O의 화학적 조성비를 RBS에 의해 측정하였다. Si(100) 기판위에 증착된 CeO2 는 $600^{\circ}C$ 낮은 증착률에서 seed layer를 하지 않은 조건에서 CeO2 (200) 방향으로 우선 성장하였으며, Si(111) 기판 위의 CeO2 박막은 40$0^{\circ}C$ 높은 증착률에서 seed layer를 2분이상 한 조건에서 CeO2 (111) 방향으로 우선 성장하였다. TEM 분석에서 CeO2 와 Si 기판사이에서 계면에서 얇은 SiO2층이 형성되었으며, TED 분석은 Si(100) 과 Si(111) 위에 증착한 CeO2 박막이 각각 우선 방향성을 가진 다결정임을 보여주었다. C-V 곡선에서 나타난 Hysteresis는 CeO2 박막과 Si 사이의 결함때문이라고 사료된다.phology 관찰결과 Ge 함량이 높은 박막의 입계가 다결정 Si의 입계에 비해 훨씬 큰 것으로 나타났으며 근 값도 증가하는 것으로 나타났다. 포유동물 세포에 유전자 발현벡터로써 사용할 수 있음으로 post-genomics시대에 다양한 종류의 단백질 기능연구에 맡은 도움이 되리라 기대한다.다양한 기능을 가진 신소재 제조에 있다. 또한 경제적인 측면에서도 고부가 가치의 제품 개발에 따른 새로운 수요 창출과 수익률 향상, 기존의 기능성 안료를 나노(nano)화하여 나노 입자를 제조, 기존의 기능성 안료에 대한 비용 절감 효과등을 유도 할 수 있다. 역시 기술적인 측면에서도 특수소재 개발에 있어 최적의 나노 입자 제어기술 개발 및 나노입자를 기능성 소재로 사용하여 새로운 제품의 제조와 고압 기상 분사기술의 최적화에 의한 기능성 나노 입자 제조 기술을 확립하고 2차 오염 발생원인 유기계 항균제를 무기계 항균제로 대

• Journal of the Korea Organic Resources Recycling Association
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• v.31 no.1
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• pp.35-45
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• 2023

In this study, the sludge formation in the wastewater drain from the advanced packaging process mechanisms are revealed as well as the key factors, materials, and sludge prevention methods using surfactant. Compared with that of conventional packaging process, advanced packaging process employ similar process to the semiconductor fabrication process, and thus many processes may generate wastewater. In specific, a large amount of wastewater may generate during the carrier wafer bonding, photo, development, and carrier wafer debonding processes. In order to identify the key factors for the formation of sludge during the advanced packaging process, six types of chemicals including bonding glue, HMDS, photoresist (PR), PR developer, debonding cleaner, and water are utilized and mixing evaluation is assessed. As a result, it is confirmed that the black solid sludge is formed, which is originated by the sludge seed formation by hydrolysis/dehydration reaction of HMDS and sludge growth via hydrophobic-hydrophobic binding with sludge seed and PR. For the sludge prevention investigation, three surfactants of CTAB, PEG, and shampoo are mixed with the key materials of sludge, and it is confirmed that the sludge formations are successfully suppressed. The underlying mechanism behind the sludge formation is that the carbon tails of the surfactant bind to PR with hydrophobic-hydrophobic interaction and inhibit the reaction with HMDS-based slurry seeds to prevent the sludge formation. In this regard, it is expected that various problems like clogging in drains and pipes during the advanced packaging process may effectively solve by the injection of surfactants into the drains.