• 제목/요약/키워드: $TaAlO_4$

검색결과 58건 처리시간 0.019초

$Li_2O-Al_2O_3-Ta_2O_5$ 삼성분계에 있어 $LiTaO_3$ 고용체의 구조 및 특성에 관한 연구 (Structure and Properties of $LiTaO_3$ Type Solid Solutions in $Li_2O-Al_2O_3-Ta_2O_5$ Ternary System)

  • 김정돈;흥국선;주기태
    • 한국세라믹학회지
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    • 제33권4호
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    • pp.405-410
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    • 1996
  • The partial substitution of LiTaO3 with Al2O3 caused the variation of dielectric properties and a lower melting temperature yielding an easier growth of single crystal. The lattice constants and Raman band broadening were measured for the LiTaO3 solid solution in which the cations of Li+ and Ta5+ were partially substituted by Al3+ cation. The LiTaO3 type limit phases were obtained. ; Li1.15Al0.45Ta0.7O3 for cationic excess Li1.15Al0.45Ta0.7O3 for stoichiometry Li0.85Al0.05TaO3 for cationic deficit. The second phase was formed beyond the solubility limit. The limit phase (Li0.85Al0.05TaO3) in the region of cationic deficit showed the lowest Cuire temperature of 61$0^{\circ}C$ and melting point of 152$0^{\circ}C$ compared to the solid solutions in other regions (TMp=1$650^{\circ}C$, Tc=69$0^{\circ}C$ for LiTaO3)

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$CF_{4}$ 기체를 이용한 $Ta_{0.5}Al_{0.5}$ 합금 박막의 플라즈마 식각 (Application of $CF_{4}$ plasma etching to $Ta_{0.5}Al_{0.5}$ alloy thin film)

  • 신승호;장재은;나경원;이우용;김성진;정용선;전형탁;오근호
    • 한국결정성장학회지
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    • 제9권1호
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    • pp.60-63
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    • 1999
  • Ta-Al 합금 박막의 건식식각에 대하여 조사하였다. $CF_{4}$ 기체를 이용한 반응성 이온 식각(Reactive Ion Etching, RIE)이 1:1 조성의 Ta-Al 합금 박막의 식각에 적용될 수 있음을 확인하였으며, 식각속도는 $67{\AA}/min$으로 측정되었다. 그리고 $CF_{4}$ 기체는 Ta-Al 합금 박막과 $SiO_{2}$ 층간에 선택성이 없다는 것이 확인되었으며, $SiO_{2}$ 층의 식각속도는 Ta-Al 박막의 경우보다 약 12배 빠른 $800{\AA}/min$으로 측정되었다. 그 외에 $CF_{4}$ 기체를 이용한 반응성 이온 식각에서는 Shiepley 1400-27 Photo Resist 보다 AZ 5214 Photo Resist가 더 안정적이라는 것이 조사되었다.

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가스터빈 엔진부품용 NiCoCrAlY-(Ta, Re, Ir) 코팅의 고온산화특성 (High Temperature Oxidation of NiCoCrAlY-(Ta, Re, Ir) Coatings for Gas Turbines)

  • 최정호;이동복
    • 한국표면공학회지
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    • 제39권3호
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    • pp.129-136
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    • 2006
  • The high velocity oxy-fuel sprayed coatings of 38Ni-23Co-20Cr-11Al-3Y-5Ta, 25Ni-34Co-20Cr-11Al-3Y-2Re and 32Ni-34.5Co-22Cr-11Al-0.5Ir (in wt%) were oxidized at 1000 and $1100^{\circ}C$ in air in order to find the alloying effect of Ta, Re and Ir on the oxidation properties of the NiCoCrAlY-base coatings. The primary phase of the coatings was $Ni_3Al$. The oxides formed on the coatings consisted primarily of ${\alpha}-Al_2O_3$, together with some $CoCr_2O_4,\;CoAl_2O_4$, and $Al_5Y_3O_{12}$. Tantalum oxidized to $Ta_2O_5$ and $Ta_2O_{22}$. However, no oxides of Re and Ir were detected by XRD owing to their thermodynamic inertness and/or their small amount.

APPLICATIN OF $CF_4$ PLASMA ETCHING TO $Ta_{0.5}Al_{0.5}$ ALLOY THIN FILM

  • Shin, Seung-Ho;Na, Kyung-Won;Kim, Seong-Jin;Chung, Yong-Sun;Auh, Keun-Ho
    • 한국결정성장학회:학술대회논문집
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    • 한국결정성장학회 1998년도 PROCEEDINGS OF THE 15TH KACG TECHNICAL MEETING-PACIFIC RIM 3 SATELLITE SYMPOSIUM SESSION 4, HOTEL HYUNDAI, KYONGJU, SEPTEMBER 20-23, 1998
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    • pp.85-90
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    • 1998
  • Reactive ion etching (RIE) of Ta-Al alloy thin film and SiO2 thin films was observed during the etching with the CF4 gas and the could be used effectively to etch the Ta-Al alloy thin film. The etching rate of the thin film at a Ta content of 50 mol% was about 67$\AA$/min. No selectivity between the Ta-Al alloy thin film and SiO2 thin films was observed during the etching with the CF4 gas and the etching rate of the SiO2 layer was 12 times faster than that of the Ta-Al alloy thin film. In addition, it was observed that photoresist of AZ5214 was more useful than Shiepley 1400-2 in RIE with the CF4 gas.

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$SnO_2$ 박막을 이용한 ${Ta_2}{O_5}$박막 커패시터의유전특성 (Dielectric properties of ${Ta_2}{O_5}$ thin film capacitor with $SnO_2$ thin film underlayer)

  • 김진석;정강민;이문희
    • 한국재료학회지
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    • 제4권7호
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    • pp.759-766
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    • 1994
  • 본 연구에서는 Ta 박막 밑에 $SnO_{2}$박막층을 입혀서 $Ta/SnO_2$이중박막이 산화될 때 산소의 공급원을 2원화 함으로써 $Ta_2O_5$의 stoichiomitry를 향상시켜 $Ta_2O_5$박막 커패시터의 주설전류를 줄이고자 하였다. Tantalum을 실리콘 웨이퍼 위에 기판온도를 변화시켜 가면서 전자빔증착이나 스퍼터링 방밥으로 입히고 $500^{\circ}C$~$900^{\circ}C$에서 산화시켜 Al/$Ta_2O_5$p-Si/Al또는Al/$Ta_2O_5$/p-Si/Al과 같은 MIS형 커패시터를 만들어 유전상수 및 누설전류를 측정하였으며 XRD, AES, ESCA등을 이용하여 박막의 결정성 및 특성을 분석하였다. $SnO_{2}$박막층을 입힌 커패시터는$SnO_{2}$층을 입히지 않은 커패시터보다 10배 이상 큰 200정도의 유전상수 값을 나타내었다. 그리고 산화온도가 높으면 박막의 결정화로 인하여 유전상수는 증가하지아는 누설전류도 약간 증가하는 것이 확인되었다. 또한 높은 증착온도는 일반적으로 누설전류를 낮추는 것으로 나타났다. 특히 $SnO_{2}$층을 입힌 경우에 기판온도를 $200^{\circ}C$로 하고 $800^{\circ}C$에서 산화시켜 만든 커패스터의 경우에 $4 \times 10^{5}$V/cm의 전장강도에서 $10^{-7}A/\textrm{cm}^2$의 낮은 누설전류 값을 나타내었다. $Ta_2O_5$박막은 $700^{\circ}C$ 이상에서 박막이 결정되고, Ta /$SnO_{2}$ 이중박막을 산화시키면 처음에는 Ta박막과 $SnO_{2}$박막 계면에서 $SnO_{2}$로부터 Ta박막에 산소가 공급되지마는 점차 Sn이 Ta박막쪽으로 확산되어 결국에는 Ta-Sn-O계의 새로운 ternary oxide가 생성되는 것으로 나타났다.

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터널링 산화막 두께 변화 및 열처리에 따른 Al2O3/TaAlO4/SiO2 다층막의 전기적 특성에 관한 연구 (Electrical Characteristics of Al2O3/TaAlO4/SiO2 Multi-layer Films by Different Tunnel Oxide Thicknesses and Annealing Treatment)

  • 박정태;김효준;최두진
    • 한국세라믹학회지
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    • 제47권5호
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    • pp.461-466
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    • 2010
  • In this study, $Al_2O_3/TaAlO_4/SiO_2$ (A/TAlO/S) structures with tantalum aluminate charge trap layer were fabricated for Nand flash memory device. We evaluated the memory window and retention characteristic as the thickness of the tunnel oxide was varied among 3 nm, 4 nm, and 5 nm. All tunnel oxide thicknesses were measured by ellipsometer and TEM (Transmission Electron Microscope). The A/TAlO/S multi-layer film consisted of 5 nm tunnel oxide showed the best result of memory window of 1.57 V and retention characteristics. After annealing the 5 nm tunnel oxide A/TAlO/S multi-layer film at $900^{\circ}C$. The memory window decreased to 1.32 V. Moreover, the TEM images confirmed that the thickness of multi-layer structure decreased 14.3% after annealing and the program conditions of A/TAlO/S multi-layer film decreased from 13 V to 11 V for 100 ms. Retention properties of both as-deposited and annealed films stably maintained until to $10^4$ cycles.

Hf, Ta가 첨가된 Ti-l5Sn-4Nb계 생체용 합금의 미세조직 및 기계적 성질에 관한 연구 (A Study on Microstructure and Mechanical Properties of Hf, Ta Added Ti-l5Sn-4Nb system Alloys for Biomaterial)

  • 김대환;이경구;박효병;이도재
    • 한국표면공학회지
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    • 제33권4호
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    • pp.251-260
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    • 2000
  • Ta and Hf added Ti-l5Sn-4Nb alloys without V and Al elements for biomaterial were melted by arc furnace in response to recent concerns about the long term safety of Ti-6Al-4V alloy. All specimens were homogenized at $1000^{\circ}C$ and solution treatment was performed at $812^{\circ}C$ and aging treatment at $500^{\circ}C$. The microstructure and mechanical properties were analysed by optical micrograph, hardness tester and instron. Ti-l5Sn-4Nb system alloys showed widmanstatten microstructure which is typical microstructure in $\alpha$$\beta$ type Ti alloys. The Ti-l5Sn-4Nb-2Hf and Ti-l5Sn-4Nb-2Ta alloys showed better hardness and tensile strength compared with Ti-6Al-4V. The result of XPS analysis, Ti-l5Sn-4Nb alloy in air atmosphere consisted of $TiO_2$, SnO and NbO.

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카나다 온타리오 밴크로프트의 맥도날도 페그마타이트 광산에서 산출된 Nb Sphene: 원소 치환에 관한 고찰 (Niobian Sphene from the McDonald Pegmatite Mine, Bancroft, Ontarion, Canada: Consideration of Substitutions)

  • 이정후
    • 한국광물학회지
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    • 제2권1호
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    • pp.8-10
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    • 1989
  • Sphene from the McDonald pegmatite near Bancroft, Ontario, Canada was analyzed using EPMA. It contains 4.3 to 6.3 weight percent of Nb2O5 with an average formula Ca1.02(Ti0.62Al0.22Nb0.07Fe0.06Ta0.01)Si0.99(O4.85F0.16). Three types of subtitutions are possible; 1)2Ti4+=(Nb, Ta)5+ + (Al, Fe3+), 2) Ti + O = (Al, Fe3+) + (F, OH), and 3) 2Ti + O = Fe2+ + (Nb, Ta)5+ + (F, OH). T재 different schemes of substitutions for balancing the analysis are considered when the iron is either all ferric or all ferrous. Assuming stoichiometry fo Ca and Si, a general formula derived from the two different schemes is Ca(Ti0.64Al0.22Fe3+0.06-X {{{{Fe_{x}^{2+} }} Nb0.01)Sio4.80-XF0.16(OH)0.04+x.

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CoFe의 삽입과 산화조건에 따른 자기 터널 접합의 자기저항특성에 관한 연구 (CoFe Layer Thickness and Plasma Oxidation Condition Dependence on Tunnel Magnetoresistance)

  • 이성래;박병준
    • 한국자기학회지
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    • 제11권5호
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    • pp.196-201
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    • 2001
  • Si(100)/Ta(50 )/NiFe(60 )/FeMn(250 )/NiFe(70 )/Al$_2$O$_3$/NiFe(150 )/Ta(50 )구조를 가진 자기터널접합의 자기저항비 향상에 관해서 연구하였다. 자성층과 절연층 사이 계면에 CoFe을 삽입하여 5.75%에서 13.7%까지 향상시켰다. 그리고 절연층은 16 의 Al을 순수한 산소 및 산소/아르곤 혼합 분위기에서 프라즈마 산화법으로 형성하였다. 순수한 산소 분위기에서는 최적 산화시간 30초에서 13.7%의 자기저항비를 얻었지만,산소/아르곤의 혼합기체를 사용하면 최적 산화시간 40초에서 15.3%의 자기저항비를 얻었다.

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생체용 Ti합금의 산화거동에 미치는 Ta 및 Nb 첨가의 영향 (Effect of Alloy Addition (Ta, Nb) on Oxidation Behavior of cp-Ti for Biomaterials)

  • 이도재;오태욱;박범수;김수학;전충극;윤계림
    • 한국재료학회지
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    • 제14권3호
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    • pp.211-217
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    • 2004
  • The oxidation behaviors of Ti-10Ta-10Nb alloy and Ti-6Al-4V alloy were studied in dry air atmosphere. Specimens were melted in consumable vacuum arc furnace and homogenized at $1050^{\circ}C$ for 24 h. Hot rolling was performed at $1000^{\circ}C$. Specimens of the alloys were oxidized as the temperature range $400~650^{\circ}C$ for 30 min. The oxidation behavior of the alloys was analysed by optical microscope, SEM/EDX, XRD, XPS and TGA. Immersion test was performed in 1% Lactic acid. In the microscope observation, oxide layer of Ti-10Ta-10Nb alloy was denser and thinner than Ti-6Al-4V's. The weight gains during the oxidation rapidly increased at the temperature above $600^{\circ}C$ in Ti-6Al-4V's alloy and$ 700^{\circ}C$ in Ti-10Ta-10Nb alloy. According to XRD results, oxide layers were composed of mostly $TiO_2$(rutile) phase. It was analysed that the passive film of the Ti alloys consisted of $TiO_2$ through X-ray photoelectron spectroscopy(XPS) analysis.