• Proceedings of the Korean Magnestics Society Conference
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• 2000.05a
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• pp.54-55
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• 2000

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.55-61
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• 2011

The n-type $Bi_2(Te_{0.9}Se_{0.1})_3$ powers were fabricated by mechanical alloying, mixed with tungsten(W) powders, and hot-pressed at $550^{\circ}C$ for 30 minutes. Thermoelectric properties of the hot-pressed $Bi_2(Te_{0.9}Se_{0.1})_3$ were characterized as a function of the volume percent of tungsten-powder addition. The power factor of the hot-pressed $Bi_2(Te_{0.9}Se_{0.1})_3$ was $21.9{\times}10^{-4}$ $W/m-K^2$, and was improved to $30.5{\times}10^{-4}$ $W/m-K^2$ by dispersion of 1 vol% W powders. While the dimensionless figure-of-merit of the $Bi_2(Te_{0.9}Se_{0.1})_3$ hot-pressed without dispersion of W powders was measured as 0.52 at room temperature, it became substantially enhanced to 0.95 with addition of 1 vol% W powders.

• Korean Journal of Materials Research
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• v.8 no.5
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• pp.408-412
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• 1998

Thermoelectric properties of Bi$_{2}$(Te$_{1-x}$Se$_{ x}$)$_{3}$(0.05$\leq$x$\leq$0.25) prepared by mechanical alloying and hot pressing, were investigated. Contrary to the p-type behavior of single crystals, the hot-pressed Bi$_{2}$(Te$_{1-x}$Se$_{ x}$)$_{3}$ exhibited ntype conduction without addition of donor dopant. When $Bi_2(Te_{0.85}Se_{0.15})_3$powders were annealed in (50% $H_2$ + 50% Ar) atmosphere, the hot-pressed specimen exhibited a positive Seebeck coefficient due to the reduction of the electron concentration by removal of the oxide layer on the powder surface and annealing-out of the excess Te vacancies. Among the Bi$_{2}$(Te$_{1-x}$Se$_{ x}$)$_{3}$fabricated by mechanical alloying and hot pressing, $Bi_2(Te_{0.85}Se_{0.15})_3$ exhibited a maximum figure-of-merit of 1.92 $\times$ $lO^{-3}$/K.

• Korean Journal of Materials Research
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• v.10 no.4
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• pp.257-263
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• 2000

Thermoelectric properties of the 0.05wt% $SbI_3$-doped n-type $Bi_2(Te_{0.95}Se_{0.05})_3$ alloy, prepared by melting/grinding and hot pressing, were investigated with variation of the annealing time up to 36 hours. The electron concentration of the 0.05wt% SbI$_3$-doped n-type $Bi_2(Te_{0.95}Se_{0.05})_3$ alloy decreased with increasing the annealing time. The figure-of-merit of the 0.05wt% $SbI_3$-doped n-type $Bi_2(Te_{0.95}Se_{0.05})_3$ alloy was improved from $2.1{\times}10^{-3}/K$ to $2.35{\times}10^{-3}/K$ by annealing at $500^{\circ}C$ for 3 hours. When annealed longer than 12 hours, however, the figure-of-merit decreased substantially due to the increase of the electrical resistivity.

• Journal of the Korean Ceramic Society
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• v.31 no.7
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• pp.777-783
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• 1994

Oxidation behavior of hot-pressed silicon nitride ceramics with various sintering additives has been investigated. The weight gain of each specimens has shown in the range of 0.11 mg/$\textrm{cm}^2$ ~3.4 mg/$\textrm{cm}^2$ at 140$0^{\circ}C$ for 192 h and eleven compositions have shown good oxidation resistance with the weight gain below 0.5 mg/$\textrm{cm}^2$. The oxidation rate has been shown to obey the parabolic rate law and the oxidized surface has consisted of $\alpha$-cristobalite and M2Si2O7 or MSiO3 (M=rare earth or transition metals) phase. The oxidation rate of each specimens has related to the eutectic temperature between additive oxide and SiO2, and ionic radius of additive oxides, respectively. From the above results, it could be concluded that the oxidation behavior of hot pressed silicon nitride is dominated by the high temperature properties of grain boundary glassy phase and the high temperature properties of grain boundary glassy phase are affected by the ionic radius of additive oxides.

• Journal of Korean Ophthalmic Optics Society
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• v.5 no.1
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• pp.61-65
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• 2000

${\beta}$-SiC powder and ${\alpha}$-SiC powders of different particle sizes, containing 5.7wt% $Al_2O_3$ and 4.3wt% $Y_2O_3$ as sintering aids, were hot-pressed at $1780^{\circ}C$ and subsequently annealed at $1950^{\circ}C$ to initiate grain growth. All the hot-pressed and annealed materials consisted of large SiC grains and elongated SiC grains. Typical hardness and fracture toughness of materials for spectacle lens cutting were 15.6 GPa and $5.7MPa{\cdot}m^{1/2}$, respectively.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.13 no.2
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• pp.94-99
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• 2014

In this study, using AlN materials produced by two different sintering techniques, grinding experiments were performed under various grinding conditions, including different table speeds and cut depths. In order to measure the grinding force, a tool dynamometer was used. Surface roughness measurements and a digital microscope were also was used. The grinding forces were higher at a higher table speed and a higher cut depth. The experimental results show that the grinding characteristics of the two workpieces are similar.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.6 no.4
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• pp.552-557
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• 1996

Microstructural development of $Si_3N_4$/20 vol% SiC nanocomposites doped 2 wt% $Al_2O_3$ and 6 wt% $Y_2O_3$ as sintering additives were analyzed by sintering interruption. Density of samples was significantly increased between $1500^{\circ}C$ and $1700^{\circ}C$, and near full density was achieved at $1800^{\circ}C$. Transformation rate from $\alpha-Si_3N_4$ to $\betha-Si_3N_4$ was increased at $1700^{\circ}C$ and $1800^{\circ}C$, and then elongated matrix grains were appeared. Small size SiC particles had suppressive effect on densification rate and transformation of $Si_3N_4$ phase.

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.05a
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• pp.22-22
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• 2002

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.05a
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• pp.118-118
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• 2002