• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.711-714
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• 2006

Properties of silicon nitride ($SiN_x$) film including physical and electrical characteristics have been studied for improving the stability of hydrogenated amorphous silicon thin-film transistors (a-Si TFTs) in active-matrix liquid-crystal displays (AMLCDs). The instability of a-Si:H TFTs is estimated by accelerated stress test of both bias-temperature stress and bias-illumination stress. The results show that the deposition conditions of $SiN_x$ films with higher power and lower pressure are the best choice for improving the on-current and stability of TFTs.

• 대한금속재료학회지
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• 제50권8호
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• pp.613-618
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• 2012

We report on electrical and mechanical properties of silicon nitride ($SiN_x$) films deposited by a plasma enhanced chemical vapor deposition (PECVD) method at $200^{\circ}C$ from $SiH_4$ highly diluted in $N_2$. The films were also prepared from $SiH_4$ diluted in He for comparison. The $N_2$ dilution was also effective in improving adhesion of the $SiN_x$ films, fascilitating construction of thin film transistors (TFTs). Metal-insulator-semiconductor (MIS) and Metal-insulator-Metal (MIM) structures were used for capacitance-voltage (C-V) and current-voltage (I-V) measurements, respectively. The resistivity and breakdown field strength of the $SiN_x$ films from $N_2$-diluted $SiH_4$ were estimated to be $1{\times}10^{13}{\Omega}{\cdot}cm$, 7.4 MV/cm, respectively. The MIS device showed a hysteresis window and a flat band voltage shift of 3 V and 0.5 V, respectively. The TFTs fabricated by using these films showed a field-effect mobility of $0.16cm^2/Vs$, a threshold voltage of 3 V, a subthreshold slope of 1.2 V/dec, and an on/off ratio of > $10^6$.

• 마이크로전자및패키징학회지
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• 제28권3호
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• pp.33-38
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• 2021

최근 유연 디스플레이에 관한 대중의 관심이 증대됨에 따라 롤러블(rollable), 폴더블(foldable) 디스플레이와 같은 우수한 폼 팩터(form factor)를 지닌 차세대 유연(flexible) 디스플레이가 주목받고 있다. 유연 디스플레이의 기계적 신뢰성 확보 측면에서, 내부 절연막으로 활용되는 실리콘 질화물(SiN_x) 박막은 구동 중 발생하는 응력에 매우 취약하므로 기계적 물성을 정확히 파악하여 파손을 예측하고 패널의 전기적 단락을 방지하는 것이 중요하다. 본 논문에서는, ~130 nm, ~320 nm 두께의 SiN_x 박막 박막 상부에 ~190 nm 두께의 유기 나노 보강층(PMMA, PS, P3HT)을 코팅하여 이중층 구조로 인장함으로써 매우 취성한 SiN_x 박막의 탄성 계수와 인장 강도 및 연신율을 측정하는 데 성공하였다. 챔버 압력 및 증착 파워를 조절한 공정 조건(A: 1250 mTorr, 450 W/B: 1000 mTorr, 600 W/C: 750 mTorr, 700 W)을 통해 제작된 ~130 nm SiN_x 의 탄성계수는 A: 76.6±3.5, B: 85.8±4.6, C: 117.4±6.5 GPa로, ~320 nm SiN_x는 A: 100.1±12.9, B: 117.9±9.7, C: 159.6 GPa로 측정되었다. 결과적으로, 동일 공정 조건 하에서 SiN_x 박막의 두께가 증가할수록 탄성 계수가 증가하는 경향을 확인하였으며, 유기 나노 보강층을 활용한 인장 시험법은 파손되기 쉬운 취성 박막의 기계적 물성을 높은 정밀도로 측정하는 데 효과적이었다. 본 연구에서 개발된 방법은, 취약한 디스플레이용 박막의 정량적인 기계적 물성 파악을 가능케하여 강건한 롤러블, 폴더블 디스플레이의 설계에 이바지할 수 있을 것으로 기대한다.

• 센서학회지
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• 제16권6호
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• pp.462-466
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• 2007

Aluminum nitride (AlN) thin films were deposited on Si substrates by using polycrystalline (poly) 3C-SiC buffer layers, in which the AlN film was grown by pulsed reactive magnetron sputtering. Characteristics of grown AlN films were investigated experimentally by means of FE-SEM, X-ray diffraction, and FT-IR, respectively. The columnar structure of AlN thin films was observed by FE-SEM. X-ray diffraction pattern proved that the grown AlN film on 3C-SiC layers had highly (002) orientation with low value of FWHM (${\Theta}=1.3^{\circ}$) in the rocking curve around (002) reflections. These results were shown that almost free residual stress existed in the grown AlN film on 3C-SiC buffer layers from the infrared absorbance spectrum. Therefore, the presented results showed that AlN thin films grown on 3C-SiC buffer layers can be used for various piezoelectric fields and M/NEMS applications.

• 한국재료학회지
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• 제9권12호
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• pp.1155-1159
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• 1999

플라즈마 화학증착 (PECVD) 장비를 이용하여 $SnO_2$ 투명전도막이 피막된 유리기판 위에 p-SiC/i-Si/n-Si 이종접합 태양전지를 제작하였다. p-SiC 층의 증착중에 기체조성 x=$CH_4/\;(SiH_4+CH_4)$의 변화에 대한 태양전지의 광기전 특성을 관찰하였다. 기체조성(x)이 0~0.4의 범위에서 p-SiC 창층의 광학적 밴드갭의 증가로 인하여 태양전지의 효율은 증가하였으나, 그 이상의 기체조성에서는 p-SiC/i-Si 계면에서의 조성불일치가 증가하여 태양전지의 효율이 감소하였다. 이러한 계면문제는 p-SiC 층과 i-Si 계면에서의 조성불일치가 증가하여 태양전지의 효율이 감소하였다. 이러한 계면문제는 p-SiC 층과 I-Si 층 사이에 I-SiC 완충층을 삽입함으로써 크게 감소하였다. 그 결과 유효면적이 $1cm^2$인 glass/$SnO_2$/p-SiC/i-SiC/i-Si/n-Si/Ag 구조의 박막 태양전지는 100mW/$cm^2$ 조도 하에서 8.6%의 효율을 나타내었다. ($V_{oc}$=0.85V, $J_{sc}$=16.42mA/$cm^2$, FF=0.615)

• 한국세라믹학회지
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• 제28권2호
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• pp.130-140
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• 1991

The powders of the system Si3N4-Y2O3-AlN were prepared using Si(OC2H5)4 and YCl3.6H2O together with commercial AlN powder. $\alpha$-Si3N4 was prepared by the carbothermal reduction and nitridation of the hydrolyzed gel at 135$0^{\circ}C$ for 10h in N2 atmosphere. YCl3.6H2O was observed to be changed to Y2O3 during the reaction. $\alpha$-Sialon(X=0.2, 0.4, 0.6) ceramics were obtained by hot-pressing the Si3N4-Y2O3-AlN mixture at 178$0^{\circ}C$ for 1h under 30 MPa. The content of $\alpha$-Sialon increased with increasing metal solubility(x value) and $\alpha$-Sialon single phase was obtained at the metal solubility of 0.6. With increasing metal solubility, flexural strength, fracture toughness and thermal shock resistence were decreased, while the microhardness was increased. Large elongated $\beta$-Si3N4 grains were mainly observed at lower metal solubility. Mechanical prorerties of the sintered ceramics with X=0.2 were measured as follows : flexural strength ; 650 MPa, fracture toughness ; 3.63 MN/m3/2, hardness ; 14.7 GPa, thermal shock resistence temperature ; 58$0^{\circ}C$.

• 한국전기전자재료학회논문지
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• 제26권1호
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• pp.18-21
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• 2013

$SiO_2$ layer grown by rapid thermal oxidation and $SiN_x$ layer were used for passivating the surface of n-type silicon solar cell, instead of only $SiN_x$ layer generally used in photovoltaic industry. The rapid thermal oxidation provides the reduction of processing time and avoids bulk life time degradation during the processing. Improvement of 30 mV in Voc and $2.7mA/cm^2$ in Jsc was obtained by applying these two layers. This improvement led to fabrication of a large area ($239cm^2$) n-type solar cell with 17.34% efficiency. Internal quantum efficiency measurement indicates that the improvement comes from the front side passivation, but not the rear side, by using $SiO_2/SiN_x$ stack.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권1호
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• pp.1-7
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• 2000

The SNOSFET memory devices with ultrathin ONO(tunnel oxide-nitride-blocking oxide) gate dielectric were fabricated using n-well CMOS process and investigated its characteristics. The thicknesses of tunnel oxide, nitride and blocking oxide were $23{\AA},\; 53{\AA}\; and\; 33{\AA}$, respectively. Auger analysis shows that the ONO layer is made up of $SiO_2(upper layer of blocking oxide)/O-rich\; SiO_x\N\_y$. It clearly shows that the converting layer with $SiO_x\N\_y(lower layer of blocking oxide)/N-rich SiO_x\N\_y(nitride)/O-rich SiO_x\N\_y(tunnel oxide)$. It clearly shows that the converting layer with $SiO_x\N\_y$ phase exists near the interface between the blocking oxide and nitride. The programming condition of +8 V, 20 ms, -8 V, 50 ms is determined and data retention over 10 years is obtained. Under the condition of 8 V programming, it was confirmed that the modified Fowler-Nordheim tunneling id dominant charge transport mechanism. The programmed threshold voltage is distributed less than 0.1 V so that the reading error of memory stated can be minimized. An $8\times8$ NAND type flash EEPROM with SONOSFET memory cell was designed and simulated with the extracted SPICE parameters. The sufficient read cell current was obtained and the upper limit of $V_{TH}$ for write state was over 2V.

• 대한기계학회논문집
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• 제18권1호
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• pp.101-112
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• 1994

The measurement of residual stress distribution of $Si_3N_4/SUS304$ joint was performed on 23 specimens with the same joint condition using PSPC type X-ray stress measurement system and the two-dimensional elastoplastic analysis using finite element method was also attempted. As results, residual stress distribution near the interface on the ceramic side of the joint was revealed quantitatively. Residual stress on the ceramic side of the joint was turned out to be tensional near the interface, maximum along the edge, varying in accordance with the condition of the joint and variance to be most conspicuous for the residual stress normal to the interface characterized by the stress singularities. In the vicinity of the interface, the high stress concentration occurs and residual stress distributes three-dimensionally. Therefore, the measured stress distribution differed remarkably from the result of the two-dimensional finite-element analysis. Especially at the center of the specimen near the interface, the residual stress, $\sigma_{x}$ obtained from the finite element analysis was compressive, whereas measurement using X-ray yielded tensile $\sigma_{x}$. Here we discuss two dimensional superposition model the discrepancy between the results from the two dimensional finite element analysis and X-ray measurement.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.360-363
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• 2003

In this paper, we investigated SiNx film as a buffer layer of TFT-FRAM. Buffer layers were prepared by two step process of a $N_2$ plasma treatment and subsequent $SiN_x$ deposition. By employing $N_2$ plasma treatment, interface traps such as mobile charges and injected charges were removed, hysteresis of current-voltage curve disappeared. After $N_2$ plasma treatment, a leakage current was decreased about 2 orders. From these results, it is possible to perform the plasma treating process to make a good quality buffer layer of MFIS-FET or capacitor as an application of non-volatile memory.