• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12S
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• pp.1175-1180
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• 2003

Transformer Coupled Plasma Chemical Vapor Deposited (TCP-CVD) silicon nitride (SiNx) is widely used as a gate dielectric material for thin film transistors (TFT). This paper reports the SiNx films, grown by TCP-CVD at the low temperature (30$0^{\circ}C$). Experimental investigations were carried out for the optimization o(SiNx film as a function of $N_2$/SiH$_4$ flow ratio varying ,3 to 50 keeping rf power of 200 W, This paper presents the dielectric studies of SiNx gate in terms of deposition rate, hydrogen content, etch rate and leakage current density characteristics lot the thin film transistor applications. And also, this work investigated means to decrease the leakage current of SiNx film by employing $N_2$ plasma treatment. The insulator layers were prepared by two step process; the $N_2$ plasma treatment and then PECVD SiNx deposition with SiH$_4$, $N_2$gases.

• Journal of the Korean Society of Safety
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• v.16 no.3
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• pp.41-44
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• 2001

The removal characteristics of nitrogen oxides (NOx) by the dielectric ($Al_2O_3$) packed-bed plasma reactor are experimentally investigated Reactor is packed with 5[mm] diameter $Al_2O_3$ beads, and was desisted to remove NOx at atmospheric pressures from the moving pollution source such as diesel automobile. The experiments were conducted for applied voltages from 5 to 10[kV], flue gas rate from 2 to 5[l/min] and frequency from 0.5 to 2[kHz]. The NOx removal efficiency significantly increasing with increasing applied voltage. Especially removal rate significantly increased with increasing frequency. However, in this experiment discharged poler n relatively high.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.171-171
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• 2012

We have studied the effects of plasma treatments on CdS buffer layers in CIGS thin film solar cells. The CdS layers were deposited on CIGS films by chemical bath deposition (CBD) method. The RF plasma treatments of the CdS thin films were performed with Ar, $O_2 and $N_2 gases, respectively. After plasma treatments, the solar cells with Al:ZnO/i-ZnO/CdS/CIGS structures were fabricated. The surface properties of the CdS/CIGS thin films after plasma treatments were investigated with SEM, EDX and AFM measurements. The electrical properties of manufactured solar cell were discussed with the results of current-voltage measurements. The plasma treatments have a strong influence on the open circuit voltage (VOC) and the fill factor of the solar cells. Finally, a correlation between the surface properties of CdS layer and the efficiencies of the CIGS thin film solar cells is discussed.

• Journal of the Korean Ceramic Society
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• v.41 no.3
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• pp.197-201
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• 2004

SiO$_2$ and SiON thick films were deposited by Plasma Enhanced Chemical Vapor Deposition (PECVD) technique on silicon wafer (100) using SiH$_4$ and $N_2$O as precursor gases. In this work, the influence of rf power, and rf bias power on the optical and physical properties of SiO$_2$ and SiON thick films is presented. The refractive index decreases with increasing rf power, and rf bias power. The refractive index of the films varied from 1.4493 to 1.4952 at wavelength at 1552 nm, with increasing rf power, the nitrogen content decreases while the oxygen content increases, in a manner that the O/N ratio increases approximately linearly.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.181-184
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• 2003

Low Energy High flux Plasma Source인 Stationary Plasma thruster (SPT)를 이용하여 폴리이미드의 표면개질 후 접촉각과 표면에너지의 변화를 조사하고 접착력과의 관계를 조사하였다. 이온에너지는 180 eV - 200 eV, 이온전류 밀도는 수백 ${\mu}A/cm^2$, 이온선량은 $5\times10^{15}/cm^2$부터, $10\times^{18}/cm^2$로 $Ar^+,\;N_2^+,\;O_2^+$를 이온 주입시켰다. 표면 처리된 폴리이미드에 대한 접촉각 변화는 dual contact anglemeter로 증류수와 에틸렌글리콜을 이용하여 측정하였고, 표면에너지의 변화량을 구하였다. 접촉각의 변화는 아르곤 이온의 경우는 최저 $35^{\circ}$, 질소와 산소의 경우 $1\times10^{17}/cm^2$에서 각각 $14^{\circ},\;10^{\circ}$정도의 전촉각을 보였으며, $5\times10^{17}/cm^2$이상에서는 측정하기 불가능하였다. 산소 이온빔으로 처리된 PI의 표면을 x-ray photoelectron spectroscopy를 통하여 측정하여본 결과, 친수성기가 많이 형성되었음을 확인할 수 있었다. 접촉각 측정으르부터 PI의 표변에너지는 42.1 mN/m에서 아르곤 이온빔의 처리 시 65.2 mN/m로 산소 이온빔의 처리 시 81.2 mN/m로 각각 1.5배, 1.9배 정도 증대하였다. 산소 이온빔으로 처리된 PI 표면위에 스퍼터링으로 300 nm 정도의 clad layer 형성 후 $20{\mu}m$ 정도의 구리 전기 도금막을 형성하여, peel 강도를 측정한 결과 0.79 kg/cm의 강도를 얻을 수 있었다.

• Journal of the Korean institute of surface engineering
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• v.34 no.5
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• pp.510-515
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• 2001

It was first time that low frequency R.F. derived plasma enhanced MOCVD with frimethylborate precursor was used to fabricate a new ternary compound $BO_{x}$ $N_{y}$ . The formation of BON molecule was resulted from nitrogen nitrifying B-O, and forming the angular molecule structure proved by XPS and FT-IR results. The relationship between hardness and film thickness was studied. An thickness-independent hardness was fond about 10 GPa. The empirical calculation of band-gap and UV test result showed that our deposited $BO_{x}$ $N_{y}$ thin film was semiconductor material with 3.4eV of wide band gap. The electrical conductivity, $4.8$\times$10^{-2}$ /($\Omega$.cm)$^{-1}$ also confirmed that $BO_{x}$ $N_{y}$ has a semiconductor property. The roughness detected from the as-grown films showed that there was no serious bombarding effect due to anion in the plasma occurring in the RF frequency derived plasma.

• Korean Journal of Materials Research
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• v.2 no.2
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• pp.85-94
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• 1992

The size, morphology and distribution of pores which affect on the physical properties of thermal barrier coatings were investigated to find the relationship with spraying parameters. The plasma-sprayed zirconia coatings contained numerous micropores as well as macropores which were appeared as spherical and irregular pores, and cracks. The pore formation process and its characteristics were varied with spraying distance. Porosity itself was varied with spraying parameters such as spray gun current, gas flow rate and the gas used(Ar or $N_2). The Porosity of coatings was ranged from 10 to 18% with the variation of spraying conditions. The relative hardness measured by the scratch test, showed strong dependence on the porosity of coatings rather than spraying parameters.

• Proceedings of the KIEE Conference
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• 1988.11a
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• pp.189-192
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• 1988

Nitrided oxides have been investigated recently for application as a replacement for thermally grown $SiO_2$ in MIS devices. In this paper, thin oxides were nitrided in $N_2$ Plasma ambient. With the measurement of the equivalent paralled conductance and capacitance by the using coductance technique, the characterization of Si-SiON interface is developed. The interface state density of Si-SiON is obtained by $1{\times}10^{11}{\sim}9{\times}10^{11}(eV^{-1}Cm^{-2})$. After${\pm}$B-T stress is performed on the sample, the interface state density gets increased.

• Korean Journal of Materials Research
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• v.16 no.11
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• pp.681-686
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• 2006

Plasma nitrocarburising and plasma post oxidation were performed to improve the wear and corrosion resistance of S45C and SCM440 steel by a plasma ion nitriding system. Plasma nitrocarburizing was conducted for 3h at $570^{\circ}C$ in the nitrogen, hydrogen and methane atmosphere to produce the ${\varepsilon}-Fe_{2-3}$(N, C) phase. Plasma post oxidation was performed on the nitrocarburized samples with various oxygen/hydrogen ratio at constant temperature of $500^{\circ}C$ for 1 hour. The very thin magnetite ($Fe_3O_4$) layer $1-2{\mu}m$ in thickness on top of the $15{\sim}25{\mu}m$ ${\varepsilon}-Fe_{2-3}$(N, C) compound layer was obtained by plasma post oxidation. A salt spray test and electrochemical testing revealed that in the tested 5% NaCl solution, the corrosion characteristics of the nitrocarburized compound layer could be further improved by the application of the superficial magnetite layer. Throttle valve shafts were treated under optimum plasma processing conditions. Accelerated life time test results, using throttle body assembled with shaft treated by plasma nitrocarburising and post oxidation, showed that plasma nitrocarburizing and plasma post oxidation processes could be a viable technology in the very near future which can replace $Cr^{6+}$ plating.

• Journal of the Korean Vacuum Society
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• v.17 no.5
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• pp.426-434
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• 2008

A space averaged $SiH_4/O_2/Ar$ simulator for the high density inductively coupled plasma sources for $SiH_4/O_2/Ar$ discharge is developed. The developed simulator uses space averaged fluid equations for electrons, positive ions, negative ions, neutral species, and radicals in $SiH_4/O_2/Ar$ plasma discharge, and the electron heating model including the anomalous skin effect. Using the developed simulator, the dependency of the density of charged particles, neutral particles, and radicals, the electron temperature, the plasma resistance, and the power absorption coefficient for the RF power and pressure is calculated.