• 한국정보통신학회:학술대회논문집
• /
• 한국해양정보통신학회 2003년도 춘계종합학술대회
• /
• pp.501-504
• /
• 2003

본 연구에서는 박막트랜지스터의 특성 향상을 위하여 강유전성 박막을 게이트 절연충으로 사용하기 위하여 강유전성 박막과 a-Si:H 의 계면특성을 조사하였다. 먼저 강유전성 박막 중에 대표적인 SrTiO$_3$를 E-BEAM 증착기로 박막을 형성시켰다. 형성된 박막은 $N_2$ 분위기에서 15$0^{\circ}C$~$600^{\circ}C$로 1시간 ANNEALING 하여 전자현미경으로 표면을 측정하였다. SrTiO$_3$의 유전상수는 50~100 정도였으며 항복전계는 1~l.5 MV/cm로 매우 우수한 유전특성을 갖고 있었다. 강유전체 박막 위에 a-SiN:H,a-Si:H(n-type a-Si:H) 등을 PECVD로 증착하여 MFNS구조를 형성하였다. 계면특성을 C-V PLOTTER로 측정한 결과 SrTiO$_3$ 박막은 SiN 과의 접합이 매우 안정되어 있었고 C-V특성은 SiN/a-Si:H 과 유사하였다. 그러나 FERROELECTRIC/a-S:H의 경우가 훨씬 CAPACITANCE값이 컸으며, 이는 강유전체 박막의 높은 유전상수에 기인 된 것이라 생각된다.

• 한국재료학회지
• /
• 제6권3호
• /
• pp.318-323
• /
• 1996

원소 분말을 합성하여 Ti5SI3 화합물을 합성하는 방법을 연구하였다. 합성법으로서는 기본적으로 반응소결법을 사용하였으며, 치밀화를 위하여는 유사-열간 정수압 성형법(PHIP, pseude-hot isostatic pressing)을 사용하였다. 반응소결법에서는 분말의 입도, 반응온도 및 유지시간이 소결밀도에 영향을 주었으며, PHIP법에 의한 치밀화에서는 압력 및 유지 간이 주요 변수로 사용되었다. 이들 변수중 미세한 입도와 유지시간이 기공을 감소시켰다. 또한 Cu의 첨가 영향을 연구하였는데, 약 6wt%이내의 Cu 첨가는 밀도 향상에 좋은 영향을 미쳤다. 반응소결 및 PHIP를 통해 Ti5SI3 -Cu의 상대밀도를 약 99%까지 높일 수 있었으며, 이때 Cu의 효과는 감도지수 부합됨을 확인하였다.

• 전자공학회논문지 IE
• /
• 제43권4호
• /
• pp.8-12
• /
• 2006

본 논문에서는 $SiO_2-ZnO-B_2O_3$ 계 및 $P_2O_5$-ZnO-BaO 계의 반사율과 유전특성을 $TiO_2$의 양에 따라 조사하였다. 반사율은 $TiO_2$ 함량이 증가함에 따랴 감소하였다 여기서 $P_2O_5$-ZnO-BaO계는 $SiO_2-ZnO-B_2O_3$ 계보다 더 낮은 반사율을 나타내었으며, 유전상수는 $P_2O_5$-ZnO-BaO 계가 $SiO_2-ZnO-B_2O_3$ 계보다 높았다. 두 계 모두 유전상수는 $TiO_2$의 양에 따라 증가하는 특성을 보였다. 이 결과는 높은 반사율과 항복특성이 요구되는 PDP디스플레이의 후면 유전층에 적용할 수 있을 것으로 생각된다.

• 한국세라믹학회지
• /
• 제26권3호
• /
• pp.409-415
• /
• 1989

Si3N4-TiN electro-conductive ceramic composites with 7wt% Al2O3＋3wt% Y2O3 or 5wt% MgO as sintering aids were fabricated by pressureless sintering at 1,80$0^{\circ}C$ for 1h. The 3pt. flexural strength, KIC and Vickers hardness were measrued in order to investigate the effects of TiN on the mechanical properties. Also oxidation behavior was observed by measuring the weight gain after exposure to air at 1,10$0^{\circ}C$ for 100h. the reaction products between Si3N4 and TiN was not detected by XRD and EDS. Mechanical properties of the composites were not influenced by the addition of TiN less than 30vol%, but oxidation resistance of the composites was rapidly decreased with the amount of added TiN.

• The Korean Journal of Ceramics
• /
• 제5권4호
• /
• pp.324-330
• /
• 1999

$Si_3N_4$-$TiB_2$ with 2 wt% $Al_2O_3$ and 4 wt% $Y_2O_3$ additives was hot pressed in a flowing $N_2$ environment with varying $TiB_2$ content from 10 to 50 vol%. Variations of mechanical (hardness, fracture toughness, and flexual strength), and tribological properties as a function of $TiB_2$ content were investigated. As the content of $TiB_2$ increased, relative density decreased due to the chemical reaction of $TiB_2$in $N_2$ environment. The reduction of density causes mechanical properties to be degraded with an increase of $TiB_2$ in $Si_3N_4$. Tribological properties were dependent of microstructure as well as mechanical properties, however, they were degraded strongly by the chemical reaction of $Si_3N_4$-$TiB_2$ during hot pressing in $N_2$ environment. SEM and TEM observations, and X-ray diffraction analysis that the chemical reaction products at the interface are TiCN, Si, and $SiO_2$. Also, the comparison of XRD patterns of the $Si_3N_4$-40 vol% $TiB_2$ composites hot pressed at $1,750^{\circ}C$ for 1 hour between in $N_2$ and in Ar gas was made. The XRD peaks of Si and $SiO_2$ were not found in Ar, but still a weak peak of TiCN was presented.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2007년도 제38회 하계학술대회
• /
• pp.1289-1290
• /
• 2007

The composites were fabricated 61Vo.% ${\beta}$-SiC and 39Vol.% $TiB_2$ powders with the liquid forming additives of 12wt% $Al_{2}O_{3}+Y_{2}O_{3}$ as a sintering aid by pressure or pressureless annealing at $1650^{\circ}C$ for 4 hours. The present study investigated the influence of annealed sintering on the microstructure and mechanical of SiC-$TiB_2$ electroconductmive ceramic composites. Reactions between SiC and transition metal $TiB_2$ were not observed in the microstructure and the phase analysis of the SiC-$TiB_2$ electroconductive ceramic composites. Phase analysis of SiC-$TiB_2$ composites by XRD revealed mostly of ${\alpha}$-SiC(6H), $TiB_2$, and In Situ YAG($Al_{5}Y_{3}O_{12}$). The relative density, the flexural strength, the Young's modulus showed the highest value of 86.69[%], 136.43[MPa], 52.82[GPa] for pressure annealed SiC-$TiB_2$ ceramic composites.

• 한국재료학회지
• /
• 제15권12호
• /
• pp.765-772
• /
• 2005

PAS(Plasma Activated Sintering) process was tried to apply for the fabrication of BMG(Bulk Metallic Glasses) of $Ni_{57}Zr_{20}Ti_{18}Si_5}\;and\;Ni_{57}Zr_{20}Ti_{18}Si_3Sn_2$ from the as-atomized amorphous powder. Compressive strength for the BMG(bulk Metallic Glasses) of $Ni_{57}Zr_{20}Ti_{18}Si_5$ were lower than those of BMG rods produced by warm extrusion ,or copper mold casting method. Microstructural examination by optical microcope, SEM ana EDS showed that oxidation had occurred during PASintering. In order to prevent the powder from the oxidation during PASintering, Ni coating for $Ni_{57}Zr_{20}Ti_{18}Si_5$ amorphous powder by electroless-plating method was performed. Microstructural examination for Ni coated layers after PASintering indicated that the Ni coating had been so effective to prevent powder from oxidation during PASintering. Sintering behaviors of $Ni_{57}Zr_{20}Ti_{18}Si_3Sn_2$ represent the same as those of $Ni_{57}Zr_{20}Ti_{18}Si_5$.

• 마이크로전자및패키징학회지
• /
• 제7권3호
• /
• pp.7-11
• /
• 2000

공침법을 이용하여 제조한 $SrTiO_3$분말에 $CuO-SiO_2$첨가물을 혼합하여 저전압구동형 SrTiO$_3$세라믹 바리스터 소자를 제조하였다. $CuO-SiO_2$첨가물을 이용한 $SrTiO_3$세라믹 바리스터제조 공정은 복잡한 공정을 단순화시킬 수 있을 뿐만 아니라, 일반적인 소결온도보다 100~$150^{\circ}C$ 낮은 온도에서도 소결이 되었다. 이 바리스터의 비직선계수($\alpha$) 값은 첨가물 5 wt% 혼합하여 $1350^{\circ}C$에서 하소한 시편에서 8.47의 최고값을 나타냈으며, 이때의 구동전압은 7 V 이하로 낮은 구동전압을 가진 바리스터를 제조할 수 있었다.

• 대한금속재료학회지
• /
• 제49권7호
• /
• pp.577-582
• /
• 2011

The newly developed ${\alpha}-case$ controlled mold material for Ti investment castings was suggested in this research. The $Al_2O_3$ mold containing interstitial $TiO_2$ and substitutional $Ti_3Al$ was manufactured by the reaction between $Al_2O_3$ and Ti. It is obvious that as the $TiO_2$ and $Ti_3Al$ content in the mold surface were increased, the depth of the interfacial reaction was significantly reduced. In addition, substitutional $Ti_5Si_3$ in the mold surface owing to the reaction between Ti and $SiO_2$ from the binder was effective for ${\alpha}-case$ reduction. Therefore, the ${\alpha}-case$ reduction was accomplished by the diffusion barrier effect of interstitial $TiO_2$, substitutional $Ti_3Al$ and $Ti_5Si_3$.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제50권11호
• /
• pp.544-549
• /
• 2001

The mechanical and electrical properties of the hot-pressed and pressureless annealed SiC-39vo1.%TiB$_2$electroconductive ceramic composites were investigated as functions of the liquid additives of $Al_2O_3+Y_2O_3$ and the sintering temperature. The result of phase analysis for the SiC-39vo1.%TiB$_2$ composites by XRD revealed $\alpha -SiC(6H),\; TiB_2,\; and YAG(Al_5Y_3O_{12})$ crystal phase. The relative density of SiC-39vo1.% $TiB_2$ composites was increased with increased $Al_2O_3+Y_2O_3$ contents. The fracture toughness showed the highest value of $7.8 MPa.m_{1/2}$ for composites added with 12 wt% $Al_2O_3+Y_2O_3$additives at $1750^{\circk}C$. The electrical resistivity of the SiC-39vo1.%$TiB_2$composites was all positive temperature coefficient resistance(PTCR) in the temperature range of $25S^{\circ}C \;to\; 700^{\circ}C$.