• Title/Summary/Keyword: 계면굴절균열

Search Result 5, Processing Time 0.016 seconds

The Evaluation of the Kinked Interface Crack Behavior in Dissimilar Materials by CED (CED에 의한 계면굴절균열의 진전거동평가)

  • Kwon, O.H
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.21 no.3
    • /
    • pp.414-422
    • /
    • 1997
  • The characteristics on the extension of the CED(Crack Energy Density) concept to the interface kinked crack problems in a dissimilar are examined. Each mode contributions of CED are found by symmetric and antisymmetric conponents and domain independent integrals. Finite element calculation is carried out to simulate the interface kinked crack growth on a bimaterial. The focus is the establishment of fracture criterion with CED and finding the orientation of crack extension. From the results, a prediction about the extension behavior of an interface kinked crack can be done. And we show that CED can be a parameter to indicate fracture criterion at an interface kinked crack.

Analysis of Harmonic Wave Generation in Nonlinear Oblique Crack Surface (비선형 경사 균열면에서의 고조파 발생 특성 해석)

  • Kim, Noh-Yu;Yang, Seung-Yong
    • Journal of the Korean Society for Nondestructive Testing
    • /
    • v.32 no.4
    • /
    • pp.376-387
    • /
    • 2012
  • Based on the nonlinear spring model coupled with perturbation method, 2nd harmonic waves generated by oblique incident ultrasound on nonlinear crack interface were calculated and investigated. Reflected and transmitted waves from the interface were determined and analyzed at various angle of incidence for the cracks with different interfacial stiffness in order to estimate the 2nd harmonic generation of incident ultrasound. It was shown in computer simulation that the 2nd harmonic components changed much with the increase of incidence angle in both reflected and transmitted wave, but became very small when the incident angle approached toward 90 degree. It can be concluded that the 2nd harmonic component of reflected wave has a meaningful amplitude as much as the transmitted 2nd harmonic wave from partly closed crack.

An Extension Behavior of an Interface Kinked Crack by CED (CED에 의한 계면굴절균열의 진전거동)

  • 권오헌
    • Journal of the Korean Society of Safety
    • /
    • v.11 no.2
    • /
    • pp.9-15
    • /
    • 1996
  • The characteristics on the extension of the CED(Crack energy density) concept to the interface kinked crack problems in a dissimilar material are examined. Each mode contributions of CED are found by symmetric and antisymmetric components and domain independent integrals. Finite element calculation is carried out to simulate the Interface kinked crack growth on bimaterial. The focus is the establishment of fracture criterion with CED and finding the orientation of crack extension. From the results, a prediction about the extension behavior of an interface kinked crack can be done. And we show that CED can be a parameter to indicate fracture criterion at an Interface kinked crack.

  • PDF

Crack Formation and Propagation Behavior of $Al_2$$O_3$/$ZrO_2$Laminate Composites ($Al_2$$O_3$/$ZrO_2$적층복합체의 균열생성 및 전파거동)

  • 방희곤;박상엽
    • Journal of the Korean Ceramic Society
    • /
    • v.37 no.11
    • /
    • pp.1058-1064
    • /
    • 2000
  • 연속슬립캐스팅 및 상압소결법으로 $Al_2$O$_3$/ZrO$_2$적층복합체를 제조하였으며, 적층복합체에서 ZrO$_2$층을 단사정, 정방정 및 입방정으로 각각 달리 적층하여 균열생성 및 전파 거동에 미치는 ZrO$_2$상의 영향을 고찰하였다. 균열 생성은 냉각시 $Al_2$O$_3$층과 ZrO$_2$층 간의 열팽창 계수의 차이에 의한 열적불일치응력이 가장 큰 요인으로 작용하였다. 적층체 내에 존재하는 균열은 tetra-ZrO$_2$의 경우 적층두께 조절로 가능하였으며, cubic-ZrO$_2$의 경우는 냉각속도 조절로 균열밀도로 크게 낮출 수 있었다. $Al_2$O$_3$/ZrO$_2$적층체를 구성하는 세가지 ZrO$_2$상(mono, tetra, cubic)들 중에서 cubic-ZrO$_2$가 포함된 적층체의 경우 $Al_2$O$_3$와 ZrO$_2$계면에 형성된 잔류압축응력으로 인한 균열굴절 효과를 얻을 수 있었다.

  • PDF

Fracture Behavior of Glass/Resin/Glass Sandwich Structures with Different Resin Thicknesses (서로 다른 레진 두께를 갖는 유리/레진/유리샌드위치 구조의 파괴거동)

  • Park, Jae-Hong;Lee, Eu-Gene;Kim, Tae-Woo;Yim, Hong-Jae;Lee, Kee-Sung
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.34 no.12
    • /
    • pp.1849-1856
    • /
    • 2010
  • Glass/resin/glass laminate structures are used in the automobile, biological, and display industries. The sandwich structures are used in the micro/nanoimprint process to fabricate a variety of functional components and devices in fields such as display, optics, MEMS, and bioindustry. In the process, micrometer- or nanometer-scale patterns are transferred onto the substrate using UV curing resins. The demodling process has an important impact on productivity. In this study, we investigated the fracture behavior of glass/resin/glass laminates fabricated via UV curing. We performed measurements of the adhesion force and the interfacial energy between the mold and resin materials using the four-point flexural test. The bending-test measurements and the load-displacement curves of the laminates indicate that the fracture behavior is influenced by the interfacial energy between the mold and resin and the resin thickness.