• Title/Summary/Keyword: (칩유동)

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Flow Analysis and Design of a Microchannel in a Lab-on-a-chip actuated with an Air Bladder (공기주입기로 구동되는 랩온어칩 내의 유동 해석과 미세 유로 설계)

  • Kang, Tae-Ho;Park, Sin-Wook;Yang, Sang-Sik
    • Proceedings of the KIEE Conference
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    • 2007.07a
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    • pp.1546-1547
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    • 2007
  • 휴대용 면역진단 시스템을 구현하기 위하여 설계된 공기주입기로 구동되는 랩온어칩 내의 유체 유동을 컴퓨터 시뮬레이션을 통하여 해석하고, 문제점을 보완할 수 있는 구조로 랩온어칩을 재설계하였다. 공기주입기에서 흘러나오는 공기를 이용해 완충액 저장고 내에 있는 완충액을 토출시킬 때 다량의 기포가 발생함을 시뮬레이션 결과를 통해 알 수 있었다. 완충액 저장고의 내부에 계단형 구조를 삽입함으로서 완충액 이송 시 형성되는 기포를 상당히 억제할 수 있었다. 또한 계단형 구조는 유선을 역행 방지판 쪽으로 분산시켜 역행 방지판의 효율을 높일 것이다.

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Numerical Analysis of the Flow Characteristics of High-Pressure Injection Nozzle for Machine Tools (공작기계용 HP Holder 분사노즐 유동특성에 관한 수치해석)

  • Yi, Chung-Seob;Yun, Ji-Hun;Jeong, In-Guk;Song, Chul-Ki;Suh, Jeong-Se
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.35 no.10
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    • pp.1061-1066
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    • 2011
  • In this study, the flow characteristics of an injection nozzle installed in a high-pressure holder for improving productivity were determined. The inlet velocity, nozzle inflow angle, and nozzle outlet diameter were selected as design factors having an influence on the flow characteristics, and numerical analysis was conducted for these factors. As the inlet velocity is high and the nozzle outlet diameter is small, the pressure and velocity of the injected flow are high. In the case of the nozzle inflow angle, the variation of flow characteristics according to angle was slight, but the highest pressure and velocity were found at $15^{\circ}$. In addition, the possibility of chip elimination by the injected flow was analyzed on the basis of the numerical results.

Development of Micro-chip Removal Equipment Using Bubble (버블을 이용한 미세칩 제거장치의 개발)

  • Choi, Sung-Yun;Kwon, Dae-Gyu;Lee, Sea-Han;Park, Tae-hyun;Wang, Duck Hyun
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.20 no.10
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    • pp.88-94
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    • 2021
  • Machining operations require the removal of chips to keep the water-soluble cutting oil clean and fresh throughout the operation time. Water-soluble cutting oil for metal processing is diluted using a 3-8% solution in water which is generally replaced every three to six months. This study aims to develop multiple purification devices to efficiently remove fine contaminating particles from water-soluble cutting oil. The 2D concept designs were created using AutoCAD. The designs were drawn using the 3D modelling feature of CATIA. Flow analysis was performed in a bubble purifier using Ansys computational fluid dynamics (CFD). This analysis has aided in improving the design and structure of the device to create the final prototype. Experiments were conducted to check the prototype's performance. Comparisons of the effects of each process variable on the experiment was carried out using ANOVA.

Performance Evaluation of Microchip Removal Device Rotating by Conveyor Belt with Neodymium Permanent Magnet (네오디뮴 영구자석을 이용한 컨베이어벨트 구동형 미세칩 포집장치의 성능 평가)

  • Choi, Sung-Yun;Wang, Jun-hyeong;Wang, Duck Hyun
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.20 no.1
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    • pp.103-109
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    • 2021
  • Fine chips generated by machining have an impact on machine failure and quality of machined products, it is necessary to remove the chips, so the microchip collection and removal device by rotating conveyor belt with neodymium permanent magnets was developed. In this research, to solve the problem for reducing the existing microchips in the tank, a micro-chip removal device by rotating conveyor belt with neodymium permanent magnets developed. In the development of micro-chip removal device, 3D CATIA modeling was used, and the flow analysis and the electromagnetic force analysis were performed with COMSOL Multiphysics program. To evaluate the performance of the prototypes produced, design of experiments (DOE) is used to obtain the effect of neodymium conveyor movement speed on chip removal for the ANOVA analysis of recovered powders. An experiment was conducted to investigate the effect of the conveyor feed rate on the chip removal performance in detail. As a result of the experiment, it was confirmed that the slower the feeding speed of the fine chip removing device, the more efficient the chip removal.

Study of On-chip Liquid Cooling in Relation to Micro-channel Design (마이크로 채널 디자인에 따른 온 칩 액체 냉각 연구)

  • Won, Yonghyun;Kim, Sungdong;Kim, Sarah Eunkyung
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.4
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    • pp.31-36
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    • 2015
  • The demand for multi-functionality, high density, high performance, and miniaturization of IC devices has caused the technology paradigm shift for electronic packaging. So, thermal management of new packaged chips becomes a bottleneck for the performance of next generation devices. Among various thermal solutions such as heat sink, heat spreader, TIM, thermoelectric cooler, etc. on-chip liquid cooling module was investigated in this study. Micro-channel was fabricated on Si wafer using a deep reactive ion etching, and 3 different micro-channel designs (straight MC, serpentine MC, zigzag MC) were formed to evalute the effectiveness of liquid cooling. At the heating temperature of $200^{\circ}C$ and coolant flow rate of 150ml/min, straight MC showed the high temperature differential of ${\sim}44^{\circ}C$ after liquid cooling. The shape of liquid flowing through micro-channel was observed by fluorescence microscope, and the temperarue differential of liquid cooling module was measuremd by IR microscope.

Heat Conduction Analysis of Metal Hybrid Die Adhesive Structure for High Power LED Package (고출력 LED 패키지의 열 전달 개선을 위한 금속-실리콘 병렬 접합 구조의 특성 분석)

  • Yim, Hae-Dong;Choi, Bong-Man;Lee, Dong-Jin;Lee, Seung-Gol;Park, Se-Geun;O, Beom-Hoan
    • Korean Journal of Optics and Photonics
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    • v.24 no.6
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    • pp.342-346
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    • 2013
  • We present the thermal analysis result of die bonding for a high power LED package using a metal hybrid silicone adhesive structure. The simulation structure consists of an LED chip, silicone die adhesive, package substrate, silicone-phosphor encapsulation, Al PCB and a heat-sink. As a result, we demonstrate that the heat generated from the chip is easily dissipated through the metal structure. The thermal resistance of the metal hybrid structure was 1.662 K/W. And the thermal resistance of the total package was 5.91 K/W. This result is comparable to the thermal resistance of a eutectic bonded LED package.

In situ Microfluidic Method for the Generation of Uniform PEG Microfiber (PEG 마이크로 섬유 제조를 위한 마이크로플루이딕 제조방법)

  • Choi, Chang-Hyung;Jung, Jae-Hoon;Lee, Chang-Soo
    • Korean Chemical Engineering Research
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    • v.48 no.4
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    • pp.470-474
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    • 2010
  • In this study, we presents a simple microfluidic approach for generating uniform Poly(ethylene glycol)(PEG) microfiber. Elongated flow pattern of monomer induced by sheath flow of immiscible oil as continuous phase is generated in Y-shape junction and in situ polymerization by UV exposure. For uniform microfiber, we investigate the optimized flow condition and draw phase diagram as function of Ca and Qd. At the region for stable elongated flow pattern, the microfiber generated in microfluidic chip is very uniform and highly reproducible. Importantly, the thickness of microfibers can be easily controlled by flow rate of continuous and disperse phase. We also demonstrate the feasibility for biological application as encapsulating FITC-BSA in PEG microfiber.

A Numerical Study on the Flow Uniformity according to Chamber Shapes Used for Test of the Semi-Conductor Chip (반도체 칩 테스트용 챔버 형상에 따른 유동 균일성에 대한 수치적 연구)

  • LEE, DAEGYU;MA, SANG-BUM;KIM, SUNG;KIM, JEONG-YEOL;KANG, CHAEDONG;KIM, JIN-HYUK
    • Transactions of the Korean hydrogen and new energy society
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    • v.31 no.5
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    • pp.480-488
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    • 2020
  • This study was conducted to improve the flow uniformity inside the chip tester through changing the flow path formation according to the inlet and outlet position of chamber. The internal flow and velocity distributions of the modified chamber models (Cases 1-3) were compared with the reference chamber model through three-dimensional Reynolds-averaged Navier-Stokes equations with k-ε turbulence model. The modified chamber models showed the superior flow uniformity characteristics compared to the reference chamber model. To investigate the flow uniformity in the chip tester, the standard deviation of the velocity was defined and compared. Through the internal flow analysis and assesment of the standard deviation, Case 2 among the test cases including the reference model showed the best flow uniformity generally.

(CyOz)-SiHx 전구체로 중착된 저유전상수 유동박막의 산소 분압에 따른 특성 연구

  • Lee, Chae-Min;O, Hyo-Jin;Kim, Hun-Bae;Park, Ji-Su;Park, Dae-Won;Jeong, Dong-Geun;Kim, Dae-Gyeong;Chae, Hui-Yeop
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.344-344
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    • 2013
  • 칩의 크기가 감소함에 따라 RC (Resistance, Capacitance) 지연, 전력소비증가 및 신호잡음 등이 문제가 되어왔다. RC지연 문제는 배선에 알루미늄 보다 비저항이 낮은 구리를 사용하고 절연막으로 유전상수가 낮은 물질을 사용하여 개선될 수 있다. 이와 같은 맥락에서 점차 저유전상수 박막의 필요성은 증가하고 있다. 그러므로 이를 개선하기 위해 저 유전상수 값을 가지는 물질을 개발 혹은, UV나 플라즈마 그리고 열을 이용하여 처리하는 연구가 절실히 요구되고 있으며, 현재 많은 연구가 진행되고 있다. 이 논문에서 저유전박막은 HDP-CVD (High Density Plasma Chemical Vapor Deposition) 시스템에서 (CyOz)-SiHx와 O2의 비율을 각각 변화시키면서 증착 되었다. (CyOz)-SiHx와 O2의 비율은 60/150, 60/180, 60/210, 60/240로 증가하면서 증착하였다. 그리고 surface profilometer을 이용하여 박막의 증착율을 측정하고 LCR meter를 이용하여 정전용량을 측정하여 유전상수 값을 얻었다. 박막의 화학적 조성과 구조는 FTIR (Fourier Transform Infrared Spectroscopy)로 측정하였다. 박막의 유동 특성은 SEM (Scanning electron microscope) 이미지로 살펴보았다.

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Implementation of Capacitive Passive Telemetry RF Sensor System Using RLS Estimation Algorithm (RLS 추정 알고리즘을 이용한 정전용량형 원격 RF 센서 시스템 구현)

  • Kim, Gyeong-Yeop;Yu, Dong-Guk;Lee, Jun-Tak
    • Proceedings of the Korean Institute of Intelligent Systems Conference
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    • 2007.11a
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    • pp.131-137
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    • 2007
  • 본 연구에서는 RLS(Rescursive Least Square) 추정 알고리즘을 이용하여 정전용량형 센서를 사용한 원격 RF 센서 시스템을 구현하고자 한다. IC 칩 형태의 원격 RF 센서 시스템이 가지는 구성의 복잡성 그리고 전력소모 문제를 해결하기 위해 보다 간단한 유도결합모델이 제안된다. 원격 RF 시스템은 페이저법을 이용하여 수학적으로 모델링되며, 모델기반의 RLS 알고리즘을 적용하기위해 시스템의 파라메타를 재배열한다. 오차 제곱합의 수렴특성을 가진 RLS 알고리즘을 이용하여 정전용량 파라메타를 추정한다. 실제 위상차를 측정하기 위해 Exclusive OR를 이용한 위상차 감지 장치를 제안한다. 센서로는 각종 환경 측정-습도, 압력 등-에 실제 활용되고 있는 정전용량형 센서를 채택한다. 잡음을 내포한 측정 데이터에 대한 추정 성능을 확인함으로써 그 유효성을 검증하고자 한다.

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