• 제목/요약/키워드: $V_{CE-SAT}$

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1,200V 급 Trench Gate Field stop IGBT 공정변수에 따른 스위칭 특성 연구 (A Study on Switching Characteristics of 1,200V Trench Gate Field stop IGBT Process Variables)

  • 조창현;김대희;안병섭;강이구
    • 전기전자학회논문지
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    • 제25권2호
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    • pp.350-355
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    • 2021
  • IGBT는 MOSFET과 BJT의 구조를 동시에 포함하고 있는 전력반도체 소자이며, MOSFET의 빠른 스위칭 속도와 BJT의 고 내압, 높은 전류내량 특성을 갖고 있다. GBT는 높은 항복전압, 낮은 VCE-SAT, 빠른 스위칭 속도, 고 신뢰성의 이상적인 파워 반도체 소자의 요구사항을 목표로 하는 소자이다. 본 논문에서는 1,200V 급 Trench Gate Field Stop IGBT의 상단 공정 파라미터인 Gate oxide thickness, Trench Gate Width, P+ Emitter width를 변화시키면서 변화하는 Eoff, VCE-SAT을 분석하였고, 이에 따른 최적의 상단 공정 파라미터를 제시하였다. Synopsys T-CAD Simulator를 통해 항복전압 1,470V와 VCE-SAT 2.17V, Eon 0.361mJ, Eoff 1.152mJ의 전기적 특성을 갖는 IGBT 소자를 구현하였다.

1,200 V급 Trench Si IGBT의 설계 및 전기적인 특성 분석 (Design and Analyzing of Electrical Characteristics of 1,200 V Class Trench Si IGBT with Small Cell Pitch)

  • 강이구
    • 한국전기전자재료학회논문지
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    • 제33권2호
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    • pp.105-108
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    • 2020
  • In this study, experiments and simulations were conducted for a 1,200-V-class trench Si insulated-gate bipolar transistor (IGBT) with a small cell pitch below 2.5 ㎛. Presently, as a power device, the 1,200-V-class trench Si IGBT is used for automotives including electric vehicles, hybrid electric vehicles, and industrial motors. We obtained a breakdown voltage of 1,440 V, threshold of 6 V, and state voltage drop of 1.75 V. This device is superior to conventional IGBTs featuring a planar gate. To derive its electrical characteristics, we extracted design and process parameters. The cell pitch was 0.95 ㎛ and total wafer thickness was 140 ㎛ with a resistivity of 60 Ω·cm. We will apply these results to achieve fine-pitch gate power devices suitable for electrical automotive industries.

1,200 V Reverse Conducting IGBT의 전기적 특성 분석 (Electrical Characteristics of 1,200 V Reverse Conducting-IGBT)

  • 김세영;안병섭;강이구
    • 한국전기전자재료학회논문지
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    • 제33권3호
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    • pp.177-180
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    • 2020
  • This paper focuses on the 1,200-V level reverse conducting-insulated gate bipolar transistor (RC-IGBT). The structure of the RC-IGBT has an n+ collector at the collector terminal. The breakdown voltage, Vth, Vce-sat, and turn-off time, and the electrical characteristics of a field-stop IGBT (FS-IGBT) and RC-IGBT are compared and analyzed using simulations. Based on the results, the RC-IGBT obtained a turn-off time of 320.6 ㎲ and a breakdown voltage of 1,720 V, while the FS-IGBT obtained a turn-off time of 742.2 ㎲ and a breakdown voltage of 1,440 V. Therefore, RC-IGBTs have faster on/off transitions and a higher breakdown voltage, which can reduce the size of the element.

Local Lifetime Control이 TGBT의 스위칭 및 래치업 특성에 미치는 영향 (Effects of the Local Lifetime Control on the Switching and Latch-up Characteristics of IGBT)

  • 이세규;정상구
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 하계학술대회 논문집 D
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    • pp.1953-1955
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    • 1999
  • The effects of the local lifetime control on the characteristics of IGBT are investigated using the 2-dimensional device simulator, MEDICI. Many lumped resistive turn-off simulations are carried out to analyze the effects of the minority carrier lifetime, the width, and the position of the region with a reduced local minority carrier lifetime. As a result of these simulations, it is concluded that the on state voltage drop$(V_{CE,SAT})$ is only slightly increased while the switching behavior is greatly improved if the low lifetime region is properly set. And these results are compared with IGBTs having uniform lifetime.

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