• Journal of Korean Society for Atmospheric Environment
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• v.19 no.2
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• pp.157-165
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• 2003

A combined process of non-thermal plasma and catalytic technique has been investigated to treat $CH_3$CN gas in the atmosphere. A planar type dielectric barrier discharge (DBD) reactor has been used to generate the non-thermal plasma that produces various chemically active species, such as O, N, OH, $O_3$, ion, electrons, etc. Several different types of the beads. which are Molecular Sieve (MS) 5A, MS 13X, Pt/alumina beads, are packed into the DBD reactor, and have been tested to characterize the effects of adsorption and catalytic process on treating the $CH_3$CN gas in the DBD reactor. The test results showed that the operating power consumption and the amounts of the by-products of the non-thermal plasma process can be reduced by the assistance of the adsorption and catalytic process.

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.2
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• pp.107-112
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• 2005

We present an AlGaN/GaN metal-insulator-semiconductor-heterostructure field effect transistor (MIS-HFET) with an $Al_2O_3-HfO_2$ laminated high-k dielectric, deposited by plasma enhanced atomic layer deposition (PEALD). Based on capacitance-voltage measurements, the dielectric constant of the deposited $Al_2O_3-HfO_2$ laminated layer was estimated to be as high as 15. The fabricated MIS-HFET with a gate length of 102 m exhibited a maximum drain current of 500 mA/mm and maximum tr-ansconductance of 125 mS/mm. The gate leakage current was at least 4 orders of magnitude lower than that of the reference HFET. The pulsed current-voltage curve revealed that the $Al_2O_3-HfO_2$ laminated dielectric effectively passivated the surface of the device.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.05a
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• pp.143-146
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• 2002

Unsized AS-4 carbon fibers were etched by RF plasma and then coated via plasma polymerization in order to enhance adhesion to vinyl ester resin. The gases utilized for the plasma etching were Ar, $N_2 and O_2$, while the monomers used for the plasma polymerization coating were acetylene, butadiene and acrylonitrile. The conditions for the plasma etching and the plasma polymerization were optimized by measuring interfacial adhesion with vinyl ester resin via micro-droplet tests. Among the treatment conditions, the combination of Ar plasma etching and acetylene plasma polymerization provided greatly improved interfacial shear strength (IFSS) of 69MPa compared to 43MPa with as-received carbon fiber. Based on the SEM analysis of failure surface and load-displacement curve, it was assume that the failure might be occurred at the carbon fiber and plasma polymer coating. The plasma etched and plasma polymer coated carbon fibers were subjected to analysis with SEM, XPS, FT-IR or Alpha-Step, and dynamic contact angles and tensile strengths were also evaluated. Plasma polymer coatings did not change tensile strength and surface roughness of fibers, but decreased water contact angle except butadiene plasma polymer coating, possibly owing to the functional groups introduced, as evidenced by FT-IR and XPS.

• Journal of Environmental Science International
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• v.21 no.6
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• pp.695-704
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• 2012

The application of disinfection models on the plasma process was investigated. Nine empirical models were used to find an optimum model. The variation of parameters in model according to the operating conditions (first voltage, second voltage, air flow rate, pH) were investigated in order to explain the disinfection model. In this experiment, the DBD (dielectric barrier discharge) plasma reactor was used to inactivate Ralstonia Solanacearum which cause wilt in tomato plantation. Optimum disinfection models were chosen among the nine models by the application of statistical SSE (sum of squared error), RMSE (root mean sum of squared error), $r^2$ values on the experimental data using the GInaFiT software in Microsoft Excel. The optimum model was shown as Weibull+talil model followed by Log-linear+ Shoulder+Tail model. Two models were applied to the experimental data according to the variation of the operating conditions. In Weibull+talil model, Log10($N_o$), Log10($N_{res}$), ${\delta}$ and p values were examined. And in Log-linear+Shoulder+Tail model, the Log10($N_o$), Log10($N_{res}$), $k_{max}$, Sl values were calculated and examined.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.10
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• pp.941-944
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• 2005

In this experiment, OLEDs(Organic Light Emitting Diodes) was fabricated to confirm effect of Plasma treatment which increase the hole injection characteristic from anode. Device structure was $ITO/2-TNATA/{\alpha}-NPD/DPVBi/BAlq/Alq_3/Al:Li$. We used DPVBi (4, 4 - Bis (2,2-diphenylethen-1-yls) - Biphenyl) as a blue emitting material. To optimize the process condition of plasma treatment, we used 2 gases of the oxygen and nitrogen gas under 120 mTorr with 100 W, 200 W, and 400 W plasma power. The current efficiency of $N_2$ plasma is more efficient than that of $O_2$ plasma. At $1000 cd/m^2$, we obtained the maximum current efficiency of 6.45 cd/A using $N_2$ gas with 200 W plasma power.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.29-35
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• 2004

Hafnium-oxide gate dielectric films deposited by a metal organic chemical vapor deposition technique on a $N_2-plasma$ treated SiNx and a hydrogen-terminated Si substrate have been investigated. In the case of $HfO_2$ film deposited on a hydrogen-terminated Si substrate, suppressed crystallization with effective carbon impurity reduction was obtained at $450^{\circ}C$. X-ray photoelectron spectroscopy indicated that the interface layer was Hf-silicate rather than phase separated Hf-silicide and silicon oxide structure. Capacitance-voltage measurements show equivalent oxide thickness of about 2.6nm for a 5.0 nm $HfO_2/Si$ single layer capacitor and of about 2.7 nm for a 5.7 nm $HfO_2/SiNx/Si$ stack capacitor. TEM shows that the interface of the stack capacitor is stable up to $900^{\circ}C$ for 30 sec.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.295-298
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• 2003

The principal problems in development of dielectric paste materials for PDP(plasma display panel)are PbO free paste and low melting temperature. We prepared PbO free paste from glasses in the system BaO-ZnO-$B_2O_3-V_2O_5$. DTA, XRD and SEM were used to study and characterize BaO-ZnO-$B_2O_3-V_2O_5$ glasses. PbO free paste developed at this paper has thermal expansion of $74{\times}10^{-7}/^{\circ}C$, DTA transformation point of $460^{\circ}C$, and firing condition of $560^{\circ}C$, 10min.

• Carbon letters
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• v.5 no.3
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• pp.103-107
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• 2004

The atmospheric pressure plasma treatments ($Ar/O_2$ and $Ar/N_2$) of activated carbon fibers (ACFs) were carried out to introduce hydrophilic functional groups on carbon surfaces in order to enhance the hydrogen chloride gas (HCl) adsorption. Surface properties of the ACFs were determined by XPS and SEM. $N_2$/77 K adsorption isotherms were investigated by BET and D-R (Dubinin-Radushkevich) plot methods. The HCl removal efficiency was confirmed by HCl detecting tubes (range:1~40 or 40~1000 ppm). As experimental results, it was found that all plasma-treated ACFs showed the decrease in the pore volume, but the HCl removal efficiency showed higher level than that of the untreated ACFs. This result indicated that the plasma treatments led to the conformation of hydrophilic functional groups on the carbon surfaces, resulting in the increase of the interaction between the ACFs and HCl gas.

• Electrical & Electronic Materials
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• v.9 no.1
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• pp.9-17
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• 1996

Plasma enhanced chemical vapor deposition (PECVD) allows low temperature processing and so it is widely used, but it causes instability of devices due to serious amount of impurities within the film. In this paper, electrical and chemical characteristics of the PECVD oxynitride film formed by different N$_{2}$O to N$_{2}$O+NH$_{3}$ gas ratio is studied. It has been found that hydrogen concentration of PECVD oxynitride film was decreased from 4.25*10$^{22}$ [cm$^{-2}$ ] to 1.18*10$^{21}$ [cm$^{-2}$ ] according to the increase of N$_{2}$O gas. It was also found that PECVD oxynitride films have low trap density in the oxide and interface in comparison with PECVD nitroxide films, and has higher refractive index and capacitance than oxide films. In particular, oxynitride film formed in gas ratio of N$_{2}$O/(N$_{2}$O+NH$_{3}$)= 0.88 shows increased capacitance and decreased leakage current due to small portion of hydrogen in oxide and the accumulation of nitrogen about 4[atm.%] at the interface.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.201-201
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• 2000

AC-PDP(Plasma Display Panel)에 사용하는 MgO 보호막의 이차전자 방출계수(${\gamma}$)는 AC-PDP의 방전특성을 결정짓는 중요한 요소이다. MgO 보호막의 이차전자 방출계수는 AC-PDP에 주입하는 기체의 종류에 영향을 받는다. 현재 AC-PDP에는 방전특성의 향상과 VUV 발생을 위하여 He, Ne, Xe 등의 혼합기체가 사용되고 있으며, N 기체를 혼합하여 사용할 경우 더 좋은 발광효율을 얻을 수 있다는 보고가 있다. 이번 실험에서는 (100) 방향으로 배향된 MgO Bulk Crystal과 MgO 보호막의 이차전자방출계수를 ${\gamma}$-FIB 장치로 N2 기체혼합비율에 따라 측정하였다. 혼합기체는 Ne=N2 이원기체를 여러 가지 혼합 비율로 변화시켜가며 실험하였다. MgO 보호막은 실제 21inch 규격의 Panel을 사용하였다.