• 한국전기전자재료학회논문지
• /
• 제11권2호
• /
• pp.106-110
• /
• 1998

The $LiNbO_3$ thin films were prepared directly on Si(100) substrates by conventional RF magnetron spurttering system for nonvolatile memory applications. RTA(Rapid Thermal Annealing) treatment was performed for as-deposited films in an oxygen atmosphere at 600 $^{\circ}C$ for 60 s. The rapid thermal annealed films were changed to poly-crystalline ferroelectric nature from amorphous of as-deposition. The resistivity of the ferroelectric $LiNbO_3$ film was increased from a typical value of $1{\sim}2{\times}10^8{\Omega}{\cdot}cm$ before the annealing to about $1{\times}10^{13}{\Omega}{\cdot}cm$ at 500 kV/cm and reduced the interface state density of the $LiNbO_3/Si$ (100) interface to about $1{\times}10^{11}/cm^2{\cdot}eV$. Ferroelectric hysteresis measurements using a Sawyer-Tower circuit yielded remanent polarization ($P_r$) and coercive field ($E_c$) values of about 1.2 ${\mu}C/cm^2$ and 120 kV/cm, respectively.

• 한국전기전자재료학회논문지
• /
• 제17권12호
• /
• pp.1283-1288
• /
• 2004

Metal-ferroelectric-insulator-semiconductor(WFIS) capacitors using rapid thermal annealed LiNbO$_3$/AlN/Si(100) structure were fabricated and demonstrated nonvolatile memory operations. The capacitors on highly doped Si wafer showed hysteresis behavior like a butterfly shape due to the ferroelectric nature of the LiNbO$_3$ films. The typical dielectric constant value of LiNbO$_3$ film in the MFIS device was about 27, The gate leakage current density of the MFIS capacitor was 10$^{-9}$ A/cm$^2$ order at the electric field of 500 kV/cm. The typical measured remnant polarization(2P$_{r}$) and coercive filed(Ec) values were about 1.2 $\mu$C/cm$^2$ and 120 kV/cm, respectively The ferroelectric capacitors showed no polarization degradation up to 10$^{11}$ switching cycles when subjected to symmetric bipolar voltage pulses of 1 MHz. The switching charges degraded only by 10 % of their initial values after 4 days at room temperature.e.

• 대한전자공학회논문지SD
• /
• 제37권6호
• /
• pp.64-71
• /
• 2000

등간격, 동일 구조의 $Ti:LiNbO_3$ 세 도파로를 이용한 광스위치를 설계하고 제작하였다. 공도파로는 z-cut $LiNbO_3$ 기판상에 Ti를 내부 확산시켜 제작하였다. TM 모드 전파 손실을 줄이기 위하여 도파로 위에 $SiO_2$ 박막을 증착시킨 후, 광스위칭을 위하여 CPW(Coplanar Waveguide)구조 Al 전극을 형성시켰다. 가운데 도파로에 입사된 ${\lambda}=1.3{\mu}m$ 광에 대하여 세 도파로가 대칭적으로 detuning 되도록 전계 인가시 광 스위칭이 일어남을 확인하였다.

• 전자공학회논문지D
• /
• 제36D권3호
• /
• pp.85-91
• /
• 1999

재현성 있는 H:LiNbO\sub 3\ 광변조기의 제작을 위해 기존 광변조기에서 사용되는 Au/Cr/SiO\sub 2\ 전극구조 대신 상온에서 버퍼층 및 전극공정이 가능하고, 광대역 설계에도 유리하도록 새로운 Cu/parylene 전극구조를 사용한 광변조기의 설계 및 제작을 수행하였다. 이를 위해 유한요소법을 이용한 광변조기의 해석 및 설계, 소자제작을 위한 저손실 1550m H:LiNbO\sub 3\ 광도파로 공정, parylene 박막증착 및 CPW 전극형성 등의 단위 공정들을 확립하였다. 이러한 소자설계 기술 및 단위공정들의 결합을 통해 parylene 버퍼층구조 H:LiNbO\sub 3\ 광변조기 내부칩을 제작하였고, 저주파 구동특성 측정시스템을 통해 변조특성을 확인하였다. 특히 Cu/parylene 전극공정 전·후의 광도파로 특성이 일정하게 유지됨으로서 재현성 있는 소자제작이 가능함을 알 수 있었다.

• 대한전자공학회:학술대회논문집
• /
• 대한전자공학회 2000년도 추계종합학술대회 논문집(2)
• /
• pp.221-224
• /
• 2000

We have successfully demonstrated metal-ferroel-ectric-insulator-semiconductor (MFIS) devices using Al/LiNbO$_{3}$/SiN/Si structure. The SiN thin films were made into metal -insulator- semiconductor (MIS) devices by thermal evaporation of aluminum source in a dot away on the surface. The interface property of MFIS from 1MHz & quasistatic C-V is good and the memory window width is about 1.5V at 0.2V/s signal voltage sweep rate. The gate leakage current density of MFIS capacitors using a aluminum electrode showed the least value of 1x10$^{-8}$ A/$\textrm{cm}^2$ order at the electric field of 300㎸/cm. And the XRD patterns shows the probability of applications of LN for MFIS devices for FeRAMs on amorphous SiN buffer layer.

• 대한전자공학회논문지SD
• /
• 제38권11호
• /
• pp.765-770
• /
• 2001

고온 급속 열처리시킨 LiNbO₃/AIN/Si(100) 구조를 이용하여 MFIS 소자를 제작하고, 비휘발성 메모리 동작 가능성을 확인하였다. 고유전율 AIN 박막 위에 Pt 전극을 증착시켜 제작한 MIS 구조에서 측정한 1MHz C-V 특성곡선에서는 히스테리시스가 전혀 없고 양호한 계면특성을 보였으며, 축적 영역으로부터 산출한 비유전율 값은 약 8 이었다. Pt/LiNbO₃/AIN/Si(100) 구조에서 측정한 1MHz C-V 특성의 축적영역에서 산출한 LiNbO₃ 박막의 비유전율 값은 약 23 이었으며, ±5 V의 바이어스 범위 내에서의 메모리 윈도우는 약 1.2 V이었다. 이 MFIS 구조에서의 게이트 누설전류밀도는 ±500 kV/cm의 전계 범위 내에서 10/sup -9/ A/㎠ 범위를 유지하였다. 500 kHz의 바이폴러 펄스를 인가하면서 측정한 피로특성은 10/sup 11/ cycle 까지 초기값을 거의 유지하는 우수한 특성을 보였다.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1989년도 하계종합학술대회 논문집
• /
• pp.655-658
• /
• 1989

The characteristics of proton-diffused $LiNbO_3$ optical waveguides with self-aligned $SiO_2$-cladding are reported. When the proton diffusion occurs, the $SiO_2$-cladding limits the lateral diffusion of protons by out-diffusion of protons in unclad region. Proton indiffusion in depth direction is promoted by inhibition of out-diffusion in clad region. Consequently, the mode profile in depth direction can be nealy symmetric. The extent of the proton exchange was observed by measuring the infrared absorption peak at about $3500cm^{-1}$. It is confirmed that proton diffusion with $SiO_2$-cladding has structural excellency.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 1997년도 추계학술대회 논문집
• /
• pp.21-24
• /
• 1997

Ferroeletric LiNbO$_3$ thin films hale been prepared directly on Si(100) substrates by conventional RF magnetron spurttering system for nonvolatile memory applications. As-deposited films were performed RTA(Rapid Thermal Annealing) treatment in an oxygen atmosphere at 600 $^{\circ}C$ for 60 s. The rapid thermal annealed films were changed to poly-crystalline ferroelectric nature from amorphous of as-deposition. The resistivity of the ferroelectric LiNbO$_3$ film was increased from a typical vague of 1~2$\times$10$^{8}$ $\Omega$.cm before the annealing to about 1$\times$10$^{13}$ $\Omega$.cm at 500 kV/cm and reduce the interface state density of the LiNbO$_3$/Si(100) interface to about 1$\times$10$^{11}$ cm$^2$ . eV. Ferroelectric hysteresis measurements using a Sawyer-Tower circuit yielded remanent polarization (Pr) and coercive field (Ec) values of about 1.2 $\mu$C/cm$^2$ and 120 kV/cm, respectively.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2000년도 하계학술대회 논문집
• /
• pp.743-746
• /
• 2000

Metal-ferroelectric-insulator-semiconductor(MFIS) devices using Pt/$LiNbO_3$/Si structure were successfully fabricated. The dielectric constant of the AIN film calculated from the capacitance in the accumulation region in the capacitance-voltage(C-V) curve was about 8.2. The gate leakage current density of MIS devices using a aluminum electrode showed the least value of 1$\times$$1O^{-8}$A/$cm^2$ order at the electric field of 500kV/cm. The dielectric constant of $LiNbO_3$film on AIN/Si structure was about 23 derived from 1MHz capacitance-voltage (C-V) measurement and the resistivity of the film at the field of 500kV/cm was about 5.6$\times$ $1O^{13}$ $\Omega$.cm.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 1998년도 춘계학술대회 논문집
• /
• pp.235-238
• /
• 1998

Ferroelectric $LiNbO_3$ thin films were grown directly on Si(100) substrates by 13.55MHz RF magnetron sputtering system using a ceramic target ($Nb_2O_5/Li_2C0_3$ = 51.4/48.6). Because high temperature process have to avoided to prevent degradation of the interface (insulator/Si), $LiNbO_3$ thin films were deposited below $300^{\circ}C$. After as-deposited films were performed RTA treatments in an oxygen ambient at $600^{\circ}C$ for 60s, electrical measurements performed films before and after anneal treatment. In high field region, the leakage current density of the films after annealing was deceased about 4order and the resistivity of these was increased to about 5\times 10^{11} \Omega \cdot cm$ at 500kV/cm. In accumulation region of C-V curve, we calculated dielectric constant of thin film $LiNbO_3$ as 27.9 which is close to that of bulk value.