• Title/Summary/Keyword: (Ba, Sr)TiO$_3$

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Uniformity of $YBa_2$$Cu_3$$O_7$ Step-edge Josephson Junctions (Y$Ba_2$$Cu_3$$O_7$ 모서리 죠셉슨 접합의 균일성)

  • Lee, S.G.;Hwang, Y.;Kim, J.T.
    • Progress in Superconductivity
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    • v.2 no.2
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    • pp.81-85
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    • 2001
  • Uniformity of critical currents of YBa$_2$Cu$_3$O$_{7}$ step-edge Josephson junctions on SrTiO$_3$(100) substrates have been studied at various step-line angles. 15 identical junctions were made in series on each substrate that has a long straight step-edge line. Step-line angles studied were 0$^{\circ}$, 15$^{\circ}$, 30$^{\circ}$, and 45$^{\circ}$with respect to the crystal major axes of the substrate. Scattering of junction critical currents among the junctions on the same substrate increased with the step-line angle. Current-voltage curves showed standard resistively-shunted-junction (RSJ) characteristics in most of the 0$^{\circ}$junctions. However, the number of junctions showing RSJ behavior decreased with increasing step-line angle. Variations of detailed microstructure of the step-edge among junctions, which are coupled with the d-wave symmetry of YBa$_2$Cu$_3$O$_{7}$, are believed to be the main cause for the nonuniformity in the critical current.ent.

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레이져 증착법으로 제조된 (Ba,Sr)$TiO_3-MFSFET $구조의 성장 및 응력에 의한 강유전성

  • 전성진;한근조;강신충;이재찬
    • Proceedings of the Korean Vacuum Society Conference
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    • 1999.07a
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    • pp.87-87
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    • 1999
  • 본 연구에서는 Pulsed Laser Deposition(이하 PDL)방법을 이용하여 Si기판에 (Ba,Sr)TiO3(이하 BST)박막을 MFS-FET(Metal-Ferroelectric-Semiconductor Field-effect Transistor)구조로 제조하였으며 BST박막의 강유전성이 BST 박막에 유도되는 응력에 어떤 영향을 받는지 살펴보았다. 본 연구에서는 완충막을 사용함으로써 BST박막과 완충막간의 격자부정합을 이용하여 BST박막에 강유전성을 유도하려고 하였다. 또한 MFS-FET구조의 BST박막에 유도되는 응력조절을 위하여 BST박막과 완충막의 두께를 변화하였으며 XRD를 통한 구조 분석 및 C-V test를 통한 전기적 특성을 관찰을 하였다. PLD법을 통해서 epitaxial 성장된 BST 박막에서는 Si에 epitaxial 성장된 완충막과의 격자부정합에 의한 BST박막내의 자발분극의 발생이 예상된다. 따라서, 본 연구는 강유전체의 자발분극에 의하여 발생되는 C-V 이력현상이 BST박막과 완충막과의 격자부정합에 의한 응력에 의해 발생될 것으로 예상하여, BST 박막에 유도되는 응력과 C-V 이력현상의 관계를 통하여 상온에서 상유전성을 갖는 BST가 응력에 의하여 어느 정도의 강유전성을 나타내는지를 밝히기 위해 진행되었다. 본 연구에서 사용된 완충막은 YSZ(Yttria Stabilized Zirconia)박막으로 0.4mTorrO2 분위기 하에서 600~80$0^{\circ}C$의 온도에서 증착하여 상형성을 살펴보았고 $700^{\circ}C$에서 epitaxial 성장을 확인하였으며 두께는 30~$\AA$으로 변화하였다. 또한 BST박막은 완충막과의 전압분배를 고려해 300~2000$\AA$으로 두께를 변화를 시키며 증착하였다. MFS 구조에서 Al 전극을 사용하여 완충막과 BST박막간의 두께 변화에 따른 Capacitance - Voltage(C-V) 측정을 하였으며 이를 통하여 강유전상의 특성인 C-V 이력현상을 관찰하였다. 그 결과 YSZ 박막에서는 C-V 이력현상이 나타나지 않았으며 BST 박막에서는 약 1.2V의 C-V이력현상이 보였다.

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Study on Damage Reduction of $(Ba_{0.6}Sr_{0.4})TiO_{3}$ Thin Films in $Ar/CF_{4}$ Plasma ($Ar/CF_{4}$ 유도결합 플라즈마에서 식각된 $(Ba_{0.6}Sr_{0.4})TiO_{3}$ 박막의 손상 감소)

  • Kang, Pil-Seung;Kim, Kyung-Tae;Kim, Dong-Pyo;Kim, Chang-Il;Hwang, Jin-Ho;Kim, Tae-Hyung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.11a
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    • pp.171-174
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    • 2002
  • The barium strontium titannate (BST) thin films were etched in $CF_{4}/Ar$ inductively coupled plasma (ICP). The high etch rate obtained at a $CF_{4}(20%)/Ar(80%)$ and the etch rate in pure argon was twice higher than that in pure $CF_{4}$. This indicated that BST etching is sputter dominant process. It is impossible to avoid plasma-induced damages by the energetic particles in the plasma and the nonvolatile etch products. The plasma damages were evaluated in terms of leakage current density, residues on the etched sample, and the changes of roughness. After the BST thin films exposed in the plasma, the leakage current density and roughness increases. In addition, there are appeared a nonvolatile etch byproductsand from the result of X-ray photoelectron spectroscopy (XPS). After annealing at ${600^{\circ}C}$ for 10 min in $O_{2}$ ambient, the increased leakage current density, roughness and nonvolatile etch byproducts reduced. From the this results, the plasma induced damage recovered by annealing process owing to the relaxation of lattice mismatches by Ar ions and the desorption of metal fluorides in high temperature.

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Flux pinning properties of Y-Ba-Cu-O thin films grown on STO substrates with assembled Au nanoparticles (금 나노입자가 배열된 STO기판에서 성장된 Y-Ba-Cu-O박막의 Flux pinning 특성)

  • Oh, Se-Kweon;Jang, Gun-Eik;Lee, Cho-Yeon;Hyun, Ok-Bae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.375-375
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    • 2009
  • For many large-scale applications of high-temperature superconducting materials, large critical current density($J_c$) in high applied magnetic fields are required. A number of methods have been reported to introduce artificial pinning centers(APCs) in $YBa_2Cu_3O_{7-\delta}$(YBCO) films for enhancement of their $J_c$. We report measurements of critical current in $YBa_2Cu_3O_{7-\delta}$ films deposited by PLD on $SrTiO_3$ substrates decorated with Au nanoparticles. Au nanoparticles were synthesized on STO substrates with self assembled monolayer. Microstructural analysis of the obtained YBCO films was performed by using cross-section transmission electron microscopy(TEM). Phase and textural analysis was done using X-ray diffraction. The surface morphology and surface roughness(Ra) of the layers was measured by atomic force microscopy(AFM).

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Geochemical Characteristics of A-type granite in Dongcheondong, Gyeongju (경주 동천동 일대에 분포하는 A-형 화강암의 지화학적 특성)

  • Myeong, Bora;Ju, Jiwon;Kim, Junghoon;Jang, Yundeuk
    • The Journal of the Petrological Society of Korea
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    • v.26 no.3
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    • pp.271-280
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    • 2017
  • The Dongcheondong granite is alkali feldspar granite in Dongcheondong, Gyeongju. The granite is coarse grained and consists of alkali feldspar, quartz, amphibole, and biotite. Alkali feldspar is perthitic orthoclase and quartz often shows undulatory extinction. Plagioclase often shows albite twins, and biotite and amphibole emplace as interstitial minerals. The Dongcheondong granite is plotted in A-type area having high ($Na_2O+K_2O)/Al_2O_3$ and low (MgO+CaO)/FeOT ratio. The Dongcheondong A-type granite has higher $SiO_2$, $Na_2O$, $K_2O$, Zr, Y, and REE contents (except for Eu) and lower $TiO_2$, $Al_2O_3$, CaO, MgO, Sr, Ba, and Eu contents than I-type granites in Gyeongsang Basin. These results show that the geochemical characteristics of the Dongcheondong A-type granite are distinguished from I-type granite in Gyeongsang Basin. A-type granite in the Dongcheondong is thought to has been generated by partial melting of I-type tonalite or granodiorite.

Characterization of BST Thin Films using MgO(100) Buffer Layer for Tunable Device

  • Lee Cheol-In;Kim Kyoung-Tae;Kim Chang-Il
    • Transactions on Electrical and Electronic Materials
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    • v.7 no.2
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    • pp.67-71
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    • 2006
  • In this paper, we have investigated the structure and dielectric properties of the $(Ba_{0.6}Sr_{0.4})TiO_3$ (BST) thin films fabricated on MgO(100)/Si substrate by an alkoxide-based sol-gel method. Both the structure and morphology of those films were analyzed by x-ray diffraction (XRD) and atomic force microscope (AFM). For the MgO(100)/Si substrate, the BST thin films exhibited highly (100) orientation. The highly (100)-oriented BST thin films showed high dielectric constant, tunability, and figure of merit (FOM). The dielectric constant, dielectric loss and tunability of the BST thin films annealed at $700^{\circ}C$ deposited on the MgO(100)/Si substrate measured at 10 kHz were 515.9, 0.0082, and 54.3%, respectively.

Chemical Mechanical Polishing (CMP) Characteristics of Ferroelectric BST Thin Film (강유전체막의 CMP 특성)

  • Park, Sung-Woo;Kim, Nam-Hoom;Lee, Woo-Sun;Seo, Yong-Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.11a
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    • pp.719-722
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    • 2004
  • In this work, we applied the chemical mechanical polishing (CMP) process to the planarization of ferroelectric film. We compared the structural characteristics of BST $(Ba_{0.6}Sr_{0.4}TiO_3)$ films before and after the CMP process. Their dependence on slurry composition was also investigated. Finally, we suggest the self-developed titania $(TiO_2)$ mixed abrasive slurry (MAS) for FRAM applications. Our experimental results on the ferroelectric film are encouraging for the next generation of FRAM applications.

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