• Title/Summary/Keyword: $SiO_x$ thin film

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역 알루미늄 유도 결정화 공정을 이용한 실리콘 태양전지 다결정 시드층 생성 (Fabrication of Poly Seed Layer for Silicon Based Photovoltaics by Inversed Aluminum-Induced Crystallization)

  • 최승호;박찬수;김신호;김양도
    • 한국재료학회지
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    • 제22권4호
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    • pp.190-194
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    • 2012
  • The formation of high-quality polycrystalline silicon (poly-Si) on relatively low cost substrate has been an important issue in the development of thin film solar cells. Poly-Si seed layers were fabricated by an inverse aluminum-induced crystallization (I-AIC) process and the properties of the resulting layer were characterized. The I-AIC process has an advantage of being able to continue the epitaxial growth without an Al layer removing process. An amorphous Si precursor layer was deposited on Corning glass substrates by RF magnetron sputtering system with Ar plasma. Then, Al thin film was deposited by thermal evaporation. An $SiO_2$ diffusion barrier layer was formed between Si and Al layers to control the surface orientation of seed layer. The crystallinity of the poly-Si seed layer was analyzed by Raman spectroscopy and x-ray diffraction (XRD). The grain size and orientation of the poly-Si seed layer were determined by electron back scattering diffraction (EBSD) method. The prepared poly-Si seed layer showed high volume fraction of crystalline Si and <100> orientation. The diffusion barrier layer and processing temperature significantly affected the grain size and orientation of the poly Si seed layer. The shorter oxidation time and lower processing temperature led to a better orientation of the poly-Si seed layer. This study presents the formation mechanism of a poly seed layer by inverse aluminum-induced crystallization.

극소전자 디바이스를 위한 AI-1%Si 박막배선에서의 Electromigration 특성 (Electromigration Characteristics in AI-1%Si Thin Film Interconnections for Microelectronic Devices)

  • 박영식;김진영
    • 한국진공학회지
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    • 제4권3호
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    • pp.327-333
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    • 1995
  • 전자소자의 축소화에 따라 박막배선에서의 electromigration은 점차 극소전자 디바이스의 주요 결함원인으로 부각되고 있다. 본 실험에서는 현재 박막 배선 재료로 가장 널리 사용되고 있는 AI-1%Si 금속박막배선의 electromigration에 대한 온도 및 배선길이의 의존성에 관하여 연구하였다. PSG($8000AA$)/SiO2(1000$\AA$)/AI-1%Si(7000$\AA$)/SiO2(5000$\AA$)/p-Si(100)의 보호막처리되지 않은 시편 등을 standard photolithography 공정을 이용하여 각각 제작하였다. 선폭 3$\mu$m, 길이 100, 400, 800, $\1600mu$m등의 AI-1%Si 배막배선구조를 사용하였다. 가속화실험을 위해 인가된 d.c.전류밀도는 4.5X106A/$ extrm{cm}^2$이었고 실온에서 $100^{\circ}C$까지의 분위기 온도에서 electromigration test를 진행하였다. 박막배선의 길에에 따른 MTF(Mean-Time-to-Failure)는 임계길이 이상에서 포화되는 경향을 보이며 이는 보호막층의 유무에 관계없이 나타난다. 선폭 $3\mu$m인 AI-1%Si 박막배선에서 임계길이는, 보호막처리된 시편은 $800\mu$m, 보호막처리되지 않은 시편은 $400\mu$m 배선길이에서 나타난다. 이러한 포화의 경향은 낮은 온도에서 더욱 명확해지는 특성을 보인다. 각 시편에서 electromigration에 대한 활성화에너지도 MTF의 특성과 유사하게 임계길이 이상에서 포화되는 특성을 보인다.

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a-Si:H Photodiode Using Alumina Thin Film Barrier

  • Hur Chang-Wu;Dimitrijev Sima
    • Journal of information and communication convergence engineering
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    • 제3권4호
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    • pp.179-183
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    • 2005
  • A photodiode capable of obtaining a sufficient photo/ dark current ratio at both forward bias state and reverse bias state is proposed. The photodiode includes a glass substrate, an aluminum film formed as a lower electrode over the glass substrate, an alumina film formed as an insulator barrier over the aluminum film, a hydrogenated amorphous silicon film formed as a photo conduction layer over a portion of the alumina film, and a transparent conduction film formed as an upper electrode over the hydro-generated amorphous silicon film. A good quality alumina $(Al_2O_3)$ film is formed by oxidation of aluminum film using electrolyte solution of succinic acid. Alumina is used as a potential barrier between amorphous silicon and aluminum. It controls dark-current restriction. In case of photodiodes made by changing the formation condition of alumina, we can obtain a stable dark current $(\~10^{-12}A)$ in alumina thickness below $1000{\AA}$. At the reverse bias state of the negative voltage in ITO (Indium Tin Oxide), the photo current has substantially constant value of $5{\times}10^{-9}$ A at light scan of 100 1x. On the other hand, the photo/dark current ratios become higher at smaller thicknesses of the alumina film. Therefore, the alumina film is used as a thin insulator barrier, which is distinct from the conventional concept of forming the insulator barrier layer near the transparent conduction film. Also, the structure with the insulator thin barrier layer formed near the lower electrode, opposed to the ITO film, solves the interface problem of the ITO film because it provides an improved photo current/dark current ratio.

Effects of Substrate Temperature on Properties of Sb-doped SnO2 Thin Film

  • Do Kyung, Lee;Young-Soo, Sohn
    • 센서학회지
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    • 제31권6호
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    • pp.371-375
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    • 2022
  • Antimony-doped tin oxide (ATO) thin films, one type of transparent conductive oxide (TCO) films, were prepared on a SiO2-coated glass substrate with different substrate temperatures by a radio-frequency magnetron sputtering system. Structural, optical, and electrical characteristics of the deposited ATO films were analyzed using X-ray diffraction, scanning electron microscopy, alpha-step, ultraviolet-visible spectrometer, and Hall effect measurement. The substrate temperature during deposition did not affect the basic crystal structure of the films but changed the grain size and film thickness. The optical transmittance of the ATO films deposited at different substrate temperatures was over 70%. The lowest sheet resistance and resistivity were 8.43 × 102 Ω/sq, and 0.3991 × 10-2 Ω·cm, respectively, and the highest carrier concentration and mobility were 2.36 × 1021 cm-3 and 6.627 × 10-2 cm2V-1s-1, respectively, at a substrate temperature of 400 ℃.

4.1” Transparent QCIF AMOLED Display Driven by High Mobility Bottom Gate a-IGZO Thin-film Transistors

  • Jeong, J.K.;Kim, M.;Jeong, J.H.;Lee, H.J.;Ahn, T.K.;Shin, H.S.;Kang, K.Y.;Park, J.S.;Yang, H,;Chung, H.J.;Mo, Y.G.;Kim, H.D.;Seo, H.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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    • pp.145-148
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    • 2007
  • The authors report on the fabrication of thin film transistors (TFTs) that use amorphous indium-gallium-zinc oxide (a-IGZO) channel and have the channel length (L) and width (W) patterned by dry etching. To prevent the plasma damage of active channel, a 100-nm-thckness $SiO_{x}$ by PECVD was adopted as an etch-stopper structure. IGZO TFT (W/L=10/50${\mu}m$) fabricated on glass exhibited the high performance mobility of $35.8\;cm^2/Vs$, a subthreshold gate voltage swing of $0.59V/dec$, and $I_{on/off}$ of $4.9{\times}10^6$. In addition, 4.1” transparent QCIF active-matrix organic light-emitting diode display were successfully fabricated, which was driven by a-IGZO TFTs.

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PbO 완충층을 이용한 Pt/Pb1.1Zr0.53Ti0.47O3/PbO/Si (MFIS)의 미세구조와 전기적 특성 (Microstructure and Electrical Properties of the Pt/Pb1.1Zr0.53Ti0.47O3/PbO/Si (MFIS) Using the PbO Buffer Layer)

  • 박철호;송경환;손영국
    • 한국세라믹학회지
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    • 제42권2호
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    • pp.104-109
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    • 2005
  • PbO 완충층의 역할을 확인하기 위해, r.f. magnetron sputtering법을 이용하여 p-type (100) Si 기판 위에 $Pt/Pb_{1.1}Zr_{0.53}Ti_{0.47}O_{3}$와 PbO target으로 Pt/PZT/PbO/Si의 MFIS 구조를 제조하였다. MFIS 구조에 완충층으로 PbO를 삽입함으로써 PZT 박막의 결정성이 크게 향상되었고, 박막의 공정온도도 상당히 낮출 수 있었다. 그리고 XPS depth profile 분석 결과, PbO 증착시 기판온도가 PbO와 Si의 계면에서 Pb의 확산에 미치는 영향을 확인하였다. PbO 완충층을 삽입한 MFIS는 높은 메모리 윈도우와 낮은 누설전류 밀도를 가지는 추수한 전기적 특성을 나타내었다. 특히, 기판온도 $300^{\circ}C$에서 증착된 PbO를 삽입한 Pt/PZT(200nm, $400^{\circ}C)PbO(80nm)/Si$는 9V의 인가전압에서 2.OV의 가장 높은 메모리 윈도우 값을 나타내었다.

기판온도에 따른 PLZT 박막의 결정성과 전기적 특성 (Effects of Substrate Temperatures on the Crystallinity and Electrical Properties of PLZT Thin Films)

  • 이인석;윤지언;김상지;손영국
    • 한국전기전자재료학회논문지
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    • 제22권1호
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    • pp.29-34
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    • 2009
  • PLZT thin films were deposited on platinized silicon (Pt/$TiSiO_2$/Si) substrate by RF magnetron sputtering. A $TiO_2$ buffer layer was fabricated, prior to deposition of PLZT films. the layer was strongly affected the crystallographic orientation of the PLZT films. X-ray diffraction was performed on the films to study the crystallization of the films as various substrate temperatures (Ts). According to increasing Ts, preferred orientation of films was changed (110) plane to (111) plane. The ferroelectric, dielectric and electrical properties of the films were also investigated in detail as increased substrate temperatures. The PLZT films deposited at $400^{\circ}C$ showed good ferroelectric properties with the remnant polarization of $15.8{\mu}C/cm^2$ and leakage current of $5.4{\times}10^{-9}\;A/cm^2$.

졸-겔법에 의한 금속기판상의 $\beta$-spodumene 결정성유리의 박영도포와 원적외선상세성 (The Effect of Far Infrared Radiation of $\beta$-Spodumene Glass-Ceramics Flims Coated on Iron Substrate by Sol-Gel Technique)

  • 양중식;신현택;박종옥
    • 한국표면공학회지
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    • 제27권2호
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    • pp.99-108
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    • 1994
  • Films of glass-ceramics $Li_2O-Al_2O_3-SiO_2$(LAS)system were prepared on substrate of an iron plate(SCP) by sol-gel technique using metal alkoxide such as Si$(OC_2H_5)_4$,Al$(OC_2H_9)_3$) and Ti$(OC_2H_6)_4$). Sol which was made by means of simple spray coating, on the substrate was hydrolyzed at 75~$80^{\circ}C$ in moisture cabinet (80~90 % humidity) to form the multicomponent gel. The films up to about 0.8~1.0$mu extrm{m}$ in thickness can be obtained by repeating operation, spraylongrightarrowhydrolysis and condensationlongrightarrowdryinglongrightarrowheating and crystallization at $700^{\circ}C$ for 3~5min. The far-infrared radiation spectra of the coated films on substrate were examined by FT-IR and of films was also observed by scanning electron micrograph technique. The thermal evaluation of the gel-film is followed by TG/DTA measurements. The structure evaluation is followedd X-ray diffraction. These results suggest that this process is applicable to far-infrared radiat at thin film technique.

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원자층 증착법으로 증착된 MoOx를 적용한 전하 선택 접합의 이종 접합 태양전지 (Heterojunction Solar Cell with Carrier Selective Contact Using MoOx Deposited by Atomic Layer Deposition)

  • 정민지;조영준;이선화;이준신;임경진;서정호;장효식
    • 한국재료학회지
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    • 제29권5호
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    • pp.322-327
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    • 2019
  • Hole carrier selective MoOx film is obtained by atomic layer deposition(ALD) using molybdenum hexacarbonyl[$Mo(CO)_6$] as precursor and ozone($O_3$) oxidant. The growth rate is about 0.036 nm/cycle at 200 g/Nm of ozone concentration and the thickness of interfacial oxide is about 2 nm. The measured band gap and work function of the MoOx film grown by ALD are 3.25 eV and 8 eV, respectively. X-ray photoelectron spectroscopy(XPS) result shows that the $Mo^{6+}$ state is dominant in the MoOx thin film. In the case of ALD-MoOx grown on Si wafer, the ozone concentration does not affect the passivation performance in the as-deposited state. But, the implied open-circuit voltage increases from $576^{\circ}C$ to $620^{\circ}C$ at 250 g/Nm after post-deposition annealing at $350^{\circ}C$ in a forming gas ambient. Instead of using a p-type amorphous silicon layer, high work function MoOx films as hole selective contact are applied for heterojunction silicon solar cells and the best efficiency yet recorded (21 %) is obtained.

기계경비용 전기센서필터의 압전박막 특성 (Piezoelectric Thin Film of Electrical Sensor Filter for Security System)

  • 이동윤
    • 한국콘텐츠학회:학술대회논문집
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    • 한국콘텐츠학회 2008년도 춘계 종합학술대회 논문집
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    • pp.595-597
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    • 2008
  • RF 마그네트론 스퍼터링 법으로 ZnO박막을 실리콘기판 위에 증착 하였고, 인가전력에 따른 박막의 결정학적, 전기적 특성을 연구하였다. 기판온도 $200^{\circ}C$, 산소:아르곤 가스의 비율이 50%:50%, 증착압력이 10mTorr의 조건에서 RF 전압에 따라 증착된 박막은 강한 c-축 성장과 우수한 결정성을 나타내었다.

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