• Journal of the Korean Crystal Growth and Crystal Technology
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• v.17 no.2
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• pp.47-51
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• 2007

F-doped SiOC : H thin films with low refractive index were deposited on Si wafer and glass substrate by plasma enhanced chemical vapor deposition (PECVD) as a function of rf powers, substrate temperatures, gas rates and their composition flow ratios ($SiH_4,\;CF_4$ and $N_2O$). The refractive index of the F-doped SiOC : H film continuously decreased with increasing deposition temperature and rf power. As $N_2O$ gas flow rate decreased, the refractive index of the deposited films decreased down to 1.3778, reaching a minimum value at rf power of 180W and $100^{\circ}C$ without $N_2O$ gas. The fluorine content of F-doped SiOC : H film increased from 1.9 at% to 2.4 at% as the rf power was increased from 60 W to 180 W, which results in the decrease of refractive index.

• The Bulletin of The Korean Astronomical Society
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• v.39 no.2
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• pp.112.2-112.2
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• 2014

We propose simultaneous monitoring observations of 22 GHz $H_2O$ and 43/86/129 GHz SiO masers toward ~15 evolved stars in order to investigate spatial structure and dynamical effect from SiO to $H_2O$ maser regions including mass-loss process and development of asymmetry in circumstellar envelopes. We also aim at investigating mutual association and difference between SiO and $H_2O$ masers for establishing SiO and $H_2O$ maser models coupled to hydrodynamical model of circumstellar envelope. In addition, the correlation and difference of SiO maser properties among J=1-0, J=2-1, and J=3-2 transition masers are traced according to different type of stars for constraining SiO pumping models. These scientific goals and target sources were determined based on KVN single dish and VLBI feasibility test observations at 4 bands. As a total observing time of every 2 month monitoring, about 90 and 360 hours (in average per year) are required for single dish and VLBI observations, respectively. From the 2014B observing season, these monitoring observations will be derived as one of KVN key science programs.

• Journal of the Korean Chemical Society
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• v.55 no.4
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• pp.570-574
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• 2011

Large colorless single crystals of analcime with diameters up to 0.20 mm have been synthesized from gels with the composition of $3.00SiO_2$ : $1.50NaAlO_2$ : 8.02NaOH : $454H_2O$ : 5.00TEA. The fully $Na^+$-exchanged analcime have been prepared with aqueous 0.1 M NaCl (pH adjusted from 6 to 11 by dropwise addition of NaOH). The single-crystal structure of hydrated $|Na_{0.94}(H_2O)|[Si_{2.06}Al_{0.94}O_6]$-ANA per unit cell, a=13.703(3) ${\AA}$, has been determined by single-crystal X-ray diffraction technique in the orthorhombic space group Ibca at 294 K. The structure was refined using all intenties to the final error indices (using only the 1,446 reflections for which $F_o$ > $4{\sigma}(F_o))R_1/wR_2$ = 0.054/0.143. About 15 $Na^+$ ions are located at three nonequivalent positions and octahedrally coordinated. The chemical composition is $Na_{0.94}(H_2O)Si_{2.06}Al_{0.94}O_6$. The Si/Al ratio of synthetic analcime is 2.19 determined by the occupations of cations, 14.79, in the single-crystal determination work.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.11
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• pp.1686-1690
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• 1989

Using the anisotropic etching characteristics of N2H4-H2O solutions, Si diaphragm was fabricated for the integrated sensors. The optimal composition and temperature of the etching solution in (100) Si etching process was established to be 50mol% N2H4 in H2O at 105\ulcorner\ulcorner for both higher etch rate (=2.6\ulcorner/min) and better surface quality of etched (100) planes. Based on the above optimal etching condition, the electrochemical etch-stop technique was employed to form n-type Si diaphragm having a thickness of 20\ulcorner and the thickness of diapragm could exactly be controlled to 20\ulcorner\ulcorner.

• Applied Chemistry for Engineering
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• v.1 no.1
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• pp.35-43
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• 1990

A series of $TiO_2-SiO_2$catalysts were prepared by coprecipitation from the mixed solution of titanium tetrachloride and sodium silicate. Some of the samples were treated with 1N $H_2SO_4$ and used as modified catalysts. The catalytic activities of modified catalysts were higher than those of unmodified catalysts, and the effect of modification on the catalytic activity was higher for 2 - propanol dehydration than for cumene dealkylation. The catalytic activity of unmodified catalysts was correlated with their acid amount for the above two reactions. As $TiO_2-SiO_2$ catalysts had relatively large amount of weak acid sites and small amount of strong acid sites, the catalytic activity for 2 - propanol dehydration was higher than that for cumene dealkylation. The effect of modification on catalytic activity increased with increasing $TiO_2$content of the catalysts. Actually, $92-TiO_2-SiO_2/SO_4{^2}$had the highest increment in catalytic activity and $10-TiO_2-SiO_2/SO_4{^2}$had the lowest increment for the 2 - propanol dehydration.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.26-31
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• 2023

We investigated the impact of NF₃ / H₂O remote plasma dry cleaning conditions on the SiO₂ etching rate at different preparation states during the fabrication of ultra-large-scale integration (ULSI) devices. This included consideration of factors like Si crystal orientation prior to oxidation and three-dimensional structures. The dry cleaning process were carried out varying the parameters of pressure, NF₃ flow rate, and H₂O flow rate. We found that the pressure had an effective role in controlling anisotropic etching when a thin SiO₂ layer was situated between Si₃N₄ and Si layers in a multilayer trench structure. Based on these observations, we would like to provide further guidelines for implementing the dry cleaning process in the fabrication of semiconductor devices having 3D structures.

• Proceedings of the KIEE Conference
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• 1989.07a
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• pp.295-298
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• 1989

Using the anisotropic etching characteristics or $N_2H_4-H_2O$ solution, Si diaphragm was fabricated for the integrated sensor. The optimal composition and temperature of the solution in Si etching process was established to be 50mol% $N_2H_4$ in water at $105{\pm}2^{\circ}C$ for both higher etch rate(=$2.6{\mu}m/min$) and better surface quality of etched {100} planes. Under the optimal etching condition, the electrochemical etch stop technique was employed to form Si diaphragm for pressure sensor and diaphragm thickness was exactly controlled to $20{\pm}2{\mu}m$.

• Applied Chemistry for Engineering
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• v.7 no.4
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• pp.645-652
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• 1996

Selective catalytic oxidation of $H_2S$ to elemental sulfur using $TiO_2/SiO_2$ catalysts was investigated in this study. The reaction test with pure $TiS_2$ and $Ti(SO_4)_2$ and cyclic temperature operation revealed that $TiO_2$ had a good resistance to sulfation and sulfidation, which are known as the main cause of catalytic deactivation in sulfur recovery process. With the increase of $TiO_2$ loading amount in $TiO_2/SiO_2$ catalysts, the conversion of $H_2S$ increased and the selectivity of elemental sulfur was very slightly decreased. As the ratio of $O_2/H_2S$ increased, the selectivity to elemental sulfur was drastically decreased. In the presence of 10 vol.% water vapor to a stoichiometric mixture of $H_2S$ and $O_2$($H_2S$= 5 vol.% O=2.5 vol.% ), both activity and selectivity of 10 wt.% $TiO_2/SiO_2$ catalyst are decreased, but it still showed more than 80% of sulfur yield.

• Journal of the Korean Ceramic Society
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• v.39 no.5
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• pp.479-483
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• 2002

Silicon dioxide thick film using silica optical waveguide cladding was fabricated by Plasma Enhanced Chemical Vapor Deposition(PECVD) method, at a low temperature ($320^{\circ}$C) and from $(SiH_4+N_2O)$ gas mixtures. The effects of deposition parameters on properties of $SiO_2$ thick films were investigated by variation of $N_2O/SiH_4$ flow ratio and RF power. After the deposition process, the samples were annealed in a furnace at $1150^{\circ}$C, in N2 atmosphere, for 2h. As the $N_2O/SiH_4$ flow ratio increased, deposition rate decreased from 9.4 to 2.9 ${\mu}m/h$. As the RF power increased, deposition rate increased from 4.7 to 6.9 ${\mu}m/h$. The thickness and the refractive index measurements were measured by prism coupler. X-ray Photoelectron Spectroscopy(XPS) and Fourier Transform-infrared Spectroscopy(FT-IR) were used to determine the chemical states. The cross-section of films was observed by Scanning Electron Microscopy(SEM).

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.63.2-63.2
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• 2010

삼중접합 태양전지에 상부전지로 이용되는 a-SiO:H 태양전지는 PECVD(Plasma Enhanced Chemical Vapour Deposition)을 이용하여 증착하였다. i a-SiO:H는 $CO_2/SiH_4$ 비율을 변화하여 밴드갭을 조절하였다. $CO_2/SiH_4$가 0에서 0.43으로 증가 할수록 밴드갭이 1.74 eV에서 1.94 eV로 증가하는 경향을 보였다. 이는 FTIR에서 나타난 결과인 Si-O-Si 결합의 증가 때문인 것으로 판단한다. 그에 반해서 광 전도도는 감소하는 경향을 보였다.그러나 암전도도와 광전도도의 비율인 광민감도는 $10^5$에서 $10^4$의 값으로 비정질 태양전지에 적용가능한 값을 보였다. 이러한 박막 특성을 가진 i a-SiO:H를 이용하여 비정질 실리콘 태양전지를 제작한 결과 $CO_2/SiH_4$의 비율이 증가함에 따라 태양전지의 $V_{oc}$가 0.8 V에서 0.5 V로 현저하게 감소하였고, $J_{sc}$와 FF 역시 11 $mA/cm^2$에서 4 $mA/cm^2$, 69%에서 50%로 감소하였다. 단위박막 결함을 측정하는 CPM(Constant Photocurrent Method)을 이용하여 i a-SiO:H 내부에 $10^{16}cm^{-3}$ 정도의 내부 결함을 관찰하였고 이는 태양전지의 특성 감소와 관련이 있는 것으로 판단한다.