• Title/Summary/Keyword: 계면에너지

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A Study on Crack Propagation Along a Sinusoidal Interface using Cohesive Zone Models (응집 영역 모델을 이용한 굴곡 계면을 따르는 균열 진전 거동에 관한 연구)

  • Lee, Hyeon-Gyeong;Kim, Hyun-Gyu
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.31 no.3
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    • pp.121-125
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    • 2018
  • In this study, finite element analyses of crack propagation along a sinusoidal interface are performed by using cohesive elements. BK law is used for cohesive zone to consider mixed mode traction-separation relation at the crack tip on a sinusoidal interface of a double cantilever beam specimen. The shape of a sinusoidal interface crack and the cohesive strength and the cohesive energies in mixed mode cohesive laws are varied in numerical experiments, and load-displacement curves at the ends of a double cantilever beam specimen are obtained to investigate the crack propagation behavior along a sinusoidal interface.

Characteristics of a-Si:H/c-Si interface and heterojunction solar cells depending on silicon wafer wet chemical cleaning (실리콘 기판 습식 세정에 따른 a-Si:H/c-Si 계면 및 이종접합 태양전지 특성 분석)

  • Song, Jun-Yong;Jeong, Dae-Young;Kim, Chan-Seok;Park, Sang-Hyun;Cho, Jun-Sik;Yun, Kyoung-Hun;Song, Jin-Soo;Lee, Jun-Sin;Kim, Dong-Hwan;Lee, Jeong-Chul
    • 한국신재생에너지학회:학술대회논문집
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    • 2009.06a
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    • pp.168-168
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    • 2009
  • 고효율 실리콘 이종접합 태양전지 제작을 위한 요소기술 중 a-Si:H/c-Si 간의 계면 안정화는 태양전지 효율에 중요한 역할을 한다. 본 연구에서는 n-type 결정질 실리콘 기판을 사용하여, 소수전하들의 재결합을 방지하고, 계면 안정화를 실행하는 방안으로 실리콘 기판 습식 세정을 수행하였다. 반도체 공정에서 일반적으로 알려진 RCA 세정기법에 HF 세정을 마지막공정으로 추가하여 자연 산화막과 기타 불순물을 더욱 효과적으로 제거할 수 있도록 실험을 진행하였다. 마지막 공정으로 추가된 HF 세정에 의한 a-Si:H/c-Si 계면 안정화 효과를 관찰하기 위하여 HF농도와 HF 세정시간에 따른 소수반송자 수명을 측정하였다. 또한 HF 세정 이후 공정의 영향을 확인하기 위하여 PE-CVD법으로 a-Si:H 박막 증착 이전 실리콘 기판의 온도와 상온에서 머무는 시간에 따른 a-Si:H/c-Si 계면안정화 특성을 분석하였다. 본 실험을 통해 HF세정공정이 계면특성에 미치는 영향을 확인하였으며 실리콘 기판 습식 세정이 이종접합태양전지 특성에 미치는 영향을 분석하였다.

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Overview of Interface Engineering for Organic Solar Cells (유기태양전지 계면 기술 동향)

  • Kim, Gi-Hwan
    • Journal of Adhesion and Interface
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    • v.22 no.4
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    • pp.113-117
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    • 2021
  • Among the next-generation solar cells, organic solar cells using organic materials are a key energy production device for the future energy generation devices, and have recently been receiving a lot of attention with rapid growth. To improve the efficiency of organic solar cells, interfacial engineering technology has been widely applied. In particular, it is widely used to improve device efficiency through energy level control by using interface engineering on the anode and cathode, which are positive electrodes, and to ultimately utilize interface engineering for tandem organic solar cells to derive excellent electrical and optical performance to produce high-performance devices. In this article, we will summarize and introduce recent research trends on interfacial engineering used in organic solar cells, and discuss the method of manufacturing high-performance organic solar cells.

Effects of Sizing Treatment of Carbon Fibers on Mechanical Interfacial Properties of Nylon 6 Matrix Composites (탄소섬유의 사이징처리가 탄소섬유/나일론6 복합재료의 기계적 계면 특성에 미치는 영향)

  • Park, Soo-Jin;Choi, Woong-Ki;Kim, Byung-Joo;Min, Byung-Gak;Bae, Kyong-Min
    • Elastomers and Composites
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    • v.45 no.1
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    • pp.2-6
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    • 2010
  • The sizing treatments of PAN-based carbon fiber surfaces were carried out in order to improve the interfacial adhesion in the carbon fibers/nylon6 composite system. The parameter to characterize the wetting performance and surface free energy of the sized fibers were determined by a contact angle method. The mechanical interfacial properties of the composites were investigated using critical stress intensity factor ($K_{IC}$). The cross-section morphologies of sized CFs/nylon6composites were observed by SEM. As the experimental results, it was observed that silane-based sizing treated carbon fibers showed higher surface free energies than other sizing treatments. In particular, the KIC of the sizing-treated carbon fibers reinforced composites showed higher values than those of untreated carbon fibers-reinforced composites. This result indicated that the increase in the surface free energy of the fibers leads to the improvement of the mechanical interfacial properties of carbon fibers/nylon6 composites.

Understanding of Protein Adsorption Kinetics to Contact Lens Hydrogels (콘택트렌즈용 하이드로젤로의 단백질 흡착 반응속도 이해)

  • Kim, Hyun-Jae;Kim, Mira;Noh, Hyeran
    • Polymer(Korea)
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    • v.38 no.2
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    • pp.220-224
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    • 2014
  • Protein adsorption kinetics was studied with the amount of proteins adsorbed to contact lens hydrogels over time scales. Hydroxyethylmethacrylate (HEMA) and silicone hydrogels were dipped in protein solutions (albumin or IgG) and adsorption amounts were measured over time scales. The amount of protein adsorbed to both hydrogel types increased rapidly in 10 min, and remained consistently in 90 min. Decreasing interfacial energetics was taken slowly up to an hour in spite of rapid diffusion of protein molecules. This is due to the fact that water deprivation from three dimensional interphase initially formed by protein diffusion took over an hour. Interpretation of adsorption kinetics on contact lens hydrogels was discussed with understanding of relationship between surface energy and protein adsorption capacity.

Effect of Ta/Cu Film Stack Structures on the Interfacial Adhesion Energy for Advanced Interconnects (미세 배선 적용을 위한 Ta/Cu 적층 구조에 따른 계면접착에너지 평가 및 분석)

  • Son, Kirak;Kim, Sungtae;Kim, Cheol;Kim, Gahui;Joo, Young-Chang;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.1
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    • pp.39-46
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    • 2021
  • The quantitative measurement of interfacial adhesion energy (Gc) of multilayer thin films for Cu interconnects was investigated using a double cantilever beam (DCB) and 4-point bending (4-PB) test. In the case of a sample with Ta diffusion barrier applied, all Gc values measured by the DCB and 4-PB tests were higher than 5 J/㎡, which is the minimum criterion for Cu/low-k integration without delamination. However, in the case of the Ta/Cu sample, measured Gc value of the DCB test was lower than 5 J/㎡. All Gc values measured by the 4-PB test were higher than those of the DCB test. Measured Gc values increase with increasing phase angle, that is, 4-PB test higher than DCB test due to increasing plastic energy dissipation and roughness-related shielding effects, which matches well interfacial fracture mechanics theory. As a result of the 4-PB test, Ta/Cu and Cu/Ta interfaces measured Gc values were higher than 5 J/㎡, suggesting that Ta is considered to be applicable as a diffusion barrier and a capping layer for Cu interconnects. The 4-PB test method is recommended for quantitative adhesion energy measurement of the Cu interconnect interface because the thermal stress due to the difference in coefficient of thermal expansion and the delamination due to chemical mechanical polishing have a large effect of the mixing mode including shear stress.

Interface Fracture and Crack Propagation in Concrete : Fracture Criteria and Numerical Simulation (콘크리트의 계면 파괴와 균열 전파 : 파괴규준과 수치모의)

  • 이광명
    • Magazine of the Korea Concrete Institute
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    • v.8 no.6
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    • pp.235-243
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    • 1996
  • The mechanical behavior ot concrete is strongly influenced by various scenarios of crack initiation and crack propagation. Recently. the study of the interface fracture and cracking in interfacial regions is emerged as an important field, in the context of the developement of high performance concrete composites. The crack path criterion for elastically homogeneous materials is not valid when the crack advances at an interface because. in this case, the consideration of the relative magnitudes of the fracture toughnesses between the constituent materials and the interface are involved. In this paper, a numerical method is presented to obtain the values of two interfacial fracture parameters such as the energy release rate and the phase angle at the tip of an existing interface crack. Criteria based on energy release rate concepts are suggested for the prediction of crack growth at the interfaces and an hybrid experimental-numerical study is presented on the two-phase beam composite models containing interface cracks to investigate the cracking scenarios in interfacial regions. In general, good agreement between the experimental results and the prediction from the criteria is obtained.

Thermodynamic Issues of Lead-Free Soldering in Electronic Packaging (전자 패키징에 사용되는 무연 솔더에 관한 열역학적 연구)

  • 정상원;김종훈;김현득;이혁모
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.3
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    • pp.37-42
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    • 2003
  • In soldering of electronic packaging, the research on substituting lead-free solder materials for Pb-Sn alloys has become active due to environmental and health concerns over the use of lead. The reliability of the solder joint is very important in the development of solder materials and it is known that it is related to wettability of the solder over the substrate and microstructural evolution during soldering. It is also highly affected by type and extent of the interfacial reaction between solder and substrate and therefore, it is necessary to understand the interfacial reaction between solder and substrate completely. In order to predict the intermetallic compound (IMC) phase which forms first at the substrate/solder interface during the soldering process, a thermodynamic methodology has been suggested. The activation energy for the nucleation of each IMC phases is represented by a function of the interfacial energy and the driving force for phase formation. From this, it is predicted that the IMC phase with the smallest activation energy forms first. The grain morphology of the IMC at the solder joint is also explained by the calculations which use the energy. The Jackson parameter of the IMC grain with a rough surface is smaller than 2 but it is larger than 2 in the case of faceted grains.

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A Phenomenological Study on Micellization and Solubilization (Micelle 형성에 관한 현상학적 고찰)

  • Myung Soo Kim
    • Journal of the Korean Chemical Society
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    • v.33 no.5
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    • pp.459-467
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    • 1989
  • When the sufactants are dissolved in water, they associate to form micelles and solubilize oil inside the micelle to form swollen micelles. Although spherical aggregates like micelles and swollen micelles occupy the same regions in the phase diagram of water-oil-surfactant systems, they are treated in different viewpoint for the formation of such aggregates. Hence a unified thermodynamic formalism for the formation of such structure is presented in this study. In all cases, the to ideal solution theory is applied for dilute system and the energy of formation is expressed as the sum of hydrophobic interaction energy and surface energy due to surfactant film. From the model, critical micelle concentration (CMC), average aggregation number, and solubilization ratio are predicted and compared with the known experimental observation.

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2 차원 금속칼코겐 화합물인 GaSe-InS Lateral Heterostructure 의 계면 구조 및 전자 구조 연구

  • Yun, Ye-Bin;Cha, Seon-Gyeong
    • Proceeding of EDISON Challenge
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    • 2016.03a
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    • pp.326-329
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    • 2016
  • 2차원 metal monochalchogenides(MMC) 물질들 중 lattice mismatch가 가장 적은 GaSe와 InS의 $8{\times}1$ lateral heterostructure의 계면 원자 구조와 전자 구조를 Linear combination of atomic orbital 제일원리계산을 이용하여 연구하였다. Arm-chair 와 zigzag 계면에 대해 각각 두 가지 원자 구조를 고려하여 총 네 가지 계면 구조 모델을 정립하고, 각각의 계면에 대해 GaSe-InS의 비율을 다섯 단계(2:6, 3:5, 4:4, 5:3, 6:2)로 바꾸어 가며 relax된 원자구조의 특성과 계면 형성 에너지를 구하였다. 또한, 계면 전자구조 분석을 위하여, 계면으로부터의 위치에 따른 projected density of states의 변화를 규명하였다.

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