• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.67-73
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• 2012

After flash memory card(FMC) was manufactured by $B^2it$ process, interfacial reaction of silver bump with thermal stress was studied. To investigate bonding reliability of Ag bump, thermal shock and thermal stress tests were conducted and then examined on the crack between Cu land and Ag bump interface. Diffusion reaction of Ag bump/Cu land interface was analyzed using SEM, EDS and FIB. The Ag-Cu alloy layer due to the interfacial reaction was formed at the Ag/Cu interface. As the diffusivity of Ag ${\rightarrow}$ Cu is faster than Cu ${\rightarrow}$ Ag, a lot of (Cu, Ag) alloy layers were observed at the Cu layer than Ag. These alloy layers contributed to increase the Cu-Ag bonding strength and its reliability.

• Korean Chemical Engineering Research
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• v.51 no.4
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• pp.527-530
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• 2013

I present the behavior of colloidal adsorption to an oil-water interface in the presence of electrolyte in an aqueous subphase. The optical laser tweezers and the piezo controller are used to trap an individual polystyrene microsphere in water and forcibly transfer it to the interface in the vertical direction. Addition of an electrolyte (i.e., NaCl) in the aqueous subphase enables the particle to attach to the interface, whereas the particle escapes from the trap without the adsorption in the absence of the electrolyte. Based on the analytical calculations of the optical trapping force and the electrostatic disjoining pressure between the particle and the oil-water interface, it is found that a critical energy barrier between them should exist. This study will provide a fundamental understanding for applications of colloidal particles as solid surfactants that can stabilize the immiscible fluid-fluid interfaces, such as emulsions (i.e., Pickering emulsions) and foams.

• Composites Research
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• v.34 no.5
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• pp.305-310
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• 2021

Mechanical properties of fiber reinforced composites were affected to fiber volume fractions (FVF) and interfacial property by sizing agent conditions. An optimum interface can relieve stress concentration by transferring the mechanical stress from the matrix resin to the reinforcements effectively, and thus can result in the performance of the composites. The interfacial properties and wettability between the epoxy resin and glass fiber (GF) were evaluated for different sizing agent conditions and FVFs. The surface energies of epoxy resin and different sizing agent treated GFs were calculated using dynamic and static contact angle measurements. The work of adhesion, W_a was calculated by using surface energies of epoxy matrix and GFs. The wettability was evaluated via the GF tow capillary test. The interfacial shear strength (IFSS) was evaluated by microdroplet pull-out test. Finally, the optimized GFRP manufacturing conditions could be obtained by using wettability and interfacial property.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.11
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• pp.1835-1843
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• 2001

The energy release rate for an interface crack in anisotropic dissimilar materials was obtained by the eigenfunction expansion method and also was analyzed numerically by the reciprocal work contour integral method. It was shown that the results for orthotropic dissimilar materials are consistent with the other worker's results.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.9 s.180
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• pp.2174-2183
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• 2000

In this paper, the evaluation method of interfacial fracture toughness to apply the fracture toughness was investigated in adhesively bonded joints of AI/Ced./A1. Four types of adhesively bonded double-cantilever beam(DCB) joints with the interface crack were prepared for the test of interfacial fracture toughness. The experiments to measure the interfacial fracture toughness were performed under the various mixed-mode conditions. The critical energy release rate, Gc, was obtained by the experimental measurement of compliances. From the experimental results, the interfacial fracture toughness for the mixed-mode specimens is well characterized by the energy release rate, and the method of strength evaluation by the interfacial fracture toughness was discussed in adhesively bonded joints.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.461.2-461.2
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• 2014

양자점은 밴드갭을 조절할 수 있거나 multiple exciton generation등 과 같은여러가지 장점을 갖고 있어 양자점 감응형 태양전지에 대한 많은 연구가 진행되어왔다. 하지만 아직까지 이론적인 에너지 전환 효율에 비하여 낮은 효율을 보여주고 있다. 이러한 낮은 효율은 양자점과 전해질 계면에서의 defect나 surface state로 인한 전자-정공의 재결합으로 설명할 수 있다. 본 연구에서는 CdSe 양자점 합성법 중의 하나인 Chemical Bath Deposition의 전구체 농도조절을 통하여 고품질의 CdSe양자점을 합성하였다. 특정 농도에서 CdSe 양자점 표면에 생성되는 SeO2층을 억제하여 CdSe양자점/전해질 계면에서의 전하 재결합 저항을 높였고 가장 높은 에너지 전환 효율을 보여주었다.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 1998.10a
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• pp.134-137
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• 1998

표면처리 한 UF 막으로 오일/물 에멀젼과 오일-SDS/물 어멜젼을 한외여과 시험하였다. 고분자와 계면활성제를 polysulfon막에 흡착시켜 표면을 처리하였다. 오일-SDS/물 에멀젼의 한외여과는 SDS양을 변화시키면서 수행하였다. 다양한 표면처리 한 막으로 한외여과 실험을 회분식 실험방법으로 수행하였다. 표면처리 안한 막에 대한 오일 에멀젼 한외여과시 fouling의 주요 원인이 오일 에멀젼의 흡착이며, 막의 표면처리와 오일 에멀젼에 계면활성제의 주입으로 뚜렷한 fouling의 저감효과가 있었다.

• 한국신재생에너지학회:학술대회논문집
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• 2009.11a
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• pp.386-386
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• 2009

TCO/p/i/n 구조의 비정질 실리콘 박막 태양전지의 제작에 있어서 TCO계면과 p층사이의 이종접합에서의 큰 밴드갭 차이는 p층으로부터의 정공 재결합을 통하여 효율 저하의 원인이 된다. 이러한 재결합은 넓은 밴드갭을 가진 물질을 완충층으로 삽입함으로써 개선되어 질 수 있다. 본 논문에서는 비정질 실리콘 보다 넓은 광학적 밴드갭을 가지는 a-SiOx 박막을 완충층으로 사용하여 TCO/P 계면에서의 재결합 감소에 대한 시뮬레이션을 수행하였다. a-SiOX 박막 내에 포함된 산소의 양에 따라 밴드갭을 조절하여 1.8eV~2.0eV 사이의 완충층을 삽입하여 박막태양전지의 개방전압, 단락전류, 효율 등에 끼치는 영향을 ASA 시뮬레이션을 통하여 알아보았다.

• 한국신재생에너지학회:학술대회논문집
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• 2009.11a
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• pp.360-363
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• 2009

In order to improve the overall power conversion efficiency, it is very important to reduce the interface resistance of dye-sensitized solar cells (DSSCs). In this approach, tiny $TiO_2$ nanoparticles with the primary size of 10~20nm were synthesized and deposited between FTO glass and preformed $TiO_2$ layer by $TiOCl_2$ treatment, and also Pt catalysts were deposited on the counter electrode by both ion-sputter and thermal deposition to reduce the electrolyte-counter electrode interface resistance. The influence of these processes on the performace of DSSCs were discussed in terms of fill factor, short circuit current, and conversion efficiency.

• 한국신재생에너지학회:학술대회논문집
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• 2009.11a
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• pp.346-346
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• 2009

For high efficiency hetero junction solar cell over 20%, good silicon wafer passivation is one of the most important technological factor. Compared to the conventional PECVD technique, HWCVD has appeared as an promising alternative for high quality passivation layer formation. In this work, HWCVD passivation layer characteristics have been intensively investigated on wafer surface treatment, Hydrogen density in deposited thin layer and thermal effects in deposition process. Comprehensive results of the individual process factors on interface passivation has been discussed and resultant silicon hetero junction solar cell characteristics has been investigated.