• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.32 no.6
• /
• pp.444-447
• /
• 2019

It was proven that the light outputs of blue GaN-based light-emitting diodes (LEDs) was seriously influenced by the application of external stress. We have simulated the wave function overlap of an electron and hole, which are significantly reduced by the development of stress. Consequently, its internal quantum efficiency decreased from 67.0% to 37.5%. To experimentally investigate the effect of stress, we designed and prepared a special zig system. By applying external tensile stress to compensate for the compressive stress innately developed in Blue LEDs, it was found that the optical output was greatly enhanced from 83.1 mcd to 117.2 mcd at a current of 100 mA, an increase of approximately 41%. In contrast, when the compressive stress is developed more by external compressive stress, we observed that the light output power was reduced from 89.0 mcd to 80.7 mcd, a decrease of approximately 9.3%.

• Journal of the Semiconductor & Display Technology
• /
• v.20 no.2
• /
• pp.98-102
• /
• 2021

GaOOH is obtained via hydrothermal synthesis procedure. The formed GaOOH is turned into α-Ga₂O₃ at 500℃ annealing. As the annealing temperatures increase the α-Ga₂O₃ is in part turned into β-Ga₂O₃ and fully turned into β-Ga₂O₃ after 1100℃. XPS and PL results reveal that heterojunction interface between α-Ga₂O₃ and β-Ga₂O₃ become maxim at 500℃ annealing condition, which result in the highest photocatalytic activity. The presence of heterojunction interface slows down the recombination process by separating photogenerated electron-hole pairs and thereby enhance the overall photocatalytic activity.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.35 no.3
• /
• pp.308-310
• /
• 2022

Ultrawide bandgap gallium oxide (Ga₂O₃) semiconductors are known to have excellent photocatalytic properties due to their high redox potential. In this study, CO₂ reduction is demonstrated using nanostructured Ga₂O₃ photocatalyst under ultraviolet (254 nm) light source conditions. After the CO₂ reduction, C₂H₄ remained as a by-product in this work. Nanostructured Ga₂O₃ photocatalyst also showed an excellent endurance characteristic. Photogenerated electron-hole pairs boosted the CO₂ reduction to C₂H₄ via nanostructured Ga₂O₃ photocatalyst, which is attributed to the ultrawide and almost direct bandgap characteristics of the gallium oxide semiconductor. The findings in this work could expedite the realization of CO₂ reduction and a simultaneous C₂H₄ production using a low cost and high performance photocatalyst.

• Mineral and Industry
• /
• v.27
• /
• pp.8-15
• /
• 2014

In this study, a proposal for revision of HSK Code was established on legally designated minerals and national stockpile minerals. It is difficult to exactly identify trade balances of minerals, such as lithium ore, rare earth ore, serpentine, kidney stone in legally designated minerals and ingot of indium, ferro-tungsten, ingot of antimony, granule of selenium, gallium, lanthanum oxide, cerium carbonate in national stockpile minerals because HSK Codes of them were not allocated separately. Furthermore, specific use, standard, component, type of products cannot be exactly identified in current HSK Code system. Therefore, it is makes rule to separately manage minerals which were managed by government such as legally designated minerals and national stockpile minerals. However, a proposal for revision of HSK Code system was established to comply with international standard(HS Code) and the items over a certain size(amounts : over 50 mil.$, volumes : over 5000 ton) were selected as revised subjects. Moreover hierarchies between HSK Codes were considered.

• 한국신재생에너지학회:학술대회논문집
• /
• 2010.06a
• /
• pp.85.1-85.1
• /
• 2010

$Cu(In,Ga)Se_2$ (CIGS) thin film solar cell is currently 19.5% higher efficiency and developing a large area technology. The structure of CIGS solar cell that make five unit layers as back contact, light absorption, buffer, front transparent conducting electrode and antireflection to make them sequentially forming. Materials and various compositions of thin film unit which also manufacture a variety method used by the physical and chemical method for CIGS solar cell. The construction and performance test of evaporator for CIGS thin film solar cell has been done. The vapor pressures were changed by using vapor flux meter. The vapor pressure were copper (Cu) $2.1{\times}10^{-7}{\sim}3.0{\times}10^{-7}$ Torr, indium (In) $8.0{\times}10^{-7}{\sim}9.0{\times}10^{-7}$ Torr, gallium (Ga) $1.4{\times}10^{-7}{\sim}2.8{\times}10^{-7}$ Torr, and selenium (Se) $2.1{\times}10^{-6}{\sim}3.2{\times}10^{-6}$ Torr, respectively. The characteristics of the CIGS thin film was investigated by using X-ray diffraction (XRD), scanning electron microscopy/energy dispersive spectroscopy (SEM/EDS) and photoluminescence (PL) spectroscopy using a He-Ne laser. In PL spectrum, temperature dependencies of PL spectra were measured at 1137 nm wavelength.

• 한국신재생에너지학회:학술대회논문집
• /
• 2010.06a
• /
• pp.61.1-61.1
• /
• 2010

$CuIn_{1-x}-GaxSe_2$ based materials with direct bandgap and high absorption coefficient are promising materials for high efficiency hetero-junction solar cells. CIGS champion cell efficiency(19.9%, AM1.5G) is very close to polycrystalline silicon(20.3%, AM1.5G). A reduction in the price of CIGS module is required for competing with well matured silicon technology. Price reduction can be achieved by decreasing the manufacturing cost and by increasing module efficiency. Manufacturing cost is mostly dominated by capital cost. Device properties of CIGS are strongly dependent on doping, defect chemistry and structure which in turn are dependent on growth conditions. The complex chemistry of CIGS is not fully understood to optimize and scale processes. Control of the absorber grain size, structural quality, texture, composition profile in the growth direction is important to achieving reliable device performance. In the present work, CIS nanoparticles were prepared by a simple wet chemical synthesis method and their structural and optical properties were investigated. XRD patterns of as-grown nanopowders indicate CIS(Cubic), $CuSe_2$(orthorhombic) and excess selenium. Further, as-grown and annealed nanopowders were characterized by HRTEM and ICP-OES. Grain growth of the nanopowders was followed as a function of temperature using HT-XRD with overpressure of selenium. It was found that significant grain growth occurred between $300-400^{\circ}C$ accompanied by formation of ${\beta}-Cu_{2-x}Se$ at high temperature($500^{\circ}C$) consistent with Cu-Se phase diagram. The result suggests that grain growth follows VLS mechanism which would be very useful for low temperature, high quality and economic processing of CIGS based solar cells.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2016.02a
• /
• pp.263-263
• /
• 2016

최근 반도체 시장에서는 저비용으로 고성능 박막 트랜지스터(TFT)를 제작하기 위한 다양한 기술들이 연구되고 있다. 먼저, 재료적인 측면에서는 비정질 상태에서도 높은 이동도와 가시광선 영역에서 투명한 특성을 가지는 산화물 반도체가 기존의 비정질 실리콘이나 저온 폴리실리콘을 대체하여 차세대 디스플레이의 구동소자용 재료로 많은 주목받고 있다. 또한, 공정적인 측면에서는 기존의 진공장비를 이용하는 PVD나 CVD가 아닌 대기압 상태에서 이루어지는 용액 공정이 저비용 및 대면적화에 유리하고 프리커서의 제조와 박막의 증착이 간단하다는 장점을 가지기 때문에 활발한 연구가 이루어지고 있다. 특히 산화물 반도체 중에서도 indium-gallium-zinc oxide (IGZO)는 비교적 뛰어난 이동도와 안정성을 나타내기 때문에 많은 연구가 진행되고 있지만, 산화물 반도체 기반의 박막 트랜지스터가 가지는 문제점 중의 하나인 문턱전압의 불안정성으로 인하여 상용화에 어려움을 겪고 있다. 따라서, 본 연구에서는 기존의 산화물 반도체의 불안정한 문턱전압의 문제점을 해결하기 위해 마이크로웨이브 열처리를 적용하였다. 또한, 기존의 IGZO에서 suppressor 역할을 하는 값비싼 갈륨(Ga) 대신, 저렴한 지르코늄(Zr)과 하프늄(Hf)을 각각 적용시켜 용액 공정 기반의 Zr-In-Zn-O (ZIZO) 및 Hf-In-Zn-O (HIZO) TFT를 제작하여 시간에 따른 문턱 전압의 변화를 비교 및 분석하였다. TFT 소자는 p-Si 위에 습식산화를 통하여 100 nm 두께의 $SiO_2$가 열적으로 성장된 기판 위에 제작되었다. 표준 RCA 세정을 진행하여 표면의 오염 및 자연 산화막을 제거한 후, Ga, Zr, Hf 각각 suppressor로 사용한 IGZO, ZIZO, HIZO 프리커서를 이용하여 박막을 형성시켰다. 그 후 소스/드레인 전극 형성을 위해 e-beam evaporator를 이용하여 Ti/Al을 5/120 nm의 두께로 증착하였다. 마지막으로, 후속 열처리로써 마이크로웨이브와 퍼니스 열처리를 진행하였다. 그 결과, 기존의 퍼니스 열처리와 비교하여 마이크로웨이브 열처리된 IGZO, ZIZO 및 HIZO 박막 트랜지스터는 모두 뛰어난 안정성을 나타냄을 확인하였다. 결론적으로, 본 연구에서 제안된 마이크로웨이브 열처리된 용액공정 기반의 ZIZO와 HIZO 박막 트랜지스터는 추후 디스플레이 산업에서 IGZO 박막 트랜지스터를 대체할 수 있는 저비용 고성능 트랜지스터로 적용될 것으로 기대된다.

• Korean Chemical Engineering Research
• /
• v.49 no.5
• /
• pp.600-604
• /
• 2011

Solution processed IGO thin films were prepared using a general chemical solution route by spin coating. The effect of the annealing temperature of IGO thin films based on the ratio of 2:1 of indium to gallium on crystallization was investigated with varying annealing temperature from $300^{\circ}C$ to $600^{\circ}C$. The electronic device characteristic of IGO thin film was investigated. The solution-processed IGO TFTs annealed at 300 and $600^{\circ}C$ in air for 1 h exhibited good electronic performances with field effect mobilities as high as 0.34 and 3.83 $cm^2/V{\cdot}s$, respectively. The on/off ratio of the IGO TFT in this work was $10^5$ with 98% transmittance.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2015.08a
• /
• pp.193.1-193.1
• /
• 2015

실리콘 (Si) 기판 위에 고품질의 갈륨질화물 (GaN) 박막을 성장시키기 위한 노력이 계속되고 있다. 실리콘 기판은 사파이어 기판 보다 경제적인 측면에서 유리하고, 실리콘 직접화 공정에 GaN 소자를 쉽게 접목 가능하다는 장점이 있다. GaN 박막은 2차원 전자 가스형성을 통한 고속소자, 직접 천이형 밴드갭을 이용한 발광소자 및 고전압 소자로써 활용 가능한 물질이다. 종래에는 Si(100) 및 Si(111) 기판 위에 GaN 박막 성장에 대한 연구가 주로 진행되었다. 하지만 대칭성과 격자 불일치도 등 결정학적 특성을 고려할 때 Si(100) 기판 위에 고품질의 GaN 박막을 성장시키는 것은 쉽지 않다. Si(111) 기판은 실리콘 소자 직접화 공정에 적합하지 못한 단점을 가지고 있다. 반면, 최근 Si(110) 기판 위에서 비등방적 변형 제어를 통한 고품질 GaN 박막 성장이 보고 되어 실리콘 집적 소자와 결합한 고전압 소자 및 고속소자 구현에 관한 연구가 진행되고 있다. 본 연구에서는 투과전자현미경 연구를 바탕으로 Si(110) 기판 위에 성장된 GaN의 미세구조에 관한 연구를 소개한다. 열팽창계수의 차이에 의한 GaN 박막 내 결함 생성을 줄이기 위하여 AlN 완충층이 사용되었다. GaN 박막을 암모니아 ($NH_3$) 유량이 다른 조건에서 성장시킴으로써 GaN 박막 미세구조의 암모니아 유량 의존성에 관한 연구를 진행하였다. GaN 박막에서 투과전자현미경 연구와 X-ray 회절 연구를 통하여 결함 거동 및 결정성을 확인하였다. $NH_3$ 유랑이 증가함에 따라 GaN의 성장 거동이 3차원에서 2차원으로 변화됨을 관찰하였다. 또한, 전위밀도의 증가도 확인되었다. $NH_3$ 유량이 낮은 경우 GaN 전위는 AlN와 GaN 경계에 주로 위치하고 GaN 표면 근처에는 전위밀도가 감소하였으나, $NH_3$ 유량이 높을 경우 GaN 박막 표면까지 전위가 관통됨을 확인하였다.

• Journal of Advanced Marine Engineering and Technology
• /
• v.33 no.1
• /
• pp.144-152
• /
• 2009

This paper propose highly miniaturized active $90^{\circ}C$ phase difference power divider and combiner for application to wireless communication system. The conventional passive $90^{\circ}C$ power divider and combiner cannot be integrated on MMIC because of their very large circuit size. Therefore, the highly miniaturized active $90^{\circ}C$ phase difference power divider and combiner are required for a development of highly integrated MMIC. In this paper, the highly miniaturized active $90^{\circ}C$ phase difference power divider and combiner employing InGaAs/GaAs HBT were designed, fabricated on GaAs substrate. According to the results, the circuit size of fabricated active $90^{\circ}C$ phase difference power divider and combiner were $1.67{\times}0.87$ mm and $2.42{\times}1.05$ mm, respectively, which were 31.6% and 2.2% of the size of conventional passive branch-line coupler. The output gain division characteristic of proposed divider circuit showed 8.4 dB and 7.9 dB respectively, and output phase difference characteristic showed $-89.3^{\circ}C$. The output gain coupling characteristic of proposed combiner circuit showed 9.4 dB and 10.5 dB respectively, and output phase difference characteristic showed $-92.6^{\circ}C$. The highly miniaturized active $90^{\circ}C$ phase difference power divider and combiner exhibited good RF performances compared with the conventional passive branch-line coupler.