• Korean Journal of Materials Research
• /
• v.6 no.8
• /
• pp.825-832
• /
• 1996

적외선 센서의 재료로 활용되고 있는 PLT박막 (두께:8000$\AA$-9000$\AA$)을 Pt/Ti/SiO2/Si와 Pt/M\ulcorner의 하부 구조상에 50$0^{\circ}C$, 55$0^{\circ}C$ 및 $600^{\circ}C$에서 스퍼터링 증착하여 결정성 및 전기적 특성을 조사하였다. $600^{\circ}C$로 in-situ 성장된 PLT박막은 Si기판을 이용한 경우 randomly oriented perovskite 결정구조를 나타내었으며, Pt/MgO 구조위에서는 c-축(00ι)방향으로 배향 성장되었다. $600^{\circ}C$에서 in-situ 성장된 PLT박막의 비유전상수($\varepsilon$r)와 유전정접(tan $\delta$)을 10kHz-100kHz의 주파수에서 측정한 결과 Pt/Ti/SiO2/Si 구조상에 증착된 박막은$\varepsilon$r=90과 tan $\delta$=0.02의 값을 Pt/MgO 구조상에 증착된 박막은 $\varepsilon$e=35와 tan$\delta$=0.01의 값을 나타내었다. 잔류분극량(2Pr)과 초전계수(${\gamma}$)는 상온부근에서 Si 기판을 이용한 경우 각각 0.6$\mu$C/$\textrm{cm}^2$.。C과 0.5x10-8C/$\textrm{cm}^2$.。C정도로 매우 작게 나타났으나 PLT/Pt/MgO 구조에서는 2Pr=5$\mu$C/$\textrm{cm}^2$, r=4x10-8C/$\textrm{cm}^2$.。C로 비교적 양호한 초전박막의 전기적 특성을 나타내었다.

• Korean Journal of Materials Research
• /
• v.5 no.6
• /
• pp.754-762
• /
• 1995

Strontium titanate(SrTiO$_3$) thin film was prepared on Si substrates by RF magnetron sputtering for a high capacitance density required for the next generation of LSTs. The optimum deposition conditions for SrTiO$_3$thin film were investigated by controlling the deposition parameters. The crystallinity of films and the interface reactions between SrTO$_3$film and Si substrate were characterized by XRD and AES respectively. High quality films were obtained by using the mixed gas of Ar and $O_2$for sputtering. The films were deposited at various bias voltages to obtain the optimum conditions for a high quality file. The best crystallinity was obtained at film thickness of 300nm with the sputtering gas of Ar+20% $O_2$and the bias voltage of 100V. The barrier layer of Pt(100nm)/Ti(50nm) was very effective in avoiding the formation of SiO$_2$layer at the interface between SrTiO$_3$film and Si substrate. The capacitor with Au/SrTiO$_3$/Pt/Ti/SiO$_2$/Si structure was prepared to measure the electric and the dielectric properties. The highest capacitance and the lowest leakage current density were obtained by annealing at $600^{\circ}C$ for 2hrs. The typical specific capacitance was 6.4fF/$\textrm{cm}^2$, the relative dielectric constant was 217, and the leakage current density was about 2.0$\times$10$^{-8}$ A/$\textrm{cm}^2$ at the SrTiO$_3$film with the thickness of 300nm.

• Journal of the Korean institute of surface engineering
• /
• v.35 no.6
• /
• pp.415-421
• /
• 2002

Ti-Si-N coating layers were codeposited on silicon wafer substrates by a DC reactive magnetron sputtering technique using separate titanium and silicon targets in $N_2$/Ar gas mixtures. The oxidation behavior of Ti-Si-N coating layers containing 4.0 at.%, 10.0 at.%, and 27.3 at.% Si was investigated at temperatures ranging from 600 to $960^{\circ}C$. The coating layers containing 4.0 at.% Si became fast oxidized from $600^{\circ}C$ while the coating layers containing 10.0 at.% Si had oxidation resistance up to $800^{\circ}C$. It was concluded that an increase in Si content to a level of 10.0 at.% led to the formation of finer TiN grains and a uniformly distributed amorphous Si3N4 phase along grain boundaries, which acted as efficient diffusion barriers against oxidation. However, the coating layers containing 27.3 at.% Si showed relatively low oxidation resistance compared with those containing 10.0 at.% Si. This phenomenon would be explained by the existence of free Si which was not nitrified in the coating layers containing 27.3 at.% Si.

• Journal of Korea Foundry Society
• /
• v.15 no.4
• /
• pp.368-376
• /
• 1995

An Al-composite material was fabricated with using the rheocompocasting process and the microstructure of the Al-Cu/SiCp composite material was investigated depending on the stirring times and the amount of Ti additions. The distribution of SiC dispersion shows the good result at the stirring time of 30 min. The degree of microdistribution of the $Al_2Cu$ and SiCp is improved when the amount of Ti addition is increased. At the compositon of 0.3%Ti, the primary solid is the compound of $Al_3Ti$ and no exist of the SiCp and $Al_2Cu$ phase around the primary $Al_3Ti$. In the process of compositization, SiCp is found at the primary and final solid parts and is found at the final solid part after remelting. $Al_2Cu$ and SiCp are distributed around and outside of dendrite or independently after remelting, which is different from the process of compositization.

• Korean Journal of Materials Research
• /
• v.1 no.4
• /
• pp.198-205
• /
• 1991

Sintered thermistor body was fabricated by solid reaction method using $Fe_2O_3, \;Al_2O_3, \;TiO_2$ and Si powder. Surface matrix of sintered body was investigated by SEM and $\beta$-constant was obtained from measurement of resistance variation in liquid bath. The values of thermistor constant $\beta$ of samples in the temperature range $-50~+50^{\circ}C$ were distributed from 927 to 4005k. This thermistor body can be used as temperature sensor for radiosonde.

• Electrical & Electronic Materials
• /
• v.10 no.6
• /
• pp.541-547
• /
• 1997

(Pb$_{1-x}$ La$_{x}$)Ti$_{1-x}$ $_4$O$_3$(x=0, 0.02, 0.04, 0.08) ceramic thin films were fabricated by Sol-Gel method. A stock solution of (Pb, La)TiO$_3$ with excess Pb 10 mol% was made and spin-coated on the Pt/Ti/SiO$_2$/Si substrate at 400rpm for 30 seconds. Coated specimens were dried on the hot-plate at 35$0^{\circ}C$ for 10 min and sintered at 500~75$0^{\circ}C$ for 1 hour. The dielectric constant, remanent polarization and coercive field of the PLT(6at.%) thin films sintered at $650^{\circ}C$ were 884, 13.95$\mu$C/$\textrm{cm}^2$ and 8.7kV/cm, respectively. Pyroelectric coefficient, figure of merit of pyroelectric current, voltage responsivity and detectivity of PLT(6at.%) thin films were 3.2$\times$10$^{-8}$ C/$\textrm{cm}^2$K, 1.02$\times$10$^{-8}$ C.cm/J, 2.9 $\times$10$^{-11}$ C.cm/J, 0.29$\times$10$^{-8}$ C.cm/J, respectively.ely.

• Journal of the Korean Ceramic Society
• /
• v.40 no.2
• /
• pp.206-211
• /
• 2003

Effects of substrates and buffer layer upon the formation of crystalline phases and ferroelectricity of $YMnO_3$ thin films were investigated. The hexagonal $YMnO_3$ was easily formed on Si(100) while the mixed phases, hexagonal and orthorhombic $YMnO_3$, on $Pt(111)/TiO_2/SiO_2/Si$ substrate. When the $Y_2O_3$ buffer layer of 70 nm thick was inserted between the substrates and the $YMnO_3,$ the c-axis oriented hexagonal single phase formed on both substrates, Si(100) and $Pt(111)/TiO_2/SiO_2/Si$. The leakage current density of the hexagonal $YMnO_3$ thin films was lower than that consisting of mixed phases, hexagonal and orthorhombic. Furthermore the hexagonal $YMnO_3$ with c-axis preferred orientation showed the lowest leakage current density. The remnant polarization from a P-E hysteresis curve for the $YMnO_3$ formed on Si(100) was 0.14 without buffer layer and $0.24_{mu}C/cm^2$ for that with buffer layer. For the $Pt(111)/TiO_3/SiO_3/Si$ substrates, the specimen without $Y_2O_3$buffer layer did not show the hysteresis curve, while the buffer-layered has the remnant polarization of $1.14_{mu}C/cm^2$. It was concluded that the leakage current density and the ferroelectricity for the $YMnO_3$ thin films could be controlled by varying crystalline phases and their preferred orientation which depend on the kind of substrates and whether the $Y_2O_3$buffer layer exist or not.

• Journal of the Microelectronics and Packaging Society
• /
• v.5 no.2
• /
• pp.59-64
• /
• 1998

Pt/SiO2/Si 기판구조위에 스크린인쇄법과 졸-겔법에 의해 (Pb, La)TiO3(PLT) 후막 과 박막을 도포시켜 $650^{\circ}C$후속열처리 온도에서 결정화한후 결정특성과 전기적 특성을 조사 하였다. $650^{\circ}C$ 온도에서 후속열처리된 PLT 시료의 경우 전형적인 perovskite 결정구조를 보 여주었다. SEM 단면형상으로부터 Pt 전극과 PLT막 사이에는 비교적 평활한 계면형상을 보여주었다. PLT 후막과 박막시료의 잔류분극(2Pr) 값은 약 1$\mu$C/cm2 으로각각 나타났으며 이와같이 후막 PLT시료에 비해 박막시료의 잔류분극값이 큰이유는 박막시료가 보다 양호 한 결정성을 지니기 때문이었다. 상온부근에서 후막과 박막시료의 초전계수값은 약 1.5nC/cm2.$^{\circ}C$와 4.0nC/cm2.$^{\circ}C$의 값을 각각 나타내었으며 누설전류의 크기는 약 0.3~0.8$\mu$ A/cm2의 비교적 양호한 누설전류 특성을 얻었다.

• Journal of the Korean Vacuum Society
• /
• v.9 no.4
• /
• pp.373-378
• /
• 2000

There was a great difference in the formation kinetics of $TiO_2$ and $Bi_2O_3$ on silicon, but the growth of bismuth titanate (BIT) thin film was mainly limited by the formation of $TiO_2$. As a result, the BIT film was easy to be lack of bismuth. The pulse injection metalorganic chemical vapor deposition (MOCVD) process was introduced in order to overcome this problem by recovering the insufficient bismuth content in the film. By this pulse injection method, bismuth content was increased and also the uniform in-depth composition of the film was attained with a abrupt $Bi_4Ti_3O_{12}/Si$ interface. In addition, the crystallinity of $Bi_4Ti_3O_{12}$ thin film prepared by pulse injection process was greatly improved and the leakage current density was lowered by 1/2~1/3 of magnitude. Clockwise hysteresis of C-V was observed and the ferroelectric switching was confirmed for $Bi_4Ti_3O_{12}$ film deposited by pulse injection method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2000.04b
• /
• pp.72-75
• /
• 2000

The effect of $Al_2O_3+Y_2O_3$ additives on fracture toughness of ${\beta}-SiC-TiB_2$ composites by hot-pressed sintering were investigated, The ${\beta}-SiC-TiB_2$ ceramic composites were hot-presse sintered and annealed by adding 4, 8, 12wt% $Al_2O_3+Y_2O_3$(6 : 4wt%) powder as a liquid forming additives at low temperature($1800^{\circ}C$) for 4h. In this microstructures, the relative density is over 97% of the theoretical density and the porosity increased with increasing $Al_2O_3+Y_2O_3$ contents because of the increasing tendency of pore formation. But the fracture toughness showed the highest of $7.0MPa{\cdot}m^{1/2}$ for composites added with 12wt% $Al_2O_3+Y_2O_3$ additives at room temperature. The electrical resistivity showed the lowest of $1.59\times10^{-3}\Omega{\cdot}cm$ for composite added with 8wt% $Al_2O_3+Y_2O_3$ additives at room temperature and is all positive temperature coefficient resistance(PTCR} against temperature up to $700^{\circ}C$.